New Lattice CrossLink-NX FPGAs Bring Power and Performance Leadership to Embedded Vision and Edge AI Applications
11.12.2019 00:00:00 EET | Business Wire | Press release
Lattice Semiconductor Corporation (NASDAQ: LSCC), the low power programmable leader, today announced the first FPGA developed on its new Lattice Nexus™ FPGA platform, CrossLink-NX™. This new FPGA provides the low power, small form factor, reliability, and performance that developers need to create innovative embedded vision and AI solutions for communications, compute, industrial, automotive, and consumer systems.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20191210005349/en/
The new CrossLink-NX FPGA from Lattice Semiconductor (Graphic: Business Wire)
According to Patrick Moorhead, President and Founder of Moor Insights & Strategy, “Technology trends like 5G connectivity, cloud-based analytics, factory automation and the smart home are driving demand for embedded vision solutions that support machine learning. However, the data latency, cost and privacy issues associated with cloud-based ML analytics have sparked interest among developers in moving more data processing from the cloud to the Edge. But doing so requires OEMs have access to Edge AI/ML inferencing solutions that offer high performance data processing, low power operation, and a small form factor.”
FPGAs are a compelling hardware platform for embedded vision and AI applications, as they perform functions in parallel. This parallel architecture significantly accelerates certain processing workloads, including data inferencing.
“Embedded vision systems are growing in complexity; many systems today use multiple image sensors, displays and cameras. Implementing such systems at the Edge, where device size and power consumption are critical, adds even more design complexity,” said Bill Pu, Co-Founder and President, Leopard Imaging. “With their very low power consumption, small size, high-performance interfaces, and robust software and IP library, Lattice CrossLink-NX FPGAs let us quickly and easily develop different video signal bridging, aggregation and splitting applications for our industrial and automotive customers using just one device, saving us significant development time and resources.”
The CrossLink-NX family was designed using the new Lattice Nexus platform, which combines a 28 nm FD-SOI manufacturing process with a new, Lattice-designed, FPGA fabric architecture optimized for low power operation in a small form factor.
“Not only does CrossLink-NX lead in power consumption, form factor, reliability and performance in comparison to similar competing FPGAs, it is also supported by a robust library of design software, IP blocks and application reference designs,” said Gordon Hands, Director of Product Marketing, Lattice Semiconductor. “These make it quick and easy for developers to integrate CrossLink-NX FPGAs into new or existing Edge designs.”
Key features of the CrossLink-NX include:
- Low power – built on the Lattice Nexus FPGA platform, CrossLink-NX provides up to a 75 percent reduction in power consumption compared to competing FPGAs of a similar class.
- High reliability – CrossLink-NX has a Soft Error Rate (SER) up to 100 times lower than similar FPGAs in its class, making it a compelling solution for mission critical applications that must operate safely and reliably. The initial CrossLink-NX device is designed to support ruggedized environments found in outdoor, industrial, and automotive applications.
-
Performance – CrossLink-NX delivers enhanced performance enabled by three key elements:
- Fast I/O support – CrossLink-NX FPGAs are well-suited for embedded vision applications thanks to support for multiple fast I/Os, including MIPI, PCIe and DDR3 memory.
- Instant on performance – to better support applications where a long system boot time is unacceptable, such as industrial motor control, CrossLink-NX enables ultra-fast I/O configuration in 3 ms and total device configuration in less than 15 ms.
- High memory to logic ratio – to efficiently power AI inferencing in Edge devices, CrossLink-NX features 170 bits of memory for every logic cell, the highest memory to logic ratio in its class, providing 2x the performance compared to prior generations.
- Small form factor – to support customer system miniaturization, the first CrossLink-NX device is available in a 6 x 6 mm form factor which is up to ten times smaller than similar competing FPGAs in its class.
- Software tools and IP – in addition to its new Lattice Radiant 2.0 design software, Lattice offers a robust library of popular IP cores including interfaces like MIPI D-PHY, PCIe, SGMII and OpenLDI, and demos for common embedded vision applications such as 4:1 image sensor aggregation.
Originally scheduled for availability in 2020, Lattice is releasing CrossLink-NX ahead of schedule and is already sampling devices with select customers. For more information, please visit www.latticesemi.com/CrossLink-NX.
About Lattice Semiconductor
Lattice Semiconductor (NASDAQ: LSCC) is the low power programmable leader. We solve customer problems across the network, from the Edge to the Cloud, in the growing communications, computing, industrial, automotive and consumer markets. Our technology, long-standing relationships, and commitment to world-class support lets our customers quickly and easily unleash their innovation to create a smart, secure and connected world.
For more information about Lattice, please visit www.latticesemi.com. You can also follow us via LinkedIn, Twitter, Facebook, YouTube, WeChat, Weibo or Youku.
Lattice Semiconductor Corporation, Lattice Semiconductor (& design) and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries. The use of the word “partner” does not imply a legal partnership between Lattice and any other entity.
GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20191210005349/en/
Contact information
MEDIA CONTACTS:
Bob Nelson
Lattice Semiconductor
408-826-6339
Bob.Nelson@latticesemi.com
INVESTOR CONTACT:
Rick Muscha
Lattice Semiconductor
408-826-6000
Rick.Muscha@latticesemi.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Klarna Partners With EuroParcs to Offer Flexible Payments for Holiday Park Stays Across Europe27.3.2026 16:04:00 EET | Press release
Klarna, the global digital bank and flexible payments provider, today announces a new partnership with EuroParcs, one of Europe's fastest-growing holiday park operators. The collaboration gives holidaymakers in Germany, the Netherlands, Belgium, and Austria more flexibility in how they pay for their getaway. Guests booking through EuroParcs can now choose from a range of Klarna payment options tailored to their market: Germany & Austria: Pay in Full, Pay in 30 Days, Pay in 3, and Financing Netherlands: Pay in Full, Pay in 30 Days, and Pay in 3 Belgium: Pay in Full and Pay in 30 Days Nicole Defren, Head of Europe at Klarna, says: "Booking a holiday should feel exciting, not complicated – and that includes how you pay for it. With Klarna, EuroParcs guests can choose the payment option that suits them best, whether that's paying upfront, in a few weeks, or spreading the cost over time. From a cosy chalet on the Veluwe to a luxury villa in the Austrian Alps, we're making it easier for fami
Askey and Canoga Perkins Announce Strategic Collaboration at MWC Barcelona to Deliver Rapid-Deploy 5G Critical Communications Solutions27.3.2026 13:00:00 EET | Press release
Askeyand Canoga Perkinsannounced at Mobile World Congress Barcelona a Global Partnership to Deliver SyncMetra® Network Connectivity Solution, combining Canoga Perkins’ software-defined, IT-operated private 5G network transport along with Askey’s carrier-grade 5G radio access technology. At MWC Barcelona 2026, Askey Computer Corporation and Canoga Perkins announced a strategic partnership to deploy Canoga Perkins' SyncMetra® Platform across enterprise and service provider markets with Askey. This partnership pairs Askey’s carrier-grade radio access capabilities with Canoga Perkins’ industry-leading time-sensitive networking (TSN) and synchronization technology, enabling customers to simplify deployment of ultra-low-latency, highly reliable network services for 5G, edge compute, industrial automation, and mission-critical enterprise applications. The partnership enables joint go-to-market efforts, integrated product offerings, and expanded access to SyncMetra through Askey’s sales channe
SBC Medical Announces Fourth Quarter and Full Year 2025 Financial Results27.3.2026 12:40:00 EET | Press release
SBC Medical Group Holdings Incorporated (Nasdaq: SBC) (“SBC Medical” or the “Company”), a Management Services Organization operating a wide range of franchise businesses across diverse medical fields, today announced its financial results for the fourth quarter of fiscal year 2025 (three months ended December 31, 2025) and for the full fiscal year 2025 (twelve months ended December 31, 2025). Fourth Quarter 2025 Highlights Total revenues were $40 million, representing an 11% year-over-year decrease. Net Income attributable to SBC Medical Group was $14 million, representing a 117% year-over-year increase. Earnings per share, which is defined as net income attributable to the Company divided by the weighted average number of outstanding shares, was $0.14 for the three months ended December 31, 2025, representing 133% year-over-year increase. EBITDA1, which is calculated by adding depreciation and amortization expense and impairment loss on intangible assets to income from operations was
NIQ Redefines Packaging Intelligence with Monthly, Harmonized Global Performance Visibility27.3.2026 12:00:00 EET | Press release
NielsenIQ (NYSE: NIQ), a global leader in consumer intelligence, today announced the launch of its Packaging Strategic Planner Global (SPG) Solution, the first harmonized global platform to deliver monthly visibility into packaging performance across materials, formats, and pack configurations. As packaging innovation accelerates, many organizations continue to rely on fragmented or annual data to inform packaging decisions. The Packaging SPG Solution closes this gap by providing real-time data delivered monthly across regions, enabling brands and packaging partners to uncover trends, grow revenue, and strengthen relationships with CPG and retail partners. Key Highlights: New monthly global packaging tracking capability Coverage across 200+ categories Visibility into 30+ package types and 20 package materials 10+ markets at launch, expanding to 30 by the end of 2026 Introduction of NIQ’s exclusive EQ2 metric, multiplying units by number in pack to reflect true consumption “The pace of
European DataWarehouse Claims Its First “Fintech Provider of the Year” Award and a Sixth “Data Provider of the Year” Title at GlobalCapital’s 2026 European Securitisation Awards27.3.2026 09:47:00 EET | Press release
European DataWarehouse (EDW) is pleased to announce that it has been named both “Data Provider of the Year” and “Fintech Provider of the Year” at the 2026 GlobalCapital European Securitization Awards in London. The award ceremony recognises outstanding achievements in European structured finance, with winners selected by popular vote from across the industry. As defined by GlobalCapital, the programme celebrates “the very best in the market, as chosen by the market.” This latest recognition marks the sixth time that EDW has received the prestigious Data Provider of the Year award, having previously been honoured in 2019, 2022, 2023, 2024 and 2025, reaffirming its long-standing commitment to transparency, data quality and innovation in European securitisation. Prof. José Manuel González-Páramo, Chairman of EDW, later commented: “ Winning this award for the sixth time highlights the continued trust the European securitisation market places in EDW. Transparency, data quality and reliabili
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
