DNP Develops Interposer, a Primary Component in Next-Generation Semiconductor Packaging
Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) has developed an interposer, a high-performance intermediate device that electrically connects multiple chips and substrates. The interposer is expected to play a key role in next-generation semiconductor packaging.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20211207005066/en/
Layer Structure (Graphic: Business Wire)
DNP also has participated in Jisso Open Innovation of Tops 2 (JOINT2), targeting further functional developments for mass-production in 2024. JOINT2 is a consortium comprising 12 companies developing semiconductor packaging materials, substrates, and equipment. Showa Denko Materials Co., Ltd. is the managing company, and was selected for the Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems by the New Energy and Industrial Technology Development Organization (NEDO).
“Through cooperation with the other participating JOINT2 companies, DNP will accelerate the further functionality of the interposer as well as advance initiatives aimed at mass production in 2024. We will also promote the development of next-generation semiconductor packaging technology.” says Ryoichi Ohigashi of the Research and Business Development Center, DNP.
Background
The shift to higher functionality, greater speed and lower power consumption for semiconductor products requires miniaturization technology of semiconductor by using photo-lithography. It is said, however, that further miniaturization is rapidly approaching its limit, due to the complexity of the process and high costs. To overcome these challenges, the focus is on next-generation semiconductor packaging technology that improves processing speed by mounting multiple chips (e.g., CPUs, AI processors and memories) at high-densities, on the surface of an interposer.
Features
The interposer overcomes the issue of an increase in wiring resistance, and degradation of insulation resistance between the wirings, to achieve the high-performance necessary for leading edge semiconductor packaging.
DNP manufactures templates for nanoimprint lithography, a next-generation pattern transfer technology by employing microfabrication technology based on printing processes. We also broadly expand businesses through MEMS foundry services for sensors. In this latest development, we have applied glass and silicon substrate processing developed through the aforementioned businesses for advanced packaging technologies, along with handling technology and fine wiring formation technology.
About DNP
Since 1876, DNP is a global leader in the provision of printing solutions that connect people and society, providing new value. We exploit our proprietary strengths in printing and information to propose solutions that support the development of a people-friendly information society, including electronic components targeting next-generation communications, and platforms that boost IoT information security.
https://www.dnp.co.jp/eng/news/detail/10161795_2453.html
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20211207005066/en/
Contact information
DNP: Yusuke Kitagawa, 81-3-6735-0101
kitagawa-y3@mail.dnp.co.jp
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Textron Aviation Broadens Aftermarket Connectivity Solutions for Cessna Citation Latitude by Offering Starlink High-Speed Internet18.9.2025 16:30:00 EEST | Press release
Textron Aviation Inc., a Textron Inc. (NYSE: TXT) company, today announced an additional high-speed internet connectivity solution for the Cessna Citation Latitude following the Federal Aviation Administration’s (FAA) issuance of AeroMech’s Supplemental Type Certificate (STC) for Starlink high-speed internet connectivity. AeroMech’s STC utilizes Starlink’s constellation of Low Earth Orbit (LEO) satellites to provide more reliable connectivity over land, water and remote areas, where traditional in-flight Wi-Fi may not have service. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20250918380069/en/ Textron Aviation broadens aftermarket connectivity solutions for Cessna Citation Latitude by offering Starlink high-speed internet (Photo Credit: Textron Aviation) “With Starlink connectivity now available as an upgrade, Citation Latitude customers can enjoy a seamless, high-speed in-flight experience that keeps them connected in more
Decode the Future of AI and Customer Experience at Elevate'25 Digital Innovation Summit18.9.2025 16:00:00 EEST | Press release
As unprecedented advancements in AI reshape consumer behavior, digital innovation summit Elevate'25 opened for general registration today. Sponsored by Airship, the exclusive, one-day event is designed to equip business leaders with proven strategies to harness artificial intelligence and mobile-first technology for a decisive competitive advantage. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20250918928987/en/ Gain insight and advice from firms at the frontier of AI-powered, mobile-first customer experiences. Taking place on October 15, 2025, at the iconic Shangri-La at The Shard in London, Elevate'25 moves beyond the headlines to provide a practical roadmap for success, featuring insights from brand executives and industry-defining keynotes. "Unprecedented advancements in AI and mobile-first consumer behaviors are driving a seismic shift that is reshaping how brands interact with customers now and far into the future,” sa
Lenovo Finds 65% of IT Leaders Admit Their Defenses Can’t Withstand AI Cybercrime18.9.2025 16:00:00 EEST | Press release
Lenovo research reveals a widening security gap as AI-driven cybercrime surges: 65% of IT leaders surveyed admit their defenses are outdated and unable to withstand AI-enabled attacks, and just 31% feel confident defending against them. The new insights are drawn from Lenovo’s third Work Reborn report, Reinforcing the Modern Workplace. While AI is driving business improvements and efficiency gains, it is also fueling a new wave of cybercrime that most businesses are ill-equipped to defend against. This underscores the critical need for enterprises to adopt AI-driven strategies that can counter threats that learn, adapt, and evolve in real time. Lenovo is positioned to deliver this shift with end-to-end solutions that embed AI security into the digital workplace. With operations in 180 markets and a leader in enterprise technology, Lenovo brings unmatched scale to solving AI workplace challenges, from protecting sensitive data to countering evolving cyber threats. “AI has changed the ba
Armis Receives Morgan Stanley 2025 Innovation Award18.9.2025 16:00:00 EEST | Press release
Armis, the cyber exposure management & security company, today announced that it has received the prestigious Innovation Award from Morgan Stanley at the Firm’s 23rd Tech Week event in Silicon Valley. For over 20 years, Morgan Stanley has celebrated companies with innovative capabilities that have materially impacted its business. Armis is being recognized for its partnership with Morgan Stanley, which chose Armis to help protect and secure its critical internet-of-things (IoT) assets across its organization. “Continuous and cutting-edge innovation that enables global cybersecurity teams to combat malicious actors is essential in today’s environment. The attack surface is growing exponentially, and Armis’ mission is to protect organizations’ entire attack surface by managing cyber risk exposure in real time,” said Yevgeny Dibrov, Armis Co-founder and CEO. “We are honored by our partnership with Morgan Stanley and look forward to supporting their continued efforts to actively manage and
Scoring Big With Fans: Balchem Spotlights the Power of Vitamin K2 at FC Bayern Women’s Season Opener18.9.2025 15:33:00 EEST | Press release
Balchem, a leading global manufacturer of specialty ingredients for human nutrition and health – and official partner of FC Bayern (FCB) Women’s football team - has launched its first ever direct-to-consumer initiative, showcasing the power of vitamin K2 to FCB fans. The company promoted its K2VITAL™ brand with an exhibition stand at the Allianz Arena in Munich, during the opening game of the Bundesliga (German football league) on 6 September. This initiative is part of Balchem’s latest marketing strategy, which aims to raise consumer awareness of the health benefits vitamin K2 has to offer, bridging the gap between B2B and B2C markets. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20250918950889/en/ Balchem Spotlights The Power of Vitamin K2 at FC Bayern Women’s Season Opener Co-Branded K2 Health Vitamins Hit the Pitch The opening event of the season provided a unique platform for Balchem to promote K2VITAL™, a patented, typ
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom