Solidigm Introduces the World’s Highest Capacity PCIe SSD for Massive Data Storage From Core to Edge
20.7.2023 18:00:00 EEST | Business Wire | Press release
Solidigm, a leading global provider of innovative NAND flash memory solutions, is proud to announce another industry-first quad-level cell (QLC) solid-state storage drive (SSD) for the data center — the Solidigm ™ D5-P5336. Offered in capacities from 7.68TB to 61.44TB, the Solidigm D5-P5336 makes it possible to store up to 6X more data in the same space compared to an all hard disk drive (HDD) array.1
"Modern workloads like AI and capabilities like 5G are rapidly reshaping the storage landscape,” said Greg Matson, VP of Strategic Planning and Marketing at Solidigm. “Businesses need storage in more places that is inexpensive, able to store massive data sets efficiently and access the data at speed. The D5-P5336 delivers on all three -- value, density and performance. With QLC, the economics are compelling -- imagine storing 6X more data than HDDs and 2X more data than TLC SSDs, all in the same space at TLC speed."
Built to handle massive amounts of data from the core to the edge, the read performance of the Solidigm D5-P5336 exceeds some of the latest cost-optimized triple-level cell (TLC) SSDs on the market today.2 Artificial intelligence (AI), machine learning (ML), content delivery networks, scale-out network attached storage (NAS), and object storage are all read-intensive workloads that continue to drive enormous volumes of data, regardless of where they reside.
Massive scalability and improved TCO across a range of configurations
With its high capacity enabling smaller storage footprints, Solidigm’s D5-P5336 enables a lower total cost of ownership and more sustainable infrastructure than all-TLC arrays, SAS HDD arrays, or hybrid arrays. Consider the following, based on a 100PB object storage solution deployment:
|
Solidigm D5-P5336 |
Compare with: |
All-TLC arrays |
All-SAS HDD arrays |
Hybrid arrays |
|
TCO reduced by: |
17% |
47% |
61% |
|
|
Power and cooling reduced by: |
Up to 1.25x |
Up to 4.9x |
Up to 6x |
|
|
physical rack footprint reduced by: |
1.9x |
11.8x |
14x |
“For years there has been debate about endurance and reliability of SSDs, QLC in particular, but Solidigm might have ended that debate with the D5-P5336,” noted Avery Pham, VP Operations, VAST Data. “Any number of applications will see notable benefits from these drives from AI and machine learning to object storage.”
"Today, it is clear that the primary constraint for edge workloads is the limitation of bandwidth rather than latency,” said Doug Emby, VP of Sales and Business Development at Cheetah RAID Storage. “Solidigm’s D5-P5336 QLC SSDs offer an impressive combination of capacity, performance, and reliability as a solution to overcome this challenge. The seamless integration of these Solidigm QLC SSDs with Cheetah's high-performance servers makes them highly suitable for the efficient deployment of edge solutions."
The D5-P5336 is shipping now in E1.L form factor with up to 30.72TB, with subsequent availability extending to 61.44TB in both U.2 and E1.L later this year. In the first half of 2024, Solidigm will be shipping E3.S form factor with up to 30.72TB.
To learn more about the benefits of QLC, visit solidigm.com/qlc. Additionally, the D5-P5336 will be on display at the Solidigm booth (#107) at Flash Memory Summit in Santa Clara, Calif. August 8-10.
1 All-HDD capacity based on 12x 3.5” front load bays x 20TB = 240TB. HDD capacity does not factor in any over-provisioning required to meet storage performance needs. All-QLC capacity based on 24x U.2 front load bays x 61.44TB D5-P5336 = 1474TB. Max 2U U.2 based on HPE Proliant DL385 Gen 11 configuration. Max 2U 3.5” HDD bays based on Supermicro 2U SuperServer design.
2 Up to 34% higher throughput than entry TLC SSDs and 20% higher than mainstream TLC SSDs for CDN workload. Comparing 15.36TB Solidigm™ D5-P5336 with read BW of 7.5GB/sec to15.36TB Kioxia CD8-R with 5.6 GB/sec as entry TLC SSD and to 15.36TB Micron 7450 with 6.2GB/sec as mainstream TLC SSD. Workload based on representative customer profile. Test Configuration: Supermicro SYS-120U-TNR, Intel(R) Xeon(R) Gold 6354. Number of CPUs: 2, Cores per CPU: 18 (total 36), DRAM: DDR4 – 64GB, OS: Ubuntu 20.04.5 LTS Linux 5.15.0-67-generic. FIO 3.16.
ABOUT SOLIDIGM
Solidigm is a leading global provider of innovative NAND flash memory solutions. Solidigm technology unlocks data’s unlimited potential for customers, enabling them to fuel human advancement. Originating from the sale of Intel’s NAND and SSD business, Solidigm became a standalone U.S. subsidiary of semiconductor leader SK hynix in December 2021. Headquartered in Rancho Cordova, California, Solidigm is powered by the inventiveness of more than 2,000 employees in 13 locations worldwide. For more information, please visit solidigm.com and follow us on Twitter and LinkedIn. “Solidigm” is a trademark of SK hynix NAND Product Solutions Corp. (d/b/a Solidigm).
- All products, computer systems, dates, and figures specified are preliminary based on current expectations and are subject to change without notice.
- Differences in hardware, software, or configuration will affect actual performance.
- Solidigm optimizations, for Solidigm compilers or other products may not optimize to the same degree for non-Solidigm products.
- Solidigm technologies may require enabled hardware, software, or service activation.
- Nothing herein is intended to create any express or implied warranty.
- The products described in this document may contain design defects or errors known as “errata,” which may cause the product to deviate from published specifications. Currently characterized errata are available on request.
- Your costs and results may vary.
- © Solidigm. “Solidigm” is a trademark of SK hynix NAND Product Solutions Corp. (d/b/a Solidigm). Other names and brands may be claimed as the property of others.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230720735706/en/
Contact information
Catherine Roberts
press@solidigm.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Biocytogen Announces Clinical Milestone with First Patient Dosed in Phase 1 Trial of IDEAYA’s First-in-Class B7H3/PTK7 Bispecific TOP1 ADC IDE03428.2.2026 02:00:00 EET | Press release
Biocytogen Pharmaceuticals (Beijing) Co., Ltd. (Biocytogen, SSE: 688796; HKEX: 02315), a global biotechnology company that drives the research and development of novel antibody-based drugs with innovative technologies, today announced that its partner IDEAYA Biosciences, Inc. (“IDEAYA”; Nasdaq: IDYA) has dosed the first patient in IDEAYA’s Phase 1 dose-escalation/expansion clinical trial of IDE034, an investigational B7H3/PTK7 bispecific TOP1 ADC. Pursuant to the companies’ option and license agreement, first patient dosing triggers a $5 million milestone payment to Biocytogen. According to IDEAYA, the Phase 1 study is designed to characterize IDE034’s safety profile, tolerability, and PK as a monotherapy, and IDEAYA also intends to evaluate combination regimens with DNA damage response (DDR) -targeting agents such as its oral PARG inhibitor IDE161 as the program advances. IDE034 is a potential first-in-class bispecific B7H3/PTK7 TOP1 ADC, independently developed by Biocytogen and lice
IQM and Real Asset Acquisition Corp. to Host Conference Call/Webcast to Discuss Proposed Transaction27.2.2026 14:00:00 EET | Press release
IQM Finland Oy, a global leader in full-stack superconducting quantum computers (“IQM”, “IQM Quantum Computers” or the “Company”), and Real Asset Acquisition Corp. (Nasdaq: RAAQ), a special purpose acquisition company (“RAAQ”), announced that they will host a conference call to discuss their recently announced business combination, including certain transaction highlights. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260227472716/en/ IQM Radiance quantum computer As previously disclosed, on February 23, 2026, IQM and RAAQ announced they have entered into a definitive business combination agreement, which will result in IQM becoming a public company and listing American Depositary Shares on one of the two leading U.S. stock exchanges. The transaction provides funding with the aim to accelerate IQM’s technology and commercial development towards fault-tolerance quantum computing, further advancing its position as a leading p
HighRadius Launches $0 Implementation Fee, $0 Subscription Fee via Outcome Based Pricing for oCFO Software27.2.2026 13:00:00 EET | Press release
HighRadius launches Office of the CFO first Outcome Based Pricing with $0 Implementation fee and $0 Subscription until Go-Live. Customers only pay a fraction of realized gains based on P&L impact. Chapter 1: Outcome Based Pricing (OBP) Introduction of OBP: HighRadius, a provider of 190+ AI agents for Order-to-Cash, Accounts Payable, Record-to-Report, and Treasury introduces Outcome Based Pricing (OBP). Three Components of OBP: Customers pay a) $0 in Implementation fees, b) $0 in Subscription fees until Go Live, c) HighRadius earns a fraction of the actual savings realized by the client. Chapter 2: US GAAP & ASC 606 Constraints Not Designed for Innovation: The traditional ASC 606 model requires companies to standardize and recognize revenue based on contractual obligations. For a traditional SaaS subscription, the obligation is access to software over time. AI agents are designed to deliver quantifiable, real-time Business Outcomes that do not fit the traditional accounting framework. C
Kioxia Appoints Yoshihiko Kawamura as Chief Financial Officer27.2.2026 10:15:00 EET | Press release
Kioxia Holdings Corporation (TOKYO:285A), a world leader in memory solutions, today announced the appointment of Yoshihiko Kawamura as Chief Financial Officer (CFO), effective April 1, 2026. Mr. Kawamura brings extensive international experience to Kioxia, having held assignments at Mitsubishi Corporation’s U.S. headquarters, served as General Manager of its Chicago office, and completed a tenure at the World Bank. At Hitachi, Ltd., he held senior leadership positions, including Chief Strategy Officer (CSO), Chief Financial Officer (CFO), and Chief Risk Management Officer (CRMO), where he was instrumental in leading the company’s management reforms. Since joining Kioxia as Executive Vice President in June 2025, Mr. Kawamura has worked closely with the executive team to advance the business through strategic capital and financial planning. Following its initial public offering on the Prime Market of the Tokyo Stock Exchange in December 2024, Kioxia is entering a new phase of growth char
DNP Invests in Rapidus to Support the Establishment of Mass Production for Next-Generation Semiconductors27.2.2026 09:18:00 EET | Press release
Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) today announced that it has participated in Rapidus Corporation’s funding round as one of the round investors. This strategic funding initiative supports Rapidus’ plan to steadily progress from its current R&D phase to mass production of 2nm (10⁻⁹ meters) logic semiconductors by 2027. Through this initiative, DNP will advance the development and mass production of EUV lithography photomasks and support Rapidus as it establishes a mass production system for 2nm & next-generation semiconductors. Background In recent years, the rise in energy consumption, in line with increased data generation, has become a challenge, driving demand for next-generation semiconductors capable of improving device performance and reducing power consumption. Next-generation semiconductors manufactured using EUV lithography enable the formation of finer patterns on silicon wafers compared to currently available technologies. This in turn is boosting expectations
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom