Solidigm Introduces the World’s Highest Capacity PCIe SSD for Massive Data Storage From Core to Edge
20.7.2023 18:00:00 EEST | Business Wire | Press release
Solidigm, a leading global provider of innovative NAND flash memory solutions, is proud to announce another industry-first quad-level cell (QLC) solid-state storage drive (SSD) for the data center — the Solidigm ™ D5-P5336. Offered in capacities from 7.68TB to 61.44TB, the Solidigm D5-P5336 makes it possible to store up to 6X more data in the same space compared to an all hard disk drive (HDD) array.1
"Modern workloads like AI and capabilities like 5G are rapidly reshaping the storage landscape,” said Greg Matson, VP of Strategic Planning and Marketing at Solidigm. “Businesses need storage in more places that is inexpensive, able to store massive data sets efficiently and access the data at speed. The D5-P5336 delivers on all three -- value, density and performance. With QLC, the economics are compelling -- imagine storing 6X more data than HDDs and 2X more data than TLC SSDs, all in the same space at TLC speed."
Built to handle massive amounts of data from the core to the edge, the read performance of the Solidigm D5-P5336 exceeds some of the latest cost-optimized triple-level cell (TLC) SSDs on the market today.2 Artificial intelligence (AI), machine learning (ML), content delivery networks, scale-out network attached storage (NAS), and object storage are all read-intensive workloads that continue to drive enormous volumes of data, regardless of where they reside.
Massive scalability and improved TCO across a range of configurations
With its high capacity enabling smaller storage footprints, Solidigm’s D5-P5336 enables a lower total cost of ownership and more sustainable infrastructure than all-TLC arrays, SAS HDD arrays, or hybrid arrays. Consider the following, based on a 100PB object storage solution deployment:
|
Solidigm D5-P5336 |
Compare with: |
All-TLC arrays |
All-SAS HDD arrays |
Hybrid arrays |
|
TCO reduced by: |
17% |
47% |
61% |
|
|
Power and cooling reduced by: |
Up to 1.25x |
Up to 4.9x |
Up to 6x |
|
|
physical rack footprint reduced by: |
1.9x |
11.8x |
14x |
“For years there has been debate about endurance and reliability of SSDs, QLC in particular, but Solidigm might have ended that debate with the D5-P5336,” noted Avery Pham, VP Operations, VAST Data. “Any number of applications will see notable benefits from these drives from AI and machine learning to object storage.”
"Today, it is clear that the primary constraint for edge workloads is the limitation of bandwidth rather than latency,” said Doug Emby, VP of Sales and Business Development at Cheetah RAID Storage. “Solidigm’s D5-P5336 QLC SSDs offer an impressive combination of capacity, performance, and reliability as a solution to overcome this challenge. The seamless integration of these Solidigm QLC SSDs with Cheetah's high-performance servers makes them highly suitable for the efficient deployment of edge solutions."
The D5-P5336 is shipping now in E1.L form factor with up to 30.72TB, with subsequent availability extending to 61.44TB in both U.2 and E1.L later this year. In the first half of 2024, Solidigm will be shipping E3.S form factor with up to 30.72TB.
To learn more about the benefits of QLC, visit solidigm.com/qlc. Additionally, the D5-P5336 will be on display at the Solidigm booth (#107) at Flash Memory Summit in Santa Clara, Calif. August 8-10.
1 All-HDD capacity based on 12x 3.5” front load bays x 20TB = 240TB. HDD capacity does not factor in any over-provisioning required to meet storage performance needs. All-QLC capacity based on 24x U.2 front load bays x 61.44TB D5-P5336 = 1474TB. Max 2U U.2 based on HPE Proliant DL385 Gen 11 configuration. Max 2U 3.5” HDD bays based on Supermicro 2U SuperServer design.
2 Up to 34% higher throughput than entry TLC SSDs and 20% higher than mainstream TLC SSDs for CDN workload. Comparing 15.36TB Solidigm™ D5-P5336 with read BW of 7.5GB/sec to15.36TB Kioxia CD8-R with 5.6 GB/sec as entry TLC SSD and to 15.36TB Micron 7450 with 6.2GB/sec as mainstream TLC SSD. Workload based on representative customer profile. Test Configuration: Supermicro SYS-120U-TNR, Intel(R) Xeon(R) Gold 6354. Number of CPUs: 2, Cores per CPU: 18 (total 36), DRAM: DDR4 – 64GB, OS: Ubuntu 20.04.5 LTS Linux 5.15.0-67-generic. FIO 3.16.
ABOUT SOLIDIGM
Solidigm is a leading global provider of innovative NAND flash memory solutions. Solidigm technology unlocks data’s unlimited potential for customers, enabling them to fuel human advancement. Originating from the sale of Intel’s NAND and SSD business, Solidigm became a standalone U.S. subsidiary of semiconductor leader SK hynix in December 2021. Headquartered in Rancho Cordova, California, Solidigm is powered by the inventiveness of more than 2,000 employees in 13 locations worldwide. For more information, please visit solidigm.com and follow us on Twitter and LinkedIn. “Solidigm” is a trademark of SK hynix NAND Product Solutions Corp. (d/b/a Solidigm).
- All products, computer systems, dates, and figures specified are preliminary based on current expectations and are subject to change without notice.
- Differences in hardware, software, or configuration will affect actual performance.
- Solidigm optimizations, for Solidigm compilers or other products may not optimize to the same degree for non-Solidigm products.
- Solidigm technologies may require enabled hardware, software, or service activation.
- Nothing herein is intended to create any express or implied warranty.
- The products described in this document may contain design defects or errors known as “errata,” which may cause the product to deviate from published specifications. Currently characterized errata are available on request.
- Your costs and results may vary.
- © Solidigm. “Solidigm” is a trademark of SK hynix NAND Product Solutions Corp. (d/b/a Solidigm). Other names and brands may be claimed as the property of others.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230720735706/en/
Contact information
Catherine Roberts
press@solidigm.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
TTNE Announces the World Sauna Award “SAUNA37 2026”10.3.2026 05:00:00 EET | Press release
TTNE Inc. today announced “SAUNA37 2026”, the world sauna award recognizing 37 sauna destinations worldwide This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260308149186/en/ SAUNA37 Through this initiative, we aim to contribute to the global growth of sauna culture and create a future where people around the world can lead happier and healthier lives through saunas. TTNE was founded by Totonoe Oyakata (Dai Matsuo) and Sauna Master (Daisuke Akiyama), who have personally experienced some of the world's finest saunas. Their desire to establish a similar deep-rooted sauna culture in Japan led to the creation of TTNE. As people once again have the opportunity to explore sauna experiences around the world, SAUNA37 aims to introduce the diverse and unique sauna facilities and cultures across the globe. Through this initiative, we seek to further evolve Japan’s sauna culture while also sharing it with the world. TTNE remains committed
Hexagon Semi’s HX77 AR Display Processor Achieves Ultra-Low Power Consumption with VeriSilicon’s Nano IP Portfolio10.3.2026 02:00:00 EET | Press release
VeriSilicon (688521.SH) today announced that Hefei Hexagon Semiconductor (Hexagon Semi), an image processing SoC provider, has adopted VeriSilicon’s proven IP portfolio in its high-performance HX77 series image processing SoC. The adopted IPs include the GCNanoUltraV 2.5D Graphics Processing Unit (GPU) IP, DW100 DeWarp Processing IP, and DC9200Nano Display Processing IP. The SoC has successfully taped out, achieving a first-pass silicon success. The HX77 series is a highly integrated, low-power image processing SoC based on RISC-V architecture, integrating comprehensive video input/output interfaces, image processing, and system control capabilities. By leveraging an innovative heterogeneous computing architecture and sophisticated power management technology, HX77 has successfully achieved a technological breakthrough that enables 2K@60fps output with mere milliwatt-level power consumption. HX77 has also realized the 3DoF hover feature on end devices through spatial computing. In addi
Operio Group Named Distributor for Schaefer Technologies in the United Kingdom and European Union9.3.2026 23:00:00 EET | Press release
Operio Group has signed a distribution agreement with Schaefer Technologies, a manufacturer of semi-automatic encapsulation equipment. Operio Group, a holding company building a global group of brands serving the solid dose manufacturing industry, will be the official distributor of Schaefer Technologies’ products in the United Kingdom and the European Union. Schaefer Technologies develops semi-automatic capsule filling systems, including equipment that produces banded capsules for liquid and pellet formulations used by nutraceutical and pharmaceutical manufacturers. Leadership from both companies worked together to establish the agreement, including Kevin Schaefer, CEO of Schaefer Technologies Inc., and Alastair Sanderson, Chief Business Development Officer at Operio Group. “Schaefer Technologies is looking forward to our new relationship with Operio Group,” said Schaefer. “Their understanding of the pharmaceutical equipment market makes them a strong partner as we combine our experti
Kinaxis Goes All-In on Innovation at Upcoming Kinexions in Las Vegas9.3.2026 20:00:00 EET | Press release
Registration is officially open for Kinexions North America, the premier global supply chain orchestration conference hosted by Kinaxis® Inc. (TSX: KXS). Taking place June 1–3 in Las Vegas, Nevada, the event brings together supply chain leaders, innovators and practitioners from around the world to explore how organizations can leverage AI-driven strategies and technologies to connect data, people and decisions. After a year defined by market volatility, geopolitical risk and disruption, this year’s conference will focus on how intelligent supply chain orchestration enables organizations to move beyond reactive planning to building true enterprise adaptability. The program promises to be the most immersive and future-forward Kinexions yet, with renowned author, entrepreneur and innovation expert, Peter Hinssen confirmed as a featured keynote address. “Kinexions has always been the place where the best in supply chain come together to calibrate and share ideas, rethink what’s possible a
Radial Selects Riskified to Power Payment Fraud and Refund/Return Protection for Merchant Client Portfolio9.3.2026 16:00:00 EET | Press release
Riskified (NYSE: RSKD), a leader in ecommerce fraud and risk intelligence, today announced a strategic partnership with Radial, a leading 3PL set to become Paxon later this year. Radial will integrate with Riskified’s AI-powered platform to help its merchants approve more legitimate orders and reduce losses from payment fraud, including many merchants that use Shopify as their ecommerce platform. Radial supports many of the world’s most recognized retail brands with a global ecommerce fulfillment network of more than 20 centers across North America, helping merchants deliver orders quickly and cost effectively. By bringing Riskified’s AI-powered fraud decisioning into its commerce ecosystem, Radial gives merchants the surgical ability to calibrate the checkout experience according to risk—without slowing fulfillment. This also supports brands seeking to expand into new markets. Riskified empowers Radial's customers with accurate, real-time fraud decisions at checkout, approving or decl
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom