Quectel Unveils Next Generation SG885G-WF Android Smart Module Ideal for High-Performance Industrial and Consumer IoT Applications
24.7.2023 12:00:00 EEST | Business Wire | Press release
Quectel Wireless Solutions, a global IoT solutions provider, today launches its new generation flagship Android smart module, the SG885G-WF. With high performance and rich media functions, the smart module is ideal for industrial and consumer applications that require high processing power and multimedia functions.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230724716405/en/
Quectel unveils next generation SG885G-WF Android smart module ideal for high-performance industrial and consumer IoT applications. (Photo: Business Wire)
The module is powered by the Qualcomm® QCS8550 System-on-Chip (SoC) for IoT from Qualcomm Technologies, Inc., delivering an impressive combination of flexibility and performance. It supports Wi-Fi 7, Bluetooth 5.3, and incorporates 2x2 Wi-Fi MIMO technology, providing users with enhanced connectivity options.
“Qualcomm Technologies is proud to collaborate with Quectel on their SG885G-WF to bring high performance connectivity solutions to consumers,” stated Dev Singh, Vice President, Business Development, Qualcomm Technologies, Inc. “Utilizing Quectel’s extensive infrastructure of cellular modules, the SG855G-WF exemplifies the necessary capabilities needed to adapt to tomorrow’s technology in IoT and beyond.”
With computing power of up to 48 TOPS, the module offers robust video capabilities, including video encoding at 4K at 120 fps or 8K at 30 fps, as well as video decoding at 4K at 240 fps or 8K at 60 fps. This ensures smooth and high-quality video processing for various applications.
Measuring 49.0mm x 51.0mm x 4.25mm, the SG885G-WF is suitable for global deployments and offers 12 GB LPDDR5X plus 256GB UFS memory. In addition, the module offers a rich set of interfaces that include LCM, camera, I2S, PCIe, UART, USB, I2C and SPI. These, in addition to adoption of the Android operating system, extend the module’s applicability to wide range of IoT and M2M applications including videoconferencing systems, live streaming devices, gaming, computing, robots, drones, AR/VR, intelligent retail and safety.
Quectel provides a range of high-performance antennas that greatly enhance wireless connectivity, aiming to assist customers in streamlining their design processes. By combining Quectel's antennas with the SG885G-WF Android Smart module, IoT developers can effectively reduce both time-to-market and costs associated with their IoT devices.
Moreover, the module offers the advantage of seamless integration with Quectel's range of cellular modules, enhancing connectivity, flexibility, and integration possibilities even further.
“We’re proud to launch our new flagship Android smart module with the new generation Quectel SG885G-WF,” said Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “The powerful Qualcomm chipset along with support for Wi-Fi 7, Bluetooth 5.3 and 2x2 MIMO technology provides customers with a powerful module that offers connectivity choice and a wide variety of interfaces. As IoT matures, the ability to enable applications that need high processing power for AI and multimedia functions has become essential and the SG885G-WF has been designed to meet these needs.”
The Quectel SG885G-WF also offers three high-current flash LED drivers which support both flash and torch modes in addition to charging management capability which supports battery voltage detection, fuel gauge and battery temperature detection. Audio interfaces include SWR, digital microphone, MI2S and HIFI I2S.
About Quectel
Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global IoT solutions provider backed by outstanding support and services. Our growing global team of 5,900 professionals sets the pace for innovation in cellular, GNSS, Wi-Fi and Bluetooth modules, antennas, services and IoT connectivity.
With regional offices and support across the globe, our international leadership is devoted to advancing IoT and helping build a smarter world.
For more information: www.quectel.com, LinkedIn, Facebook, and Twitter.
Qualcomm is a trademark or registered trademark of Qualcomm Incorporated.
Qualcomm branded products are products of Qualcomm Technologies, Inc. and/or its subsidiaries. Qualcomm patented technologies are licensed by Qualcomm Incorporated.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230724716405/en/
Contact information
Media: media@quectel.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Kioxia and Sandisk Begin Production of 10th-Generation 3D Flash Memory Products at Kitakami Plant Fab23.7.2026 13:19:00 EEST | Press release
Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today announced the start of production for their 10th-generation 3D Flash memory technology at Fab2 (K2) at the Kitakami Plant in Iwate Prefecture in Japan. The milestone comes as the companies continue to drive meaningful, multi-year bit growth to address the strong demand for their innovative flash memory technology. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702296115/en/ Unveiling ceremony for the K2 facility In conjunction with the start of production, the companies held an unveiling ceremony for the K2 facility. Opening in September 2025, the facility has produced the companies’ 8th-generation 3D flash memory products and will begin to scale production with the introduction of their 10th-generation products. Both generations of 3D flash memory adopt innovative CBA (CMOS directly Bonded to Array)
VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications3.7.2026 13:02:00 EEST | Press release
VeriSilicon (688521.SH) today announced its high-performance CPP2000 Camera Post-Processing (CPP) IP, expanding the company’s Image Signal Processing (ISP) solutions with advanced post-processing capabilities. By improving image quality and visual perception in mobile imaging scenarios, CPP2000 enables more reliable vision performance in robotics, drones, and other mobile vision applications. CPP2000 integrates multiple image processing technologies and can further optimize YUV images output from image signal processors. The IP supports image and video processing at up to 8K resolution and offers multiple hardware configuration options to meet diverse requirements in Power, Performance, Area (PPA), and latency across different applications. CPP2000 leverages the combined operation of multiple image processing technologies, including motion-compensated temporal filtering, advanced spatial noise reduction, chroma adjustment and dynamic contrast improvement, and edge enhancement. Together
Messer Acquires Singapore-Based Industrial Gas Platform; Japan Corporate Advisory Institute Advises Sellers3.7.2026 12:11:00 EEST | Press release
Messer, the world’s largest privately held specialist for industrial, medical, electronic and specialty gases, has acquired WKS Group, a Singapore-based industrial gas platform with operations across Singapore and southern Malaysia. Transaction terms were not disclosed. Messer reported consolidated sales of approximately EUR 4.5 billion for its 2025 financial year. Founded in Singapore in 1977, WKS Group comprises six companies and employs approximately 195 people across Singapore and southern Malaysia. The acquisition expands Messer’s operating footprint in Southeast Asia and strengthens its access to key industrial clusters across the region. “We are pleased to have completed this transaction with Messer, whose strategic vision makes them an excellent partner for WKS Group,” said Mr. Wong Koh Hoi, shareholder of WKS Group. “We appreciate JCAI’s professionalism and dedication throughout the process, and their expertise was instrumental in achieving a successful outcome.” Japan Corpora
Access Advance Welcomes Meta Platforms, Inc. and Alibaba Group to the Video Distribution Patent Pool3.7.2026 02:00:00 EEST | Press release
Access Advance LLC today announced that Meta Platforms, Inc., one of the world's largest distributors of video content across its Facebook, Instagram, Threads, and WhatsApp services, has joined the Video Distribution Patent Pool (VDP Pool) as a Licensee. Meta also joined both the HEVC Advance and VVC Advance pools as a Licensee. Alibaba Group, whose video infrastructure spans a wide range of video-based services across e-commerce, entertainment, and digital media platforms, was also announced as a VDP Pool Licensee this week. Meta and Alibaba joining the VDP Pool further reinforces the program’s market leading position in resolving the licensing issues around the use of modern video codecs, including VP9, AV1, HEVC and VVC, across all the diverse business models of internet video streaming. "A significant U.S.-based company like Meta joining as a Licensee is a milestone moment for the content distribution business and the VDP Pool," said Peter Moller, CEO of Access Advance. "Meta reach
Kioxia Commences Sample Shipments of 10th-Generation BiCS FLASH™ Devices Delivering High Performance, High Capacity and Low Power Consumption3.7.2026 02:00:00 EEST | Press release
Kioxia Corporation, a world leader in memory solutions, today announced that it has commenced sample shipments of 1Tb (terabit) Triple-Level-Cell (TLC) memory devices utilizing its 10th-generation BiCS FLASH™ 3D flash memory technology.1 These will be primarily integrated into the company’s enterprise and data center SSDs, strengthening Kioxia’s lineup to meet the growing demand for AI storage, which requires higher performance, higher capacity, and lower power consumption. These new products will be manufactured using state-of-the-art equipment at Kioxia’s Kitakami Plant Fab2 facility in Iwate Prefecture, Japan. By leveraging innovative CMOS directly Bonded to Array (CBA) technology2 and On-Pitch Select Gate Drain (OPS) technology,3 both adopted since the 8th-generation BiCS FLASH™, the 10th-generation technology achieves a NAND interface speed of 4.8 Gb/s,4 a 33% improvement over the 8th generation. Bit density has increased by 59% by stacking 332 layers and improving lateral density
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom