TSMC, Bosch, Infineon, and NXP Establish Joint Venture to Bring Advanced Semiconductor Manufacturing to Europe
8.8.2023 13:09:00 EEST | Business Wire | Press release
TSMC (TWSE: 2330, NYSE: TSM), Robert Bosch GmbH, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), and NXP Semiconductors N.V. (NASDAQ: NXPI) today announced a plan to jointly invest in European Semiconductor Manufacturing Company (ESMC) GmbH, in Dresden, Germany to provide advanced semiconductor manufacturing services. ESMC marks a significant step towards construction of a 300mm fab to support the future capacity needs of the fast-growing automotive and industrial sectors, with the final investment decision pending confirmation of the level of public funding for this project. The project is planned under the framework of the European Chips Act.
The planned fab is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC’s 28/22 nanometer planar CMOS and 16/12 nanometer FinFET process technology, further strengthening Europe’s semiconductor manufacturing ecosystem with advanced FinFET transistor technology and creating about 2,000 direct high-tech professional jobs. ESMC aims to begin construction of the fab in the second half of 2024 with production targeted to begin by the end of 2027.
The planned joint venture will be 70% owned by TSMC, with Bosch, Infineon, and NXP each holding 10% equity stake, subject to regulatory approvals and other conditions. Total investments are expected to exceed 10 billion euros consisting of equity injection, debt borrowing, and strong support from the European Union and German government. The fab will be operated by TSMC.
“This investment in Dresden demonstrates TSMC’s commitment to serving our customers’ strategic capacity and technology needs, and we are excited at this opportunity to deepen our long-standing partnership with Bosch, Infineon, and NXP,” said Dr. CC Wei, Chief Executive Officer of TSMC. “Europe is a highly promising place for semiconductor innovation, particularly in the automotive and industrial fields, and we look forward to bringing those innovations to life on our advanced silicon technology with the talent in Europe.”
Dr. Stefan Hartung, Chairman of the Bosch board of management: “Semiconductors are not only a crucial success factor for Bosch. Their reliable availability is also of great importance for the success of the global automotive industry. Apart from continuously expanding our own manufacturing facilities, we further secure our supply chains as an automotive supplier through close cooperation with our partners. With TSMC, we are pleased to gain a global innovation leader to strengthen the semiconductor ecosystem in the direct vicinity of our semiconductor plant in Dresden.”
“Our joint investment is an important milestone to bolster the European semiconductor ecosystem. With this, Dresden is strengthening its position as one of the world’s most important semiconductor hubs that is already home to Infineon’s largest frontend site,” said Jochen Hanebeck, CEO of Infineon Technologies. “Infineon will use the new capacity to serve the growing demand particularly of its European customers, especially in automotive and IoT. The advanced capabilities will provide a basis for developing innovative technologies, products and solutions to address the global challenges of decarbonization and digitalisation.”
“NXP is very committed to strengthening innovation and supply chain resilience in Europe,” said Kurt Sievers, President and CEO of NXP Semiconductors. “We thank the European Union, Germany, and the Free State of Saxony for their recognition of the semiconductor industry’s critical role and for their true commitment to boost Europe’s chip ecosystem. The construction of this new and significant semiconductor foundry will add much needed innovation and capacity for the range of silicon required to supply the sharply increasing digitalization and electrification of the automotive and industrial sectors.”
About Bosch
The Bosch Group is a leading global supplier of technology and services. It employs roughly 421,000 associates worldwide (as of December 31, 2022). The company generated sales of 88.2 billion euros in 2022. Its operations are divided into four business sectors: Mobility, Industrial Technology, Consumer Goods, and Energy and Building Technology. As a leading IoT provider, Bosch offers innovative solutions for smart homes, Industry 4.0, and connected mobility. Bosch is pursuing a vision of mobility that is sustainable, safe, and exciting. It uses its expertise in sensor technology, software, and services, as well as its own IoT cloud, to offer its customers connected, cross-domain solutions from a single source. The Bosch Group’s strategic objective is to facilitate connected living with products and solutions that either contain artificial intelligence (AI) or have been developed or manufactured with its help. Bosch improves quality of life worldwide with products and services that are innovative and spark enthusiasm. In short, Bosch creates technology that is “Invented for life.” The Bosch Group comprises Robert Bosch GmbH and its roughly 470 subsidiary and regional companies in over 60 countries. Including sales and service partners, Bosch’s global manufacturing, engineering, and sales network covers nearly every country in the world. With its more than 400 locations worldwide, the Bosch Group has been carbon neutral since the first quarter of 2020. The basis for the company’s future growth is its innovative strength. At 136 locations across the globe, Bosch employs some 85,500 associates in research and development, of which nearly 44,000 are software engineers. Additional information is available online at www.bosch.com, www.iot.bosch.com, www.bosch-press.com, www.twitter.com/BoschPresse.
About Infineon
Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The company has around 56,200 employees worldwide and generated revenue of about €14.2 billion in the 2022 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the over-the-counter market OTCQX International over-the-counter market (ticker symbol: IFNNY). Further information is available at www.infineon.com
Follow us: Twitter – Facebook – LinkedIn
About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) brings together bright minds to create breakthrough technologies that make the connected world better, safer and more secure. As a world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets while delivering solutions that advance a more sustainable future. Built on more than 60 years of combined experience and expertise, the company has approximately 34,500 team members in more than 30 countries and posted revenue of $13.21 billion in 2022. Find out more at www.nxp.com.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 12,698 products for 532 customers in 2022 by providing broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230807579958/en/
Contact information
Robert Bosch GmbH
Athanassios Kaliudis
Spokesperson connected mobility, software and automotive electronics
Tel: +49 152 08651292
E-Mail: athanassios.kaliudis@de.bosch.com
Infineon Technologies AG
Andre Tauber
Head of Corporate Media Relations
Tel: +49 89 234-36705
E-Mail: Andre.Tauber@infineon.com
NXP Semiconductors
Mike Silverman
Sr. Director of Global Public Relations
Mobile: +1 979-350-9210
E-Mail: Mike.Silverman@nxp.com
Taiwan Semiconductor Manufacturing Company, Ltd.
Nina Kao
Head of Public Relations
Tel: +886-3-563-6688 ext. 7125036
Mobil: +886-988-239-163
E-Mail: nina_kao@tsmc.com
Ulric Kelly
Public Relations
Tel: +886-3-563-6688 ext. 7126541
Mobil: +886-978-111-503
E-Mail: ukelly@tsmc.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Takeda Announces FY2026 First Quarter Results, Near-Term Launch Preparations and Pipeline Progress on Track30.7.2026 09:37:00 EEST | Press release
Takeda (TOKYO:4502/NYSE:TAK) announced financial results for the first quarter of fiscal year 2026 (April 1, 2026 to June 30, 2026), marking a period of disciplined execution and operational momentum. Takeda leveraged the resilient performance of its core in-line portfolio to support its long-term strategy, advancing commercial launch preparations and driving critical R&D pipeline milestones. With a clear operational trajectory established in the first quarter and under a new operating model, Takeda remains on track to deliver its strategic and financial commitments for the fiscal year. FY2026 First Quarter Highlights Revenue increased by +10.2% versus the prior-year period on an actual exchange rate (AER) basis and decreased by -0.5% on a Constant Exchange Rate (CER) basis as the negative impact of the loss of exclusivity of VYVANSE® was largely offset by growth from core in-line brands. Core Operating Profit increased by +11.5% on an AER basis and decreased by -0.5% on a CER basis, r
Coulson Aviation Introduces CFR HALO, a Long-Term Fire Retardant Engineered for Modern Aerial Firefighting30.7.2026 09:03:00 EEST | Press release
Coulson Aviation today introduced CFR HALO, a next-generation long-term fire retardant engineered specifically for modern aircraft, tank systems, and wildfire missions. It is the first product from Coulson EmberWorks, the company’s research and development division dedicated to advancing aerial firefighting technologies. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260729960073/en/ Coulson Aviation has introduced CFR HALO, a next-generation long-term fire retardant engineered specifically for modern aircraft, tank systems and wildfire missions. It is designed with mission-optimized viscosity and flow characteristics to improve drop cohesion, reduce airborne drift, and support more accurate placement within the intended target area. CFR HALO is currently advancing through independent qualification programs with CEREN in France and the USDA Forest Service for inclusion on the Qualified Products List (QPL). These programs wil
SES Reports H1 2026 Results & Reiterates Full-Year Outlook30.7.2026 08:30:00 EEST | Press release
SES S.A. announces financial results for the three and six months ended June 30, 2026. H1 2026 Performance (€ million) H1 2026 as reported (1) H1 2025 as reported (1) ∆ At constant FX (2) H1 2025 like-for-like(3) ∆ At constant FX (2) Average €/$ FX rate 1.17 1.08 1.08 Revenue 1,602 978 +72.4% 1,799 -5.0% Adjusted EBITDA (4) 725 521 +47.0% 824 -6.2% 1) ‘Reported basis’ with Intelsat fully consolidated from July 17, 2025 2) ‘At constant FX’ refers to comparative figures restated at the current period FX rates to neutralize currency variations 3) ‘Like-for-like basis’ is as if Intelsat was fully consolidated from January 1, 2024 4) Excluding operating expenses/income recognized in relation to U.S. C-band repurposing, other income non-recurring, fair value movement on contingent value rights and other significant special items (disclosed separately) Networks revenue up +89.0% yoy(1) supported by growth in Mobility (+169.9% yoy(1); including positive impact from a contract restructuring in
AB InBev Reports Second Quarter 2026 Results30.7.2026 08:02:00 EEST | Press release
Anheuser-Busch InBev (Brussel:ABI) (BMV:ANB) (JSE:ANH) (NYSE:BUD): This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260729033132/en/ Regulated information1 “Cheers to beer – our performance this quarter reflects the strength of the beer category and the consistent execution of our strategy. Through investment in our megabrands and mega platforms, innovation and offering more choices across more occasions, we are strengthening the cultural relevance of our brands with consumers. Thank you to our colleagues for their commitment and disciplined execution, which position us well to continue our momentum.” – Michel Doukeris, CEO, AB InBev Revenue +5.6% Revenue increased by 5.6% in 2Q26 with revenue per hl growth of 4.2% and by 5.7% in HY26 with revenue per hl growth of 4.3%. Reported revenue increased by 11.0% in 2Q26 to 16 660 million USD and by 11.5% in HY26 to 31 927 million USD, positively impacted by currency translation. 6.2%
Kioxia Commences Sample Shipments of 9th-Generation BiCS FLASH™ 1Tb TLC Devices30.7.2026 08:00:00 EEST | Press release
Kioxia Corporation, a world leader in memory solutions, today announced it has commenced sample shipments of 1Tb (terabit) Triple-Level Cell (TLC) memory devices incorporating its 9th-generation BiCS FLASH™ 3D flash memory technology1. The devices are designed to support applications such as AI-enabled PCs and smartphones with low- to mid-level storage capacities that require high performance. Kioxia continues to pursue a dual-axis strategy based on its innovative CMOS directly Bonded to Array (CBA) technology2 and On-Pitch Select Gate Drain (OPS) technology3. Under its unique dual-axis strategy, Kioxia is simultaneously advancing two distinct product lines: its 9th-generation solutions, which deliver high performance at relatively low cost of investing, and its 10th-generation technology, which leverages advanced layer stacking to achieve massive capacity and superior performance. The new 9th-generation BiCS FLASH™ 1Tb TLC devices, developed using a 230-layer stacking process based on
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom