DNIB.com Reports Internet Has 356.6 Million Domain Name Registrations at the End of the Second Quarter of 2023
7.9.2023 23:32:00 EEST | Business Wire | Press release
VeriSign, Inc. (NASDAQ: VRSN), a global provider of domain name registry services and internet infrastructure, today announced that, according to the latest Domain Name Industry Brief Quarterly Report from DNIB.com, the second quarter of 2023 closed with 356.6 million domain name registrations across all top-level domains (TLDs), an increase of 1.7 million domain name registrations, or 0.5%, compared to the first quarter of 2023. Domain name registrations also increased by 4.3 million, or 1.2%, year over year.
The .com and .net TLDs had a combined total of 174.4 million domain name registrations in the domain name base at the end of the second quarter of 2023, a decrease of 0.3 million domain name registrations, or 0.2%, compared to the first quarter of 2023. The .com and .net TLDs had a combined increase of 0.1 million domain name registrations, or 0.1% year over year. As of June 30, 2023, the .com domain name base totaled 161.3 million domain name registrations and the .net domain name base totaled 13.1 million domain name registrations.
New .com and .net domain name registrations totaled 10.2 million at the end of the second quarter of 2023, compared to 10.1 million domain name registrations at the end of the second quarter of 2022.
Total country-code TLD (ccTLD) domain name registrations were 137.0 million at the end of the second quarter of 2023, an increase of 1.1 million domain name registrations, or 0.8%, compared to the first quarter of 2023. ccTLDs increased by 2.7 million domain name registrations, or 2.0%, year over year. The top 10 ccTLDs, as of June 30, 2023, were .cn, .de, .uk, .nl, .ru, .br, .au, .fr, .eu, and .it.
With the launch of the DNIB.com dashboards, 16 additional TLDs have been included in applicable calculations. The applicable current and historical data presented in this edition of the quarterly report have been adjusted accordingly, and applicable quarterly and year-over-year trends have been calculated using those adjusted figures. More information is available at DNIB.com.
Information about the statistical methodology used in creating the Domain Name Industry Brief Quarterly Report and DNIB.com’s dashboards is available here.
About DNIB.com
DNIB.com, sponsored by Verisign, provides global statistical and analytical research and data on the domain name industry, plus analyses of key policy, security, and technology trends. The latest Domain Name Industry Brief Quarterly Report, previous reports, and interactive dashboards with expanded domain name industry data are all available at DNIB.com.
About Verisign
Verisign, a global provider of domain name registry services and internet infrastructure, enables internet navigation for many of the world’s most recognized domain names. Verisign enables the security, stability, and resiliency of key internet infrastructure and services, including providing root zone maintainer services, operating two of the 13 global internet root servers, and providing registration services and authoritative resolution for the .com and .net top-level domains, which support the majority of global e-commerce. To learn more about what it means to be Powered by Verisign, please visit verisign.com.
VRSN
© 2023 VeriSign, Inc. All rights reserved. VERISIGN, the VERISIGN logo, Domain Name Industry Brief, and other trademarks, service marks, and designs are registered or unregistered trademarks of VeriSign, Inc. and its subsidiaries in the United States and in foreign countries. All other trademarks are property of their respective owners.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230907783392/en/
Contact information
Investor Relations: David Atchley, datchley@verisign.com, + 1 703-948-3447
Media Relations: Dave McGuire, davmcguire@verisign.com, + 1 703-948-3800
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 23:06:00 EET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 23:00:00 EET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 20:50:00 EET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 19:08:00 EET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 17:00:00 EET | Press release
ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent chip teams. ChipAgents is building the foundational AI infrastructure for chip design, with coordinated AI Agents that can plan, reason, execut
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
