Nitro Named a Leader in the IDC MarketScape: Worldwide eSignature Software 2023 Vendor Assessment
Nitro Software, a global leader in SaaS eSignature and PDF document solutions for businesses, announced today that Nitro was named a Leader in the IDC MarketScape: Worldwide eSignature Software 2023 Vendor Assessment .
Nitro Sign provides organizations with a seamless, scalable eSigning experience, including flexible integrations and APIs, a low total cost of ownership, and high-trust electronic signatures that meet or exceed global security and compliance standards.
The IDC MarketScape: Worldwide eSignature Software 2023 Vendor Assessment delivers a comprehensive evaluation of eSignature vendors, key observations, market trends and advice for technology buyers on how to choose the right eSignature vendor.
Nitro was recognized for the following strengths:
- “Nitro offers a full range of deployment choices, from on premises to private and public cloud setups.”
- “Nitro's eSignature solution is part of a full suite of PDF creation, editing and document automation, document generation, and analytics tools.”
- “Nitro helps support its customers' sustainability goals by providing data on CO2 emissions, paper saved, and energy saved on an account basis.”
“We believe being recognized as a Leader in the IDC MarketScape: Worldwide eSignature Software 2023 Vendor Assessment is a testament to Nitro's unyielding commitment to innovation and delivering top-tier solutions. This acknowledgment further validates our dedication to providing powerful eSignature workflows, seamless UI experiences and cutting-edge technologies that redefine how businesses approach digital document management." Filip Verreth, VP Product at Nitro
To read more about eSignature trends and Nitro’s position as a Leader, click here for a complimentary excerpt of the report.
About Nitro Software
Nitro is a global SaaS leader in PDF software, document management and electronic signatures. Nitro’s Productivity Platform includes powerful PDF tools, digital workflows, highly secure eSigning and identity verification capabilities. Its analytics product measures ROI and quantifies sustainability efforts, all supported by a best-in-class customer success and change management support team. With more than 3 million licensed users and 13,000+ business customers across 157 countries, Nitro serves 67% of the Fortune 500. For more information, visit: www.gonitro.com.
About IDC MarketScape:
IDC MarketScape vendor assessment model is designed to provide an overview of the competitive fitness of ICT (information and communications technology) suppliers in a given market. The research methodology utilizes a rigorous scoring methodology based on both qualitative and quantitative criteria that results in a single graphical illustration of each vendor’s position within a given market. IDC MarketScape provides a clear framework in which the product and service offerings, capabilities and strategies, and current and future market success factors of IT and telecommunications vendors can be meaningfully compared. The framework also provides technology buyers with a 360-degree assessment of the strengths and weaknesses of current and prospective vendors.
IDC MarketScape: Worldwide eSignature Software 2023 Vendor Assessment, ( doc #US49646293 ), September 2023
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
Nitro Software email@example.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
STEMCELL Technologies Partners with Science World to Empower Girls Pursuing Science-related Careers25.9.2023 21:02:00 EEST | Press release
STEMCELL Technologies, Canada’s largest biotechnology company, is pleased to announce it will be the presenting partner of the Girls and STEAM Summit at Science World in Vancouver. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230925955247/en/ STEMCELL Technologies, Canada’s largest biotechnology company, is pleased to announce it will be the presenting partner of the Girls and STEAM Summit at Science World in Vancouver, British Columbia. The Summit, which takes place on November 4, 2023, is a full-day event with workshops, hands-on activities, a keynote presentation, and sessions with experienced mentors who work in STEAM (science, technology, engineering, art and design, and math). “Science is about so much more than what happens in the laboratory. It provides a lens that can instill a deep-seated curiosity in young minds and enrich every aspect of our lives,” said Sharon Louis, Senior Vice President of Research and Devel
AngloGold Ashanti plc Completes the Primary Listing of Its Ordinary Shares on the NYSE and Commences Trading25.9.2023 17:11:00 EEST | Press release
AngloGold Ashanti is pleased to announce that it has today completed its corporate restructuring, with a primary listing of its shares on the New York Stock Exchange (NYSE) and a corporate domicile in the UK. The corporate restructuring was first announced on 12 May of this year and approved by the shareholders of AngloGold Ashanti Limited on 18 August. “The move of our primary listing to the NYSE provides us with improved access to the world’s largest capital market and places us alongside the industry’s highest-valued gold companies,” said AngloGold Ashanti CEO Alberto Calderon. “This signifies an important new era for AngloGold Ashanti strengthening our corporate infrastructure as we continue to focus on taking performance from our world class asset base to the next level.” The ordinary shares of AngloGold Ashanti plc commenced trading on the NYSE today, 25 September 2023, maintaining the ticker symbol AU. Trading in the AngloGold Ashanti Limited American Depositary Shares (ADSs) on
PLIDCO Launches New Line of Hydrogen-Compatible Fittings25.9.2023 17:00:00 EEST | Press release
The Pipe Line Development Company (PLIDCO), the leader in pipeline leak repair and maintenance fittings, announced today a new range of products for use with hydrogen pipelines in response to the emerging transition toward hydrogen and other alternative energy sources. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230925622149/en/ PLIDCO Hydrogen-Compliant Fittings Brochure (Photo: Business Wire) Designed for onshore and subsea high-pressure emergency pipeline repairs and routine pipeline maintenance applications, PLIDCO’s products are ideal for hydrogen, oil, gas, water, chemical, steam, slurry and other piping systems. Its high-pressure fittings are designed and manufactured to meet the highest quality standards, following ASME/ANSI codes and adhering to a strict quality control program. “As the shift toward a hydrogen-based energy system gains traction, we anticipate an emerging need for pipeline maintenance and repair p
MESTEC Wins Oracle® Global Leaders ISV of the Year Award25.9.2023 16:30:00 EEST | Press release
MESTEC is excited to accept the Oracle Global Leaders ISV of the Year Award at this year’s Oracle CloudWorld Conference. At over 50% annual growth, MESTEC is leading the manufacturing software category and welcoming some of the world’s most innovative and valuable manufacturers to its pioneering SaaS MES platform. MESTEC’s primary focus on helping manufacturers gain performance across 80+ key manufacturing KPIs, along with its rapid deployment time, is fuelling customer migration to the platform. MESTEC is part of the Eyelit Group, an emerging leader in manufacturing software platforms. Together with Eyelit advanced manufacturing software, the two platforms are seeing especially strong demand in semiconductor, automotive, medtech, aerospace and defence, battery, and solar industries. The platforms support all key manufacturing workflows including asset management, factory and equipment integration, automation, manufacturing execution (MES), recipe management, quality management, planni
ASMPT AMICRA and Teramount Collaborate to Advance Silicon Photonics Packaging25.9.2023 16:00:00 EEST | Press release
ASMPT AMICRA, a worldwide leading supplier of ultra-high precision die attach equipment that specializes in ultra-high precision die attach solutions, and Teramount Ltd, the leader in scalable fiber connectivity to chips, today announced a collaboration to address the challenge of connecting fibers to silicon photonic chips, to meet the ever-growing bandwidth demands in datacom and telecom applications. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230925435797/en/ A close collaboration between Teramount and ASMPT AMICRA on fiber connectivity to silicon photonics chips (Photo: Business Wire) In the rapidly evolving fields of artificial intelligence and high-performance networking, one of the primary challenges has been to achieve seamless fiber-to-chip connectivity. The collaboration between the two companies, based on placement of Teramount’s pioneering wafer-level self-aligning optical elements on customer’s Silicon Photo
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.Visit our pressroom