Esri Launches Online GIS Course for Climate Action
28.9.2023 23:01:00 EEST | Business Wire | Press release
As the impacts of climate change increase and intensify around the world, one aspect that has become clear is the geographic nature of the issue. The ability to tackle such a wide-reaching geographic challenge requires technology that gives context, which location intelligence provides. To support the individuals working toward this goal, Esri, the global leader in geographic information system (GIS) technology, today announced it will offer a new massive open online course (MOOC) exploring the application of its software to address climate change impacts. The complimentary course will be available this fall for six weeks on the Esri Academy website and includes full access to ArcGIS Pro, ArcGIS Network Analyst, ArcGIS Online, and other ArcGIS software that uses science-based tools and authoritative data.
GIS for Climate Action opens on October 25 and provides a comprehensive introduction to how GIS software is used to ingest, map, visualize, analyze, and share massive amounts of data.
Scientists, researchers, business leaders, and policymakers rely on GIS to glean insight that supports sound decisions. Participants in the MOOC will gain experience using a suite of ArcGIS software as they work through real-world scenarios to visualize climate hazards, analyze climate-related risks to people and the natural and built environments, and determine where to deploy effective solutions.
Chief Scientist of Esri, Dawn Wright, a lauded expert in geography and oceanography and the first Black person to explore and map Challenger Deep in the Pacific Ocean, will host the course.
"In this MOOC, we'll dive into scientific principles and explore climate change indicators, risks, and options to mitigate greenhouse gas emissions, protect vulnerable populations—and much more," said Wright. "Taking positive climate action can begin with the simple act of talking about how it affects the people and places that you love.”
Course videos feature Wright having frank conversations with leading climate experts and individuals taking action to infuse sustainability into education and their local communities. Other videos feature discussions between Esri technology experts on the front lines of helping organizations understand and address climate risks.
Each section of the course will focus on a specific topic and application. From determining optimal locations to install solar panels to planning adaptations that will mitigate high heat to optimizing travel routes, participants will explore a wide range of scenarios using real data and powerful ArcGIS tools.
"I invite anyone who is worried about climate change and wants to make a difference to join this course,” continued Wright. "It should also be a lot of fun!"
Sparking positive action requires effective communication, and course participants will learn how to use ArcGIS Dashboards, ArcGIS Instant Apps, and ArcGIS StoryMaps to share data and their analysis results using visually appealing information products that will resonate with decision-makers and the public.
GIS for Climate Action is open to learners worldwide. All that's needed to attend is an ArcGIS account, which is free and easy to create at accounts.arcgis.com. A certificate will be awarded to all participants after course completion. Registration is open through November 8.
To view course details and register, visit go.esri.com/gis-for-climate-action-course.
About Esri
Esri, the global market leader in geographic information system (GIS) software, location intelligence, and mapping, helps customers unlock the full potential of data to improve operational and business results. Founded in 1969 in Redlands, California, USA, Esri software is deployed in hundreds of thousands of organizations globally, including Fortune 500 companies, government agencies, nonprofit institutions, and universities. Esri has regional offices, international distributors, and partners providing local support in over 100 countries on six continents. With its pioneering commitment to geospatial technology and analytics, Esri engineers the most innovative solutions that leverage a geographic approach to solving some of the world’s most complex problems by placing them in the crucial context of location. Visit us at esri.com.
Copyright © 2023 Esri. All rights reserved. Esri, the Esri globe logo, ArcGIS, StoryMaps, Network Analyst, The Science of Where, esri.com, and @esri.com are trademarks, service marks, or registered marks of Esri in the United States, the European Community, or certain other jurisdictions. Other companies and products or services mentioned herein may be trademarks, service marks, or registered marks of their respective mark owners.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230928428222/en/
Contact information
Jo Ann Pruchniewski
Public Relations, Esri
Mobile: 301-693-2643
Email: jpruchniewski@esri.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 23:06:00 EET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 23:00:00 EET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 20:50:00 EET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 19:08:00 EET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 17:00:00 EET | Press release
ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent chip teams. ChipAgents is building the foundational AI infrastructure for chip design, with coordinated AI Agents that can plan, reason, execut
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom