Tongxin Micro Making a Splash at TRUSTECH, and Unveiling the World’s First eSIM Solution Tailored for Smart POS Systems
29.11.2023 20:00:00 EET | Business Wire | Press release
November 28th marks the grand opening of TRUSTECH 2023 in Paris, France. Tongxin Micro, an industry-leading semiconductor solution provider, makes an impressive debut, showcasing its technological advancements in identity recognition, telecommunications, and financial payments.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20231129462718/en/
(Photo: Business Wire)
In the realm of identity recognition, Tongxin Micro brings its document chip solutions in compliance with international ICAO standards that boast the highest security levels globally, catering to such applications as seafarer’s passport and official passport. In telecommunications, a full array of products and terminal applications are displayed, including standard SIM, SWP-SIM, digital car keys based on SWP-SIM, and eSIM wearable devices. In the payment sector, Tongxin Micro’s innovative payment technologies draw significant attention, ranging from chip applications in payment IC cards, display cards, fingerprint cards, and e-CNY hardware wallets, to MCU chips for safety-critical products, such as POS, online identity authentication, IoT SE, and biometric identification.
In addition, John Zou, EVP of Tongxin Micro, shares the world’s first eSIM solution tailored for smart POS systems at the Innovation Stage. He expresses that, "Currently, smart POS systems require to switch among multiple SIM cards to connect to different networks, which is a tedious and unsafe process, and thus compromising business service efficiency and user experience. Our solution, designed with the world-class security chips in an embedded manner, features high information security. It enables online activation of eSIM, allowing the switch between different carriers freely to save deployment costs. This solution comes with wafer-level personalization services, saving significant board-level space, and we can also provide customized one-stop solutions to meet the diverse needs of customers both at home and abroad.” To date, this solution has been adopted by several well-known terminal device manufacturers.
Bearing its mission of achieving more intelligent, more convenient, and more secure digital experience in mind, Tongxin Micro has deepened its footprint in the fields of automotive electronics and smart chip. The company is steadily accelerating its global expansion, with business spanning over twenty countries and regions in Asia, Europe, Americas, and Africa. Tongxin Micro looks forward to continuously creating more competitive new technologies and solutions for global customers, and jointly forging ahead for a brighter future in digital economy.
For more information: www.tsinghuaic.com
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20231129462718/en/
Contact information
Tongxin Microelectronics Co., Ltd.
Steve Sun
sunhb01@tsinghuaic.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Access Advance Welcomes Meta Platforms, Inc. and Alibaba Group to the Video Distribution Patent Pool3.7.2026 02:00:00 EEST | Press release
Access Advance LLC today announced that Meta Platforms, Inc., one of the world's largest distributors of video content across its Facebook, Instagram, Threads, and WhatsApp services, has joined the Video Distribution Patent Pool (VDP Pool) as a Licensee. Meta also joined both the HEVC Advance and VVC Advance pools as a Licensee. Alibaba Group, whose video infrastructure spans a wide range of video-based services across e-commerce, entertainment, and digital media platforms, was also announced as a VDP Pool Licensee this week. Meta and Alibaba joining the VDP Pool further reinforces the program’s market leading position in resolving the licensing issues around the use of modern video codecs, including VP9, AV1, HEVC and VVC, across all the diverse business models of internet video streaming. "A significant U.S.-based company like Meta joining as a Licensee is a milestone moment for the content distribution business and the VDP Pool," said Peter Moller, CEO of Access Advance. "Meta reach
Kioxia Commences Sample Shipments of 10th-Generation BiCS FLASH™ Devices Delivering High Performance, High Capacity and Low Power Consumption3.7.2026 02:00:00 EEST | Press release
Kioxia Corporation, a world leader in memory solutions, today announced that it has commenced sample shipments of 1Tb (terabit) Triple-Level-Cell (TLC) memory devices utilizing its 10th-generation BiCS FLASH™ 3D flash memory technology.1 These will be primarily integrated into the company’s enterprise and data center SSDs, strengthening Kioxia’s lineup to meet the growing demand for AI storage, which requires higher performance, higher capacity, and lower power consumption. These new products will be manufactured using state-of-the-art equipment at Kioxia’s Kitakami Plant Fab2 facility in Iwate Prefecture, Japan. By leveraging innovative CMOS directly Bonded to Array (CBA) technology2 and On-Pitch Select Gate Drain (OPS) technology,3 both adopted since the 8th-generation BiCS FLASH™, the 10th-generation technology achieves a NAND interface speed of 4.8 Gb/s,4 a 33% improvement over the 8th generation. Bit density has increased by 59% by stacking 332 layers and improving lateral density
Bending Spoons S.p.A. announces closing of initial public offering2.7.2026 21:35:00 EEST | Press release
Bending Spoons S.p.A. (“Bending Spoons”), a leading technology company, today announces the closing of its initial public offering of an aggregate of 57,971,015 of its ordinary shares, at an initial public offering price of $29.00 per share. The offering consisted of 34,398,640 shares sold by Bending Spoons and 23,572,375 shares sold by certain selling shareholders (the “Selling Shareholders”). The gross proceeds from the offering to Bending Spoons, before deducting underwriting discounts and commissions and other offering expenses, was approximately $953,917,285.50. Bending Spoons did not receive any proceeds from the sale of shares by the Selling Shareholders. Bending Spoons’ ordinary shares began trading on the Nasdaq Global Select Market on July 1, 2026 under the ticker symbol “BSP”. Goldman Sachs International, J.P. Morgan, and Allen & Company LLC are acting as joint lead book-running managers for the offering. Wells Fargo Securities, BofA Securities, Jefferies, Evercore ISI, BNP
Strategic Partnership Between Record Asset Management and Admicasa2.7.2026 20:00:00 EEST | Press release
RAM Swiss Holding AG is a subsidiary of LSE-listed Record Financial Group (Record) and part of the Record Asset Management (RAM) group of companies. The partnership is a milestone in the growth of Admicasa and marks an important step in the continued expansion of Record’s private markets platform. Subject to regulatory approval, the agreement, signed on 1st July 2026, provides RAM Swiss Holding AG with a 50% participation in the Admicasa Fondsleitung AG, part of Admicasa, and establishes a long-term partnership to develop investment opportunities in the Swiss and Global real estate market with a plan to expand into other asset classes in the medium term. RAM is the European asset management arm of Record, the LSE-listed specialist investment group managing USD 115 billion of assets on behalf of institutional clients worldwide. Record's client base comprises pension funds, foundations, sovereign institutions and other asset managers, with whom it has built long-standing relationships th
IQM Quantum Computers Becomes First European Quantum Computing Company Listed on a Major U.S. Exchange2.7.2026 17:47:00 EEST | Press release
IQM Quantum Computers (Nasdaq: IQMX) (“IQM”, “IQM Quantum Computers” or the “Company”), a global leader in full-stack superconducting quantum computers, today became a publicly traded company following the completion of its business combination with Real Asset Acquisition Corp. (“RAAQ”). This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702960460/en/ IQM Quantum Computers Becomes First European Quantum Computing Company Listed on a Major U.S. Exchange The company’s American Depositary Shares begin trading today on the Nasdaq Global Select Market under the ticker symbol “IQMX”. The listing marks a major milestone for IQM establishing the company as the first European quantum computing company listed on a major U.S. stock exchange. Due to the proceeds of the transaction, IQM maintains a strong pro forma cash position of EUR 337 million. IQM enters the public markets with strong commercial momentum and a rapidly expanding globa
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom