DNP Accelerates Development of Photomask Manufacturing Process for 2nm Generation EUV Lithography
27.3.2024 03:23:00 EET | Business Wire | Press release
Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has begun development of a photomask manufacturing for 2-nanometer (10-9 meter) generation logic semiconductors that support Extreme Ultra-Violet (EUV) lithography, the cutting-edge process for semiconductor manufacturing.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240319148117/en/
Image of EUV lithography with pellicle, a protective film for the photomask (Photo: Business Wire)
DNP will also act as a subcontractor and provide the newly developed technology to Tokyo-based Rapidus Corporation (Rapidus). Rapidus is participating in the Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems instigated by the New Energy and Industrial Technology Development Organization (NEDO).
[Background]
We have strengthened our ability to manufacture cutting-edge semiconductors with high productivity and quality. And in 2016, DNP was the world's first merchant photomask manufacturer to introduce the multi-beam mask writing tool (MBMW).
In 2023, we completed the development of a photomask manufacturing process for 3-nm generation EUV lithography, and commenced development of 2-nm generation technology. In response to the need for further miniaturization, we will begin full-scale development of a photomask manufacturing process for 2-nm generation EUV lithography, including the operation of second and third multi-electron beam mask lithography systems in FY 2024.
DNP plans to bring online its second and third MBMW mask lithography systems in FY 2024, accelerating the development of photomasks for 2-nm generation EUV lithography.
DNP will act as a subcontractor on Development of Advanced Semiconductor Manufacturing Technology (Commissioned) by Rapidus as part of the NEDO’s previously mentioned R&D project.
[Going Forward]
By FY 2025, DNP will complete the development of a manufacturing process for photomasks for 2-nm generation logic semiconductors that support EUV lithography. From FY 2026 onwards, we will push ahead with the establishment of production technology with a view to commencing mass production in FY 2027.
We have also begun development with an eye toward the 2-nm generation and beyond, and have signed an agreement with imec, a cutting-edge international research organization headquartered in Leuven, Belgium, to jointly develop next-generation EUV photomasks. DNP will continue to contribute to the growth of Japan's semiconductor industry by promoting development in collaboration with various partners within the framework of the international semiconductor industry.
About DNP
DNP was established in 1876, and has become a leading global company that leverages print-based solutions to engineer fresh business opportunities while protecting the environment and creating a more vibrant world for all. We capitalize on core competencies in microfabrication and precision coating technology to provide products for the display, electronic device, and optical film markets. We have also developed new products, such as vapor chamber and reflect array that offer next-generation communication solutions for more people-friendly information society.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240319148117/en/
Contact information
Media contact
DNP: Yusuke Kitagawa, +81-3-6735-0101
kitagawa-y3@mail.dnp.co.jp
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
IFF to Webcast Fireside Chat at Barclays Global Consumer Conference on Sept. 1018.8.2026 23:15:00 EEST | Press release
IFF (NYSE: IFF) today announced that Chief Executive Officer Erik Fyrwald will participate in a fireside chat at the Barclays Global Consumer Conference on Thursday, Sept. 10, 2026 at 945 a.m. ET. Investors may access the live webcast on the Company's website at ir.iff.com. For those unable to listen to the live webcast, a recorded version will be made available for replay. Welcome to IFF At IFF (NYSE: IFF), we make joy through science, creativity and heart. As the global leader in flavors, fragrances, and health and biosciences, we deliver groundbreaking, sustainable innovations that elevate everyday products—advancing wellness, delighting the senses and enhancing the human experience.Learn more at iff.com, LinkedIn, Instagram and Facebook. View source version on businesswire.com: https://www.businesswire.com/news/home/20260818490253/en/
Lehman Brothers Treasury Announces the Successful Sale of its Remaining Intercompany Claim against Lehman Brothers Holdings Inc.18.8.2026 22:15:00 EEST | Press release
In connection with its previously announced final wind-down, Lehman Brothers Treasury Co. B.V. in liquidation (“LBT”), through its U.S. counsel Herbert Smith Freehills Kramer (US) LLP, announced that its placement agent, Seaport Loan Products LLC, successfully closed the sale of LBT’s remaining $19.6 billion Class 4A intercompany claim against Lehman Brothers Holdings Inc. The net proceeds of the sale, together with certain available cash (but after deducting various sale-related and other administrative costs and expenses), will be used to fund a final distribution to the holders of LBT’s existing notes, after which such existing notes will be canceled and LBT shall be fully wound down. As a result, LBT will cease to exist. LBT expects the final distribution to occur in the course of October 2026 and the wind down to have been completed before the end of 2026. View source version on businesswire.com: https://www.businesswire.com/news/home/20260818004215/en/
GenBio AI Builds First World Model of the Human Cell18.8.2026 16:00:00 EEST | Press release
GenBio AI ('GenBio') is an AI for Science company co-founded by Nobel Laureate David Baker, leading AI scientist Eric Xing, and other prominent life science and artificial intelligence researchers from Stanford, Carnegie Mellon University, Mohamed Bin Zayed University of Artificial Intelligence, Harvard, Weizmann Institute, and other research institutions. Today, the company introduced AIDO Cell, its virtual cell world model — the first system capable of simulating a human cell, both in its natural state and in response to drugs and other interventions, across its full biological hierarchy, from DNA and RNA through protein to the whole-cell level. A Key First in Biological and Medical Sciences: Full-hierarchy virtual cell simulation has been widely identified as a key milestone in computational biology. Compared to the previous efforts by various research labs, AIDO Cell is the first to integrate the entire molecular-to-cellular spectrum into one continuous simulation. Using the system
Xsolla Partner Network Expands Verified Creator Partnerships and Unifies Campaign Management Ahead of gamescom 202618.8.2026 16:00:00 EEST | Press release
Xsolla, a global video game commerce company, today announced an expansion of the Xsolla Partner Network ahead of gamescom 2026 in Cologne, giving game developers a simpler, more reliable way to grow their games through creators. The creator platform now lives within Xsolla Publisher Account, where developers already run their business, with verified creator onboarding and a redesigned and unified campaign workflow. Flat-fee campaigns, a new guaranteed payment option alongside revenue share, and data-driven creator recommendations are coming soon. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260818140062/en/ Graphic: Xsolla Xsolla Partner Network gives developers one place to launch, manage, track, and report on creator campaigns while Xsolla handles payments, payouts, taxes, and compliance. Verified creators, less guesswork. Automated anti-fraud vetting and identity verification at payout means developers partner with rea
KOCCA to Showcase 13 Korean Game Companies at ‘Gamescom 2026’ with PC, Mobile, and VR Lineups18.8.2026 15:48:00 EEST | Press release
The Korea Creative Content Agency (KOCCA) announced that 13 Korean game companies will gather under one roof at Gamescom 2026, Europe’s largest game show, held in Cologne, Germany, from August 26 to 28 (B2B, 09:00~20:00). Located in Booth Hall 3.2 C-050g–D051g, the Korea Joint Pavilion offers visitors hands-on experiences with an expansive lineup of titles, ranging from PC and mobile games to VR-powered titles across diverse genres. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260818271881/en/ KOCCA will bring 13 Korean game companies to Gamescom 2026 in Cologne, Germany (Image: KOCCA) The standout feature of this year’s joint pavilion is its overwhelming genre diversity. The lineup includes roguelike deckbuilders, visual novels, 2D shooters, rhythm action, and cooperative horror survival—catering to a broad spectrum of gamers—alongside immersive content that integrates AI and XR technology. Introducing the Participating T
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
