TSMC Celebrates 30th North America Technology Symposium with Innovations Powering AI with Silicon Leadership
TSMC (TWSE: 2330, NYSE: TSM) today unveiled its newest semiconductor process, advanced packaging, and 3D IC technologies for powering the next generation of AI innovations with silicon leadership at the Company’s 2024 North America Technology Symposium. TSMC debuted the TSMC A16TM technology, featuring leading nanosheet transistors with innovative backside power rail solution for production in 2026, bringing greatly improved logic density and performance. TSMC also introduced its System-on-Wafer (TSMC-SoW™) technology, an innovative solution to bring revolutionary performance to the wafer level in addressing the future AI requirements for hyperscaler datacenters.
This year marks the 30th anniversary of TSMC’s North America Technology Symposium, and more than 2,000 attended the event, growing from less than 100 attendees 30 years ago. The North America Technology Symposium in Santa Clara, California kicks off TSMC Technology Symposiums around the world in the coming months. The symposium also features an “Innovation Zone,” designed to highlight the technology achievements of our emerging start-up customers.
“We are entering an AI-empowered world, where artificial intelligence not only runs in data centers, but PCs, mobile devices, automobiles, and even the Internet of Things,” said TSMC CEO Dr. C.C. Wei. “At TSMC, we are offering our customers the most comprehensive set of technologies to realize their visions for AI, from the world’s most advanced silicon, to the broadest portfolio of advanced packaging and 3D IC platforms, to specialty technologies that integrate the digital world with the real world.”
New technologies introduced at the symposium include:
TSMC A16TM Technology: With TSMC’s industry-leading N3E technology now in production, and N2 on track for production in the second half of 2025, TSMC debuted A16, the next technology on its roadmap. A16 will combine TSMC’s Super Power Rail architecture with its nanosheet transistors for planned production in 2026. It improves logic density and performance by dedicating front-side routing resources to signals, making A16 ideal for HPC products with complex signal routes and dense power delivery networks. Compared to TSMC’s N2P process, A16 will provide 8-10% speed improvement at the same Vdd (positive power supply voltage), 15-20% power reduction at the same speed, and up to 1.10X chip density improvement for data center products.
TSMC NanoFlexTM Innovation for Nanosheet Transistors: TSMC’s upcoming N2 technology will come with TSMC NanoFlex, the company’s next breakthrough in design-technology co-optimization. TSMC NanoFlex provides designers with flexibility in N2 standard cells, the basic building blocks of chip design, with short cells emphasizing small area and greater power efficiency, and tall cells maximizing performance. Customers are able to optimize the combination of short and tall cells within the same design block, tuning their designs to reach the optimal power, performance, and area tradeoffs for their application.
N4C Technology: Bringing TSMC’s advanced technology to a broader range of of applications, TSMC announced N4C, an extension of N4P technology with up to 8.5% die cost reduction and low adoption effort, scheduled for volume production in 2025. N4C offers area-efficient foundation IP and design rules that are fully compatible with the widely-adopted N4P, with better yield from die size reduction, providing a cost-effective option for value-tier products to migrate to the next advanced technology node from TSMC.
CoWoS®, SoIC, and System-on-Wafer (TSMC-SoW™ ): TSMC’s Chip on Wafer on Substrate (CoWoS®) has been a key enabler for the AI revolution by allowing customers to pack more processor cores and high-bandwidth memory (HBM) stacks side by side on one interposer. At the same time, our System on Integrated Chips (SoIC) has established itself as the leading solution for 3D chip stacking, and customers are increasingly pairing CoWoS with SoIC and other components for the ultimate system-in-package (SiP) integration.
With System-on-Wafer, TSMC is providing a revolutionary new option to enable a large array of dies on a 300mm wafer, offering more compute power while occupying far less data center space and boosting performance per watt by orders of magnitude. TSMC’s first SoW offering, a logic-only wafer based on Integrated Fan-Out (InFO) technology, is already in production. A chip-on-wafer version leveraging CoWoS technology is scheduled to be ready in 2027, enabling integration of SoIC, HBM and other components to create a powerful wafer-level system with computing power comparable to a data center server rack, or even an entire server.
Silicon Photonics Integration: TSMC is developing Compact Universal Photonic Engine (COUPE™ ) technology to support the explosive growth in data transmission that comes with the AI boom. COUPE uses SoIC-X chip stacking technology to stack an electrical die on top of a photonic die, offering the lowest impedance at the die-to-die interface and higher energy efficiency than conventional stacking methods. TSMC plans to qualify COUPE for small form factor pluggables in 2025, followed by integration into CoWoS packaging as co-packaged optics (CPO) in 2026, bringing optical connections directly into the package.
Automotive Advanced Packaging: After introducing the N3AE “Auto Early” process in 2023, TSMC continues to serve our automotive customers’ needs for greater computing power that meets the safety and quality demands of the highway by integrating advanced silicon with advanced packaging. TSMC is developing InFO-oS and CoWoS-R solutions for applications such as advanced driver assistance systems (ADAS), vehicle control, and vehicle central computers, targeting AEC-Q100 Grade 2 qualification by fourth quarter of 2025.
About TSMC
TSMC pioneered the pure-play foundry business model when it was founded in 1987, and has been the world’s leading dedicated semiconductor foundry ever since. The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and portfolio of design enablement solutions to unleash innovation for the global semiconductor industry. With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
TSMC deployed 288 distinct process technologies, and manufactured 11,895 products for 528 customers in 2023 by providing broadest range of advanced, specialty and advanced packaging technology services. The Company is headquartered in Hsinchu, Taiwan. For more information please visit https://www.tsmc.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240424036229/en/
Contact information
TSMC Spokesperson:
Wendell Huang
Senior Vice President and CFO
Tel: 886-3-505-5901
Media Contacts:
Nina Kao
Head of Public Relations
Tel: 886-3-563-6688 ext.7125036
Mobile: 886-988-239-163
E-Mail: nina_kao@tsmc.com
Michael Kramer
Public Relations
Tel: 886-3-563-6688 ext. 7125031
Mobile: 886-988-931-352
E-Mail: pdkramer@tsmc.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
FES Super Extends Partnership with SS&C28.5.2025 01:13:00 EEST | Press release
SS&C Technologies Holdings, Inc. (Nasdaq: SSNC) today announced the Fire and Emergency Services Superannuation Fund (“FES Super”) has signed a long-term agreement to extend its existing partnership with SS&C. The renewal reinforces SS&C’s leadership and continued growth in the Australian superannuation market, following several recent strategic wins in the region. FES Super leverages SS&C Bluedoor, a cloud-hosted registry platform, to manage its administration needs. The platform enables real-time automation and straight-through processing, helping streamline operations and improving member experiences. SS&C also provides member digital and reporting services to the fund. “Our top priority is acting in the best interests of our members,” said Adrian Rutter, Fund Secretary at FES Super. “SS&C’s flexible, customizable tools and consistent service enable us to continue doing just that. By leveraging Bluedoor’s integration capabilities and cloud-native services, we can efficiently deliver
Perma-Pipe International Holdings, Inc. Announces New Contract Award in Qatar27.5.2025 22:48:00 EEST | Press release
Perma-Pipe International Holdings, Inc. (Nasdaq: PPIH) today announced that it has received its first project award to be executed in Qatar since the announcement of the intent to mobilize there. The project will be for USD $2.4 million and will utilize Perma-Pipe’s fabrication capabilities and the XTRU-THERM® insulation system, a spray-applied polyurethane foam jacketed with a high-density polyethylene casing. Adham Sharkawy, Senior Vice President of Perma-Pipe’s MENA region, remarked, “In response to this important award, we will begin executing the project from a temporary facility in Doha, ensuring timely delivery and uninterrupted service to our client. Simultaneously, we are advancing the construction of our permanent facility in Qatar, which will serve as a long-term base for our regional operations. We are deeply grateful to our customers for their continued trust and confidence in Perma-Pipe’s capabilities.” Saleh Sagr, President, commented, “Expanding in Doha has been an impo
Galderma Intends to Buy Back approximately 2.4 Million Shares in the Context of the Accelerated Bookbuild Offering by EQT, ADIA and Auba27.5.2025 18:46:00 EEST | Press release
Galderma Group AG (SWX:GALD): Ad hoc announcement pursuant to Art. 53 LR Galderma intends to repurchase approximately 2.4 million shares in the context of the accelerated bookbuild offering of Galderma shares by Sunshine SwissCo GmbH (“EQT”), Abu Dhabi Investment Authority (“ADIA”) and Auba Investment Pte. Ltd. (“Auba”) announced today The repurchased shares will be held in treasury and financed by existing liquidity at hand Galderma (SIX: GALD), the pure-play dermatology category leader, today announced that it intends to repurchase approximately 2.4 million Galderma shares in the context of an accelerated bookbuilding offering (“ABO”) of approximately 16.7 million Galderma shares (approximately 7% of Galderma’s share capital) by EQT, ADIA and Auba. Galderma will participate in the ABO at the same price per share which will be determined in the bookbuilding. The repurchased shares will be financed by Galderma’s existing liquidity on hand and will not affect the company’s ability to de
New South Wales Minister for Industry and Trade Visits Novotech Seoul Office to Strengthen Clinical Trial Collaboration27.5.2025 18:44:00 EEST | Press release
Novotech, a globally recognized full-service clinical research organization (CRO) and scientific advisory company trusted by biotech and small- to mid-sized pharmaceutical companies to guide drug development at every phase, was honored to welcome The Hon. Anoulack Chanthivong, New South Wales (NSW) Minister for Industry and Trade, to its Seoul office on May 19. The Minister’s visit highlights a deepening collaboration between South Korea and Australia in the field of clinical research and highlights the strategic importance of cross-border partnerships in advancing global drug development. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20250527294947/en/ Novotech, a globally recognized full-service clinical research organization (CRO) and scientific advisory company trusted by biotech and small- to mid-sized pharmaceutical companies to guide drug development at every phase, was honored to welcome The Hon. Anoulack Chanthivong,
LambdaTest Introduces Automation MCP Server to Revolutionize Test Failure Triaging27.5.2025 18:00:00 EEST | Press release
LambdaTest, a unified agentic AI and cloud engineering platform, has announced the launch of its Automation MCP Server, a breakthrough solution designed to simplify and accelerate the process of triaging test failures. By enabling direct integration between AI assistants and LambdaTest’s test execution data, the Automation MCP Server empowers developers and QA engineers to investigate and resolve issues faster, without leaving their integrated development environment (IDE). The Automation MCP Server offers a seamless interface within the IDE, allowing users to access and analyze real-time test data with ease. With intelligent root cause analysis, the MCP server can quickly identify the underlying reasons for test failures and take immediate action to fix the underlying code. This results in fewer debugging cycles and faster release times. The server also enhances automated testing workflows by enabling the generation of new test cases using real execution data. Developers can leverage
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom