Recent Study Finds Digital IDs Not Ready to Replace Physical Documents — Yet
11.6.2024 09:30:00 EEST | Business Wire | Press release
As innovative digital verification methods continue to emerge, the debate around their reliability and effectiveness is heating up. Yet, a recent study “The New Imperative: Digital IDs” commissioned by Regula reveals the lasting importance of physical identity documents. Despite digital advances, a high percentage of organizations worldwide still depend on physical documents for verification.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240610221791/en/
According to Regula's study, digital IDs will not replace physical documents in the near future. The majority of companies globally rely on automation and biometrics for remote identity verification. (Graphic: Business Wire)
Current state. Companies employ various methods for identity verification, as shown in a Forrester Consulting study commissioned by Regula. 46% of respondents verify documents manually, even in remote scenarios involving video interviews or passport scan submission. Some companies have automated this process (53%) or switched to more secure forms of user authentication such as biometrics (54%) or multi-factor authentication (49%). A significant number of companies (44%) use third-party services that also often count on physical documents for thorough identity checks.
The Forrester Consulting study suggests that, while innovative digital verification methods are evolving, physical identity documents remain indispensable, ensuring reliable and trustworthy identity verification across various regulatory environments.
The reliance on physical documents is more pronounced in industries where security demands are stringent, such as Aviation (63%) and Finance (44%). Organizations from countries with rigid regulatory frameworks, including the US (50%) and Germany (49%), also stay true to manual checks.
Barriers to widespread Digital ID adoption. One of the obstacles on the road to broad adoption of the Digital ID concept is the lack of a general legislative framework for this form of identity proofing. 74% of respondents underscore the necessity for global digital ID standards and legislation to ensure interoperability of such IDs across borders.
However, with varied regional perspectives on identity and privacy (71%) and the technological disparity between countries (70%)—which are also named among the concerns—agreeing on these standards will be challenging. To address these difficulties, the situation requires collaborative innovation from authorities, businesses, and players in the identity verification (IDV) market.
The unified approach will become a pivot for establishing a consistently high reliability rate for Digital ID and contributing to the evolution of the IDV market. Sooner or later, this process will begin, since 72% of surveyed stakeholders believe the integration of digital IDs helps develop a robust global digital economy.
“Digital ID represents a significant change in how we approach identity verification, offering a brand-new dimension to our existing frameworks. However, the introduction of Digital ID as it now stands will not lead to the disruption of the IDV market. There are many signals indicating the need for long-term support of current identification types. While countries can adopt the new approach at their own pace domestically, a global shift to Digital IDs must be ubiquitous. This transition is hampered by various obstacles associated with political and economic issues, as well as a lack of universal public recognition of the technology. Eventually, obtaining Digital IDs will likely require presenting physical passports or ID cards, at least during the initial issuance stage. Even after the appearance of a complete ICAO standard for Digital ID, its worldwide adoption and the development of such a system will take time, and may involve considerable costs. Until this happens, we are just beginning to research the potential of this novelty,” said Ihar Kliashchou, Chief Technology Officer at Regula.
You can download the complete study with all the details for free here.
More on the topic:
- 42% of companies globally are ready to implement Digital ID.
- EU Digital Identity Wallet: Exploring Its Current Potential.
- 9 Identity Verification Trends Shaping 2024 for Forward-Thinking Businesses.
About Regula
Regula is a global developer of forensic devices and identity verification solutions. With our 30+ years of experience in forensic research and the largest library of document templates in the world, we create breakthrough technologies in document and biometric verification. Our hardware and software solutions allow over 1,000 organizations and 80 border control authorities globally to provide top-notch client service without compromising safety, security or speed.
Regula has been repeatedly named a Representative Vendor in the Gartner® Market Guide for Identity Verification.
Learn more at www.regulaforensics.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240610221791/en/
Contact information
Kristina – ks@regulaforensics.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 23:06:00 EET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 23:00:00 EET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 20:50:00 EET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 19:08:00 EET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 17:00:00 EET | Press release
ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent chip teams. ChipAgents is building the foundational AI infrastructure for chip design, with coordinated AI Agents that can plan, reason, execut
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
