Altium 365 Apps Now Available in AWS Marketplace for Collaborative, Secure Design of Electronics Hardware
3.9.2024 15:00:00 EEST | Business Wire | Press release
Altium, a global leader in electronics design systems, announced today that its Altium 365 cloud platform and its Secure Collaboration application are now both available in AWS Marketplace, a digital catalog with thousands of software listings from independent software vendors that make it easy to find, test, buy, and deploy software that runs on Amazon Web Services (AWS).
Altium 365 brings a cloud-based suite of applications to enable the design and delivery of printed circuit boards (PCBs) and enables seamless collaboration across the electronics design and development process. Altium 365 applications allow design engineers, procurement professionals, system architects, IT administrators, and other stakeholders to work together in real-time, ensuring a faster, more efficient, more secure electronics design process. Secure Collaboration is the first application from the Altium 365 suite available in AWS Marketplace, enhancing the quality of electronics design collaboration by protecting valuable, proprietary designs with robust security. Secure Collaboration ensures that sensitive electronics design information remains protected as it moves through distributed teams, from concept to production.
AWS customers will now have access to Altium 365’s suite of applications directly within AWS Marketplace. They will be able to choose from a growing suite of Altium applications automating engineering design process management, ECAD connectivity, supply chain management, and data security, all within their AWS Marketplace account.
"We are thrilled to make our Altium 365 suite of applications available in AWS Marketplace," said Ananth Avva, VP and GM of Cloud Platform, Digital Industries, at Altium. "Workflows for electronics development must be centralized, secure, and adaptable to the rapid pace of innovation demanded by today’s electronics development teams. Now those innovators will be able to set their own pace with Altium 365 and use the Secure Collaboration application to work together confidently. This is the first of many apps we plan to launch in AWS Marketplace."
For more information on Altium and its Altium 365 cloud applications, please visit: altium365.com. To purchase the Secure Collaboration application on AWS visit: https://aws.amazon.com/marketplace/pp/prodview-xpaerlwievwyi?sr=0-1&ref_=beagle&applicationId=AWSMPContessa
About Altium
Altium Limited, a part of the Renesas Group, is a global software company headquartered in San Diego, California, accelerating the pace of innovation through electronics. For over 30 years, Altium has been delivering software that maximizes the productivity of PCB designers and electrical engineers. From individual inventors to multinational corporations, more PCB designers and engineers choose Altium software to design and realize electronics-based products.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240903062339/en/
Contacts
Christina Murphy, Altium
Senior Director, Corporate Marketing and Communications
christina.murphy@altium.com or pr@altium.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
www.businesswire.com

Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
BOCHK and Ant International Forge Strategic Partnership to Enhance Cross-border Payment Connectivity and Innovative Corporate Financial Service Solutions Through Fintech20.8.2026 09:00:00 EEST | Press release
Ant International and Bank of China (Hong Kong) (“BOCHK”) announced that the two parties have forged a strategic partnership. Leveraging BOCHK’s banking strengths and Ant International’s leading fintech and AI technologies, the two parties seek to explore the frontier of AI-driven innovative financial services, empower real-time treasury management and cross-border payments, deliver efficient and intelligent liquidity management and financial service solutions for global enterprises, while continuously enhancing financial services for small and medium-sized enterprises (“SMEs”). This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260819555366/en/ From left to right: Kelvin Li, General Manager of Platform Tech and Senior Vice President of Ant International, Eric Jing, Chairman of Ant International, Sun Yu, Vice Chairman and Chief Executive of BOCHK, and Wang Huabin, Deputy Chief Executive of BOCHK Sun Yu, Vice Chairman and Chief E
Ant International’s FalconTST Model 2.0 Achieves SOTA, Elevating Predictive AI Application in Finance to New Levels20.8.2026 04:55:00 EEST | Press release
Ant International has introduced Falcon Time-Series Transformer (TST) AI Model 2.0, its most advanced TST model so far designed to deliver more accurate forecasting in real-world FX risk management of cross-border payments, with more industry applications to come, such as demand forecasting for supply chain management for e-commerce platforms, and predictive operations management for aviation industry. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260819055561/en/ Falcon TST Time-Series Transformer Al Model 2.0 FalconTST 2.0 demonstrates State-of-the-Art (SOTA) performance on the Mean Absolute Scaled Error (MASE) metric on a top global public evaluation benchmark for time-series foundational models. MASE is among the most critical metrics used to evaluate time-series models. FalconTST 2.0 achieved a MASE score of 0.666 and places it at the top of the leaderboard, surpassing other TST foundational models from leading global
Grid Dynamics Earns MACH Alliance's 2026 Agent Ready Award for Production-Scale Agentic AI19.8.2026 23:05:00 EEST | Press release
Grid Dynamics Holdings, Inc. (Nasdaq: GDYN) (“Grid Dynamics”), a premier AI transformation partner for the Fortune 1000, today announced it has earned MACH Alliance's 2026 Agent Ready Award, becoming one of 35 companies named in the program's inaugural cohort. Agent Ready is an advanced certification that builds upon MACH Certification, the MACH Alliance's baseline standard for open, composable, and connected technology. The honor recognizes certified members that have moved agentic AI from pilots and demos into production, at scale, with the guardrails enterprise deployment requires. Every award is independently reviewed by MACH Alliance, the vendor-neutral authority on scaling production-ready enterprise AI without vendor lock-in. For companies like Grid Dynamics, Agent Ready criteria evaluate organizational readiness at scale: named leadership, market presence, published thought leadership and production delivery. Grid Dynamics met that bar with agentic AI programs built and deliver
Xsolla Announces Multi-Year Strategic Partnership With the Good Game Club Podcast to Amplify Positive Stories From the Global Games Industry19.8.2026 19:10:00 EEST | Press release
Xsolla, a global video game commerce company, today announced a multi-year strategic partnership with Good Game Club, the independent, global podcast dedicated to sharing positive stories from the gaming ecosystem. The partnership builds on a broader effort to support the developers, publishers, and creators shaping the future of the games industry in a positive way by supporting good stories from the human side of video game businesses. The partnership spans the global events calendar, with joint podcast recordings planned each year at gamescom in Cologne and the Game Developers Conference (GDC) in San Francisco. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260819127662/en/ Graphic: Xsolla Xsolla and Good Game Club will collaborate on recurring editorial segments and deep-dive episodes exploring studios and stories from every corner of the industry, from up-and-coming teams to mid-tier and established developers. The coll
KAGA FEI Expands Its Software-Embedded Bluetooth Low Energy Module Lineup with ES4L15MA1 and EC4L15MA119.8.2026 17:00:00 EEST | Press release
KAGA FEI Co., Ltd., a global provider of advanced short-range wireless modules, announced today the development of the ES4L15MA1 and EC4L15MA1 Bluetooth Low Energy modules with embedded software for wireless communication. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260802953307/en/ ES4L15MA1 (left) and EC4L15MA1 (right) sample modules These products are versions of KAGA FEI’s ES4L15BA1 and EC4L15BA1 wireless modules with embedded software, which use Nordic Semiconductor’s nRF54L15. Because the modules include the functions required for Bluetooth Low Energy communication, device manufacturers can develop products in a shorter period without having to develop wireless communication software from scratch. The modules help reduce software development workloads, shorten product development cycles, and lower development costs for a wide range of IoT devices. The need for wireless connectivity in IoT applications is growing acr
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom