Quectel Expands IoT Wi-Fi and Bluetooth Module Portfolio, Boosting Speed and Cost Efficiency for Faster Time-to-market
7.10.2024 18:00:00 EEST | Business Wire | Press release
Quectel Wireless Solutions, a global IoT solutions provider, today announced the introduction of three additional short-range modules to its portfolio. The modules are the FC30R, a cost-effective, industrial-grade Wi-Fi module; the FCU743R, featuring Wi-Fi 4 and Bluetooth 5.2 capabilities; and the FCM740D, an MCU with Wi-Fi 4 and Bluetooth 5.2. These modules enable customers to bring IoT devices to market more cost-effectively and with faster time to market.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20241007406027/en/
Quectel expands IoT Wi-Fi and Bluetooth module portfolio, boosting speed and cost efficiency for faster time-to-market. (Photo: Business Wire)
“We’re constantly striving to provide our customers with the strongest possible portfolio across the Quectel product range,” commented Norbert Muhrer, President and CSO, Quectel Wireless Solutions. “The inclusion of these modules expands the range of options in our short-range portfolio for customers' IoT applications, empowering them to innovate in their IoT device designs and accelerate their time to market.”
The FC30R is an ultra-compact, cost-effective industrial-grade Wi-Fi module that supports IEEE 802.11 b/g/n standards. Measuring just 12.0 mm × 12.0 mm × 2.1 mm, it is perfect for size-sensitive applications. It can be seamlessly integrated with Quectel 5G modules (RT620T series), 4G modules (EG25 series, AG35 series, EG95 series, EC21 series, EC25 series, EC20 series, EC200A series, EC200R series, EC300R-LA series), and other application processors (NXP, ST, TI, Ambarella, etc.), making it suitable for a wide range of M2M applications including EV chargers, mobile hotspots, on-board diagnostics (OBD), gateways and industrial PDAs.
The FCU743R is a USB interface, high-performance Wi-Fi 4 and Bluetooth 5.2 module that supports the 2.4 GHz and 5 GHz Wi-Fi bands and can realize high-speed, low-power WLAN wireless transmission with a maximum data transmission rate of up to 150 Mbps. With an ultra-compact size of 13.0 mm × 12.2 mm × 2.0 mm, the module is ideal for size-sensitive applications.
Surface-mount technology (SMT) makes FCU743R an ideal solution for durable and rugged designs and the low profile and small size of LCC package ensure that it can be easily embedded into size-constrained applications and provide reliable connectivity with these applications
The FCM740D is an MCU Wi-Fi 4 and Bluetooth 5.2 module, that boasts a high-performance processor with a frequency of up to 120MHz and supports IEEE 802.11b/g/n protocol and BLE 5.2. The module features built-in 256 KB SRAM and 2 MB/4 MB flash (optional), complies with WPA-PSK, WPA2-PSK and WPA3-SAE security standards. The FCM740D has an LCC + DIP form factor with an ultra-compact size of 20.3 mm × 15.8 mm × 2.7 mm, which optimizes the size and cost for customers.
With a variety of low-power modes and long connection keep-alive mechanisms, the module is perfect for smart home, industrial IoT, consumer electronics and other applications, especially home appliances, small-sized smart lighting and other applications and IoT devices with high temperature requirements, such as HVAC, dimmer, light strips, smart sockets.
Finally, two MCU Bluetooth modules, the HCM511S and HCM010S, are now available in additional variants with stronger transmit power and additional antenna options. The HCM511S-E now features 8 dBm transmit power and an RF coaxial connector and external pin antenna interface, while the HCM010S-E now offers a pin antenna, RF coaxial connector and optional PCB antenna.
Quectel’s IoT modules are developed with security at the core. From product architecture to firmware/software development, Quectel incorporates leading industry practices and standards, mitigating potential vulnerabilities with third party independent test houses and have incorporated security practices like generating SBOMs and VEX files as well as performing firmware binary analysis into the entire software development lifecycle.
Quectel will be exhibiting at MWC Las Vegas 2024. Schedule a meeting to find out more about the Quectel product range.
About Quectel
Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global IoT solutions provider backed by outstanding support and services. Our growing global team of 5,600 professionals sets the pace for innovation in cellular, GNSS, Wi-Fi and Bluetooth modules as well as antennas and services.
With regional offices and support across the globe, our international leadership is devoted to advancing IoT and helping build a smarter world.
For more information, please visit: www.quectel.com, LinkedIn, Facebook, and X.
View source version on businesswire.com: https://www.businesswire.com/news/home/20241007406027/en/
Contacts
Media contact: media@quectel.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
www.businesswire.com

Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Visa Receives Approval to Begin Preparations for a Domestic Business in China13.10.2026 07:11:00 EEST | Press release
Visa (NYSE:V), a global leader in digital payments, today announced that it has received approval of its Application to Prepare from the People’s Bank of China (PBOC), which allows the company to begin formal preparations to establish a domestic bankcard clearing institution in China. This marks an important milestone toward the company serving China’s domestic payments market. “The approval of our Application to Prepare marks a significant step forward in Visa’s long-standing commitment to China. We greatly appreciate the important role of the leaders of the United States and China in pursuing a constructive and strategically stable relationship between the world’s largest economies,” said Ryan McInerney, Chief Executive Officer of Visa. “For more than 40 years, Visa has been an active contributor to China’s dynamic payments landscape. We look forward to taking the necessary steps in the process, pursuant to the PBOC’s regulations, to begin operating domestically in China.” China is o
Lattice Delivers Industry-First PQC-Enabled Platform Firmware Resilience for AI Infrastructure with Lattice Sentry Solution Stack12.10.2026 23:00:00 EEST | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced the latest version of its Lattice Sentry™ solution stack (v5.0), the industry’s first post-quantum cryptography (PQC)-enabled Platform Firmware Resilience (PFR) and attestation solution. Extending Lattice's post-quantum cryptography leadership from silicon to a complete platform security stack, Lattice Sentry now delivers CNSA 2.0-aligned, NIST-compliant protection across AI data centers, and critical infrastructure, giving system designers a validated, production-ready path to quantum-resistant security. Lattice Sentry extends the company’s PQC leadership, combining the industry's first CNSA 2.0-compliant FPGA portfolio with AMI's platform management software to deliver a complete, integrated platform security solution. “AI infrastructure and the threat landscape are evolving rapidly. Platform firmware has become a primary attack vector, and the quantum era will upend decades
Cooler Master Expands End-to-End Cooling Solutions for AI Infrastructure12.10.2026 20:00:00 EEST | Press release
Cooler Master, a global leader in digital infrastructure cooling solutions, has outlined its end-to-end cooling portfolio for AI infrastructure, designed to support high-density computing deployments in new data centers and existing facilities expanding AI capacity. Anchored by a 2,500 kW Liquid-to-Liquid In-Row Coolant Distribution Unit (CDU), the portfolio spans facility-level heat transfer, rack and server cooling, and the equipment used to prepare liquid cooling systems for operation. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012102572/en/ “Customers need choices that bring fast time-to-market, flexibility, and scalability for the deployment of their facilities,” said Thomas Chen, CEO at Cooler Master Corporation. “We aim to help them put liquid cooling to work, whether that means retrofitting an existing data center or building a new site. That requires comprehensive plans about how the equipment being assembled
GigaDevice Deepens Ecosystem Collaboration with LVGL to Advance GD32’s Global Open-Source GUI Ecosystem12.10.2026 16:00:00 EEST | Press release
GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, is deepening its ecosystem collaboration with LVGL. LVGL's Open graphics library is one of the world’s most widely‑adopted open‑source embedded frameworks. Eight GD32 MCU product families have now been officially included in the LVGL ecosystem, providing developers worldwide with more convenient and efficient support for embedded graphics development. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012320702/en/ Eight GD32 product series supported on LVGL website LVGL is an open-source graphical user interface framework designed for embedded devices, commercially supported by LVGL Ltd., a technology company based in Cambridge, UK. Lightweight, efficient, and cross-platform, it can be widely used in applications such as smart home devices, industrial control systems, consumer electronics, a
W. L. Gore & Associates Launches GORE® Battery Vents – MultiVent Series at the Battery Show12.10.2026 15:00:00 EEST | Press release
Today, W. L. Gore & Associates (Gore) introduced GORE® Battery Vents – MultiVent Series at The Battery Show North America 2026, a new integrated venting architecture that combines all three functions into a single device. Designed for lithium-ion battery packs in electric vehicles and energy storage systems, GORE® MultiVent is an integrated battery vent: one device that equalizes pressure, protects against moisture and evacuates gas during thermal runaway, then reseals. It gives pack designers an alternative to combining dual-stage vents, separate evacuation valves and desiccants. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012625188/en/ GORE® MultiVent GORE MultiVent builds on technology Gore acquired from Vernay Laboratories in 2026 and combines Gore membrane expertise with Vernay’s advanced valve technology. Battery pack designers have traditionally relied on multiple components to manage pressure equalization, mois
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom