ADVA leads project to create market’s most advanced optical transceiver chiplets
24.9.2019 10:00:00 EEST | Business Wire | Press release
ADVA (FSE: ADV) today announced that it’s leading a three-year initiative to create the industry’s most advanced optical transceiver chiplets. The chiplets will be key to tackling urgent bandwidth needs by enhancing density, flexibility and efficiency in data center interconnect (DCI) networks. The project entitled “Photonic Embedding of Active Region Laser chips in Silicon (PEARLS)” aims to integrate quantum-dot lasers onto silicon-based electro-photonic integrated circuits (ePICs). By combining silicon photonics, BiCMOS electronics and lasers on a single chip, the size and cost of optical transceivers can be dramatically reduced. The three-year project involves a consortium comprising ADVA, FormFactor, Fraunhofer IZM, IHP, IHP Solutions, Sicoya, Technion and the University of Kassel.
“With this project we’re taking integration and compact design to new levels. By squeezing more technology onto a single chip than ever before, we’re creating a platform for miniaturized optical transceivers able to deliver the space and bandwidth density needed for tomorrow’s DCI networks,” said Jörg-Peter Elbers, SVP, advanced technology, ADVA. “PEARLS not only paves the way for a new generation of intra-data center transceivers, but also facilitates more compact and cost-effective integrated coherent transmitter-receiver optical sub-assemblies (IC-TROSAs) for inter-data center applications.”
The PEARLS project is funded by Germany’s Federal Ministry for Education and Research (BMBF). Its multi-disciplinary engineering team is aiming to take a silicon-based electro-photonic chip platform – which offers monolithic integration of electronics and photonics as already proven in the ADVA-led SPEED project – and extend it to incorporate a third key element: Nanotechnology lasers will be added to the chip, saving space and reducing energy consumption compared to off-chip approaches. This will be achieved with quantum dots just a few nanometers in size. Able to withstand extreme temperatures, they facilitate wafer-scale integration without the need for a thermo-electric cooler or a hermetic package.
“Within this very exciting project, IHP will develop the technology platform. Together we’re breaking new ground and laying the foundations for the next generation of low-energy, space-efficient optical transceivers,” commented Bernd Tillack, managing director, IHP GmbH. “The PEARLS project will pave the way for optical transceiver chiplets – modular transceiver chips with an unprecedented level of optical and electronic integration. Built on top of a standard BiCMOS process flow, the new technology will also be a major step forward for sustainable DCI networking.”
About ADVA
ADVA is a company founded on innovation and focused on helping our customers succeed. Our technology forms the building blocks of a shared digital future and empowers networks across the globe. We’re continually developing breakthrough hardware and software that leads the networking industry and creates new business opportunities. It’s these open connectivity solutions that enable our customers to deliver the cloud and mobile services that are vital to today’s society and for imagining new tomorrows. Together, we're building a truly connected and sustainable future. For more information on how we can help you, please visit us at www.adva.com.
Published by:
ADVA Optical Networking SE, Munich, Germany
www.adva.com
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20190924005089/en/
Contact information
For ADVA press:
Gareth Spence
t +44 1904 699 358
public-relations@adva.com
For ADVA investors:
Stephan Rettenberger
t +49 89 890 665 854
investor-relations@adva.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Access Advance Welcomes Meta Platforms, Inc. and Alibaba Group to the Video Distribution Patent Pool3.7.2026 02:00:00 EEST | Press release
Access Advance LLC today announced that Meta Platforms, Inc., one of the world's largest distributors of video content across its Facebook, Instagram, Threads, and WhatsApp services, has joined the Video Distribution Patent Pool (VDP Pool) as a Licensee. Meta also joined both the HEVC Advance and VVC Advance pools as a Licensee. Alibaba Group, whose video infrastructure spans a wide range of video-based services across e-commerce, entertainment, and digital media platforms, was also announced as a VDP Pool Licensee this week. Meta and Alibaba joining the VDP Pool further reinforces the program’s market leading position in resolving the licensing issues around the use of modern video codecs, including VP9, AV1, HEVC and VVC, across all the diverse business models of internet video streaming. "A significant U.S.-based company like Meta joining as a Licensee is a milestone moment for the content distribution business and the VDP Pool," said Peter Moller, CEO of Access Advance. "Meta reach
Kioxia Commences Sample Shipments of 10th-Generation BiCS FLASH™ Devices Delivering High Performance, High Capacity and Low Power Consumption3.7.2026 02:00:00 EEST | Press release
Kioxia Corporation, a world leader in memory solutions, today announced that it has commenced sample shipments of 1Tb (terabit) Triple-Level-Cell (TLC) memory devices utilizing its 10th-generation BiCS FLASH™ 3D flash memory technology.1 These will be primarily integrated into the company’s enterprise and data center SSDs, strengthening Kioxia’s lineup to meet the growing demand for AI storage, which requires higher performance, higher capacity, and lower power consumption. These new products will be manufactured using state-of-the-art equipment at Kioxia’s Kitakami Plant Fab2 facility in Iwate Prefecture, Japan. By leveraging innovative CMOS directly Bonded to Array (CBA) technology2 and On-Pitch Select Gate Drain (OPS) technology,3 both adopted since the 8th-generation BiCS FLASH™, the 10th-generation technology achieves a NAND interface speed of 4.8 Gb/s,4 a 33% improvement over the 8th generation. Bit density has increased by 59% by stacking 332 layers and improving lateral density
Bending Spoons S.p.A. announces closing of initial public offering2.7.2026 21:35:00 EEST | Press release
Bending Spoons S.p.A. (“Bending Spoons”), a leading technology company, today announces the closing of its initial public offering of an aggregate of 57,971,015 of its ordinary shares, at an initial public offering price of $29.00 per share. The offering consisted of 34,398,640 shares sold by Bending Spoons and 23,572,375 shares sold by certain selling shareholders (the “Selling Shareholders”). The gross proceeds from the offering to Bending Spoons, before deducting underwriting discounts and commissions and other offering expenses, was approximately $953,917,285.50. Bending Spoons did not receive any proceeds from the sale of shares by the Selling Shareholders. Bending Spoons’ ordinary shares began trading on the Nasdaq Global Select Market on July 1, 2026 under the ticker symbol “BSP”. Goldman Sachs International, J.P. Morgan, and Allen & Company LLC are acting as joint lead book-running managers for the offering. Wells Fargo Securities, BofA Securities, Jefferies, Evercore ISI, BNP
Strategic Partnership Between Record Asset Management and Admicasa2.7.2026 20:00:00 EEST | Press release
RAM Swiss Holding AG is a subsidiary of LSE-listed Record Financial Group (Record) and part of the Record Asset Management (RAM) group of companies. The partnership is a milestone in the growth of Admicasa and marks an important step in the continued expansion of Record’s private markets platform. Subject to regulatory approval, the agreement, signed on 1st July 2026, provides RAM Swiss Holding AG with a 50% participation in the Admicasa Fondsleitung AG, part of Admicasa, and establishes a long-term partnership to develop investment opportunities in the Swiss and Global real estate market with a plan to expand into other asset classes in the medium term. RAM is the European asset management arm of Record, the LSE-listed specialist investment group managing USD 115 billion of assets on behalf of institutional clients worldwide. Record's client base comprises pension funds, foundations, sovereign institutions and other asset managers, with whom it has built long-standing relationships th
IQM Quantum Computers Becomes First European Quantum Computing Company Listed on a Major U.S. Exchange2.7.2026 17:47:00 EEST | Press release
IQM Quantum Computers (Nasdaq: IQMX) (“IQM”, “IQM Quantum Computers” or the “Company”), a global leader in full-stack superconducting quantum computers, today became a publicly traded company following the completion of its business combination with Real Asset Acquisition Corp. (“RAAQ”). This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702960460/en/ IQM Quantum Computers Becomes First European Quantum Computing Company Listed on a Major U.S. Exchange The company’s American Depositary Shares begin trading today on the Nasdaq Global Select Market under the ticker symbol “IQMX”. The listing marks a major milestone for IQM establishing the company as the first European quantum computing company listed on a major U.S. stock exchange. Due to the proceeds of the transaction, IQM maintains a strong pro forma cash position of EUR 337 million. IQM enters the public markets with strong commercial momentum and a rapidly expanding globa
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
