Business Wire

Boomi Named a Leader in IDC MarketScape: Worldwide Cloud Integration Software and Services (iPaaS) 2023 Vendor Assessment

27.2.2023 17:20:00 EET | Business Wire | Press release

Share

Boomi TM, the intelligent connectivity and automation leader, today announced that Boomi has been positioned as a Leader in the IDC MarketScape: Worldwide Cloud Integration Software and Services (iPaaS) 2023 Vendor Assessment (doc #US50244723, February 2023). The inaugural IDC MarketScape study assesses the cloud integration software and services (also referred to as iPaaS) market among 12 select vendors and evaluates the strengths of their offerings.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230227005164/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

Boomi named a Leader in Cloud Integration Software and Services by IDC MarketScape (Graphic: Business Wire)

According to the report, “Integration is a foundational connectivity automation technology that not only unlocks immediate business benefits but also replaces technical debt that was previously used to connect applications, making it easier to replace outdated legacy applications.”

The report notes, “As one of the original cloud-based integration tools, Boomi has considerable experience solving on-premises and multicloud integration scenarios and older protocols, as well as connecting to [software as a service] SaaS applications. Boomi has more connectors than any other integration provider evaluated, some of which can be modified, although some are at an additional cost.”

The report also notes, “Customers report strong satisfaction with Boomi, as evidenced by strong renewal rates from existing customers. Still, Boomi has significantly invested in improving the operational alignment of the customer success and experience teams, adding resources to further improve customer satisfaction.” Additionally, the report states, “As one of the founders of cloud integration, Boomi has a strong track record of providing integration solutions to businesses of multiple sizes and in many regions and industries. The [Boomi] AtomSphereTM Platform includes an API management platform with key protocols supported as well as support for event-based integration. In addition, it offers a large library of connectors intended to help customers quickly build connections between applications.”

“As a founder and innovator in cloud integration, with the largest customer base among integration platform vendors, we’re proud to be recognized by the IDC MarketScape as a Leader in its first report covering this space,” said Ed Macosky, Chief Innovation Officer at Boomi. “This latest achievement builds on our numerous industry accolades and further validates our expertise in integration and intelligent automation. As businesses continue to embrace cloud technologies and digital transformation strategies, low-code integration solutions will be more important than ever to help organizations break down data silos, improve operational efficiency, reduce costs, and confidently leverage cutting-edge technologies to drive success.”

The Boomi AtomSphere Platform empowers organizations to instantly connect everyone to everything, anywhere. From effortlessly connecting SaaS applications to enabling real-time data sharing between multiple sources, Boomi’s cloud integration platform provides the speed, scalability, and reliability needed to transform an organization’s digital landscape by driving greater efficiency and automation across all its systems. Organizations that rely on Boomi enjoy rapid time-to-value with quick deployment and low upfront costs.

Boomi touts a growing community of more than 100,000 members and one of the largest arrays of GSIs in the iPaaS space. The company boasts a worldwide network of approximately 800 partners, including Accenture, Deloitte, SAP, and Snowflake; and works with the largest hyperscaler cloud service providers, including Amazon Web Services, Google, and Microsoft, among others.

Included on the Deloitte Technology Fast 500™ and Inc. 5000 lists as one of America’s fastest growing technology companies, Boomi has also won two International Stevie® Awards, for Company of the Year and Product Innovation; the Gold Globee® Award in the Platform as a Service (PaaS) category; the Merit Award for Technology in the Cloud Services category; the Stratus Award as a Global Leader in Cloud Computing 2022, and received the prestigious 5-star rating in the CRN Partner Program Guide, a definitive list of the most notable programs from industry-leading technology vendors that provide innovative products and flexible services through the IT channel.

Additional Resources

About IDC MarketScape

IDC MarketScape vendor assessment model is designed to provide an overview of the competitive fitness of ICT (information and communications technology) suppliers in a given market. The research methodology utilizes a rigorous scoring methodology based on both qualitative and quantitative criteria that results in a single graphical illustration of each vendor’s position within a given market. IDC MarketScape provides a clear framework in which the product and service offerings, capabilities and strategies, and current and future market success factors of IT and telecommunications vendors can be meaningfully compared. The framework also provides technology buyers with a 360-degree assessment of the strengths and weaknesses of current and prospective vendors.

About Boomi

Boomi aims to make the world a better place by connecting everyone to everything, anywhere. The pioneer of cloud-based integration platform as a service (iPaaS), and now a category-leading, global software as a service (SaaS) company, Boomi touts the largest customer base among integration platform vendors and a worldwide network of approximately 800 partners – including Accenture, Capgemini, Deloitte, SAP, and Snowflake. Global organizations turn to Boomi’s award-winning platform to discover, manage, and orchestrate data, while connecting applications, processes, and people for better, faster outcomes. For more information, visit http://www.boomi.com.

© 2023 Boomi, LP. Boomi, the ‘B’ logo, Boomiverse, and AtomSphere are trademarks of Boomi, LP or its subsidiaries or affiliates. All rights reserved. Other names or marks may be the trademarks of their respective owners.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

Contact information

Kristen Walker
Global Corporate Communications
kristenwalker@boomi.com
+1-415-613-8320

About Business Wire

For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Westlake Epoxy Expands Distribution Relationship with Brenntag to India18.2.2026 03:30:00 EET | Press release

Westlake Corporation (NYSE: WLK) today announced that Westlake Epoxy will expand its long‑standing distribution relationship with Brenntag to South and West India. The agreement builds on a successful collaboration across Europe, North and South America, and Southeast Asia, extending Westlake Epoxy’s reach into one of the world’s fastest‑growing coatings, adhesives and construction markets. Under the expanded collaboration, Brenntag will distribute Westlake Epoxy’s established portfolio of epoxy solutions for coatings, adhesives and construction applications, including the EPON™, EPIKOTE™, EPIKURE™ and EPI‑REZ™ product lines. Customers are expected to benefit from reliable local supply, technical service and application‑focused formulation support tailored to regional requirements. India’s coatings, adhesives and construction sectors continue to grow, driven by infrastructure investment, urbanization and increasing performance expectations. By combining Westlake Epoxy’s proven epoxy te

Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 23:06:00 EET | Press release

Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana

Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 23:00:00 EET | Press release

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp

Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 20:50:00 EET | Press release

Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve

ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 19:08:00 EET | Press release

ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye