Boyd Corporation Acquires Siltec, Continues to Expand Global Material Science Portfolio
21.10.2021 09:00:00 EEST | Business Wire | Press release
Boyd Corporation, a world-leading innovator of technologies in engineered materials and thermal management, today announced the acquisition of Siltec, a Weiler, Germany-based specialist in silicone compounding for custom products in the highly-regulated medical industry. The acquisition deepens and diversifies Boyd’s material science portfolio and further expands its European footprint.
“Siltec’s dedicated team of scientists and technologists enhance Boyd competencies in silicone material science and the medical industry. We’ll leverage this expertise to accelerate innovation across Boyd’s material portfolio and adjacent high growth markets like industrial technology, eMobility and cloud data center where customers need high temperature resistant and durable solutions,” stated Boyd CEO Doug Britt.
Boyd continues to invest in value-driven innovation and technology to create marketable differentiation for its customers. The addition of silicone compounding expertise further bolsters Boyd’s deep material science knowledge and expands its custom engineered material manufacturing optimized to balance high performance, sustainability, and lean manufacturing. Boyd’s robust global manufacturing footprint, design expertise, and rapid prototyping helps customers accelerate time to market, enhance global agility, and improve regional responsiveness.
“We’re excited to add talented staff, additional operations, and new customers in Europe, a region where we’re deeply committed to drive continued growth. Siltec’s manufacturing expands our presence in Germany and the Czech Republic,” said Boyd European Managing Director Joop Ruijgrok.
About Boyd Corporation
Boyd Corporation is a world-leading innovator of technologies in material science, engineered materials, and thermal management that seal, protect, interface with, and cool our customers’ most critical applications. We embrace science to solve ambitious performance targets. Boyd architects material innovation, combining technologies in novel ways to redefine the possible. We gain unparalleled technology insight solving complex challenges across the leading industries we serve. Our solutions maximize performance in 5G infrastructure and the world’s most advanced data centers; enhance reliability and extend range for electric and autonomous vehicles; advance the accuracy of cutting-edge personal healthcare and diagnostic systems, enable performance critical aircraft and defense technologies; and accelerate innovation in next-generation electronics and human-machine-interface. Core to Boyd’s global, large-scale manufacturing is a deep commitment to protect the environment with sustainable, lean operations that reduce waste and minimize carbon footprint.
Visit us at www.boydcorp.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20211020005775/en/
Contact information
Amie Jeffries
Boyd Corporation
amie.jeffries@boydcorp.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Hexagon Semi’s HX77 AR Display Processor Achieves Ultra-Low Power Consumption with VeriSilicon’s Nano IP Portfolio10.3.2026 02:00:00 EET | Press release
VeriSilicon (688521.SH) today announced that Hefei Hexagon Semiconductor (Hexagon Semi), an image processing SoC provider, has adopted VeriSilicon’s proven IP portfolio in its high-performance HX77 series image processing SoC. The adopted IPs include the GCNanoUltraV 2.5D Graphics Processing Unit (GPU) IP, DW100 DeWarp Processing IP, and DC9200Nano Display Processing IP. The SoC has successfully taped out, achieving a first-pass silicon success. The HX77 series is a highly integrated, low-power image processing SoC based on RISC-V architecture, integrating comprehensive video input/output interfaces, image processing, and system control capabilities. By leveraging an innovative heterogeneous computing architecture and sophisticated power management technology, HX77 has successfully achieved a technological breakthrough that enables 2K@60fps output with mere milliwatt-level power consumption. HX77 has also realized the 3DoF hover feature on end devices through spatial computing. In addi
Operio Group Named Distributor for Schaefer Technologies in the United Kingdom and European Union9.3.2026 23:00:00 EET | Press release
Operio Group has signed a distribution agreement with Schaefer Technologies, a manufacturer of semi-automatic encapsulation equipment. Operio Group, a holding company building a global group of brands serving the solid dose manufacturing industry, will be the official distributor of Schaefer Technologies’ products in the United Kingdom and the European Union. Schaefer Technologies develops semi-automatic capsule filling systems, including equipment that produces banded capsules for liquid and pellet formulations used by nutraceutical and pharmaceutical manufacturers. Leadership from both companies worked together to establish the agreement, including Kevin Schaefer, CEO of Schaefer Technologies Inc., and Alastair Sanderson, Chief Business Development Officer at Operio Group. “Schaefer Technologies is looking forward to our new relationship with Operio Group,” said Schaefer. “Their understanding of the pharmaceutical equipment market makes them a strong partner as we combine our experti
Kinaxis Goes All-In on Innovation at Upcoming Kinexions in Las Vegas9.3.2026 20:00:00 EET | Press release
Registration is officially open for Kinexions North America, the premier global supply chain orchestration conference hosted by Kinaxis® Inc. (TSX: KXS). Taking place June 1–3 in Las Vegas, Nevada, the event brings together supply chain leaders, innovators and practitioners from around the world to explore how organizations can leverage AI-driven strategies and technologies to connect data, people and decisions. After a year defined by market volatility, geopolitical risk and disruption, this year’s conference will focus on how intelligent supply chain orchestration enables organizations to move beyond reactive planning to building true enterprise adaptability. The program promises to be the most immersive and future-forward Kinexions yet, with renowned author, entrepreneur and innovation expert, Peter Hinssen confirmed as a featured keynote address. “Kinexions has always been the place where the best in supply chain come together to calibrate and share ideas, rethink what’s possible a
Radial Selects Riskified to Power Payment Fraud and Refund/Return Protection for Merchant Client Portfolio9.3.2026 16:00:00 EET | Press release
Riskified (NYSE: RSKD), a leader in ecommerce fraud and risk intelligence, today announced a strategic partnership with Radial, a leading 3PL set to become Paxon later this year. Radial will integrate with Riskified’s AI-powered platform to help its merchants approve more legitimate orders and reduce losses from payment fraud, including many merchants that use Shopify as their ecommerce platform. Radial supports many of the world’s most recognized retail brands with a global ecommerce fulfillment network of more than 20 centers across North America, helping merchants deliver orders quickly and cost effectively. By bringing Riskified’s AI-powered fraud decisioning into its commerce ecosystem, Radial gives merchants the surgical ability to calibrate the checkout experience according to risk—without slowing fulfillment. This also supports brands seeking to expand into new markets. Riskified empowers Radial's customers with accurate, real-time fraud decisions at checkout, approving or decl
Andersen to Announce Fourth-Quarter and Full-Year 2025 Financial Results9.3.2026 16:00:00 EET | Press release
Andersen Group Inc. (NYSE: ANDG) (“Andersen”), a leading provider of independent tax, valuation and financial advisory services to individuals and family offices, businesses and funds in the United States, will announce its financial results for the full year and fourth quarter 2025 after the market closes on Tuesday, March 17, 2026. Andersen CEO and Chairman, Mark L. Vorsatz, and Andersen Chief Financial Officer, Neal Livingston, will host a conference call to discuss Andersen’s financial results on Tuesday, March 17, 2026 at 5PM ET. Participants can join the webcast at https://event.choruscall.com/mediaframe/webcast.html?webcastid=J3Hvslre. The webcast replay link will be archived on Andersen’s Investor Relations website at investor.andersen.com within a few hours of the event and will remain on the website for six months. About Andersen Andersen is a leading provider of independent tax, valuation and financial advisory services to individuals, family offices, businesses and alternat
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom