C3 AI Reinvents No Code AI with the Introduction of C3 AI Ex Machina
27.1.2021 17:00:00 EET | Business Wire | Press release
C3 AI (NYSE: AI), the world’s leading provider of enterprise AI software, today announced the general availability of C3 AI® Ex Machina, a next-generation predictive analytics application that empowers anyone to develop, scale, and produce AI-based insights without writing code.
Analysts, operators, and subject matter experts across all industries and business functions are increasingly required to develop predictive and prescriptive insights compiled from vast and disparate datasets. While there are many no-code tools available that lower the barrier for users to build ML models and perform data analysis, none provide end-to-end capabilities that enable them to capture and process the volume and variety of data required, automatically generate interpretable AI models, and productize, deploy, and scale the results across their company. Current predictive analytics tools are typically complicated to use and limit the ability of their insights to drive real business outcomes.
C3 AI Ex Machina is the only end-to-end, no-code predictive analytics solution that enables individuals, teams, and enterprises to:
- Rapidly and flexibly access and prep petabytes of disparate data with prebuilt connectors to data sources such as Snowflake, S3, ADLS, Databricks, and more.
- Build and manage AI models without writing code using an intuitive drag-and-drop interface supported by powerful AutoML.
- Drive company-wide results by seamlessly publishing predictive insights to enterprise systems or custom business applications.
- Scale cloud resources to meet needs in a modern, cloud-native application while only paying for resources used.
- Grow with confidence by integrating and expanding on the C3 AI Suite, the platform that powers billions of AI predictions for the world’s largest companies.
Con Edison’s data analysts use C3 AI Ex Machina to identify malfunctioning meters in near-real-time, realizing significant business value. "C3 AI Ex Machina empowers our analysts to easily harness all our data and assess reliability and safety risks. Our AMI Operations group recently used C3 AI Ex Machina to build predictive models that identified hazardous electric meters at risk of overheating. Using C3 AI Ex Machina, our business analysts are now able to evaluate near-real-time risk scores and immediately schedule prioritized field inspections,” said Chris Brownlee, Department Manager at Con Edison. “C3 AI Ex Machina has dramatically simplified and accelerated our ability to build and deploy machine learning models to address use cases that proactively identify risks and provide safer, more reliable service to our customers.”
C3 AI Ex Machina enables anyone to apply the power of predictive analytics to their business and play a role in the increasing digitization of company operations. The application allows users to solve a limitless range of complex use cases, including customer churn prevention, supplier delay mitigation, asset reliability prediction, and fraud detection – all supported by the robust platform enterprise AI capabilities of the C3 AI Suite.
“C3 AI Ex Machina enables anyone to combine their business expertise with no-code AI to deliver predictive insights that their company can take informed action against,” said C3 AI President and CTO Ed Abbo. “C3 Ex Machina offers a tried, tested, and proven path to rapid enterprise AI application development and deployment. It empowers anyone with subject matter expertise to significantly improve their organization’s ability to make timely and contextual data-driven decisions.”
Learn more about C3 AI Ex Machina and try the application at https://c3.ai/products/c3-ai-ex-machina/.
About C3 AI
C3 AI (NYSE:AI) is a leading provider of Enterprise AI software for accelerating digital transformation. C3 AI delivers a family of fully integrated products: C3 AI® Suite, an end-to-end platform for developing, deploying, and operating large-scale AI applications; C3 AI Applications, a portfolio of industry-specific SaaS AI applications; C3 AI CRM, a suite of industry-specific CRM applications designed for AI and machine learning; and C3 AI Ex Machina, a no-code AI solution to apply data science to everyday business problems. The core of the C3 AI offering is an open, model-driven AI architecture that dramatically simplifies data science and application development. Learn more at: www.c3.ai
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210127005302/en/
Contact information
C3 AI Public Relations
Edelman
Lisa Kennedy
415-914-8336
pr@c3.ai
Investor Relations
IR@C3.ai
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Westlake Epoxy Expands Distribution Relationship with Brenntag to India18.2.2026 03:30:00 EET | Press release
Westlake Corporation (NYSE: WLK) today announced that Westlake Epoxy will expand its long‑standing distribution relationship with Brenntag to South and West India. The agreement builds on a successful collaboration across Europe, North and South America, and Southeast Asia, extending Westlake Epoxy’s reach into one of the world’s fastest‑growing coatings, adhesives and construction markets. Under the expanded collaboration, Brenntag will distribute Westlake Epoxy’s established portfolio of epoxy solutions for coatings, adhesives and construction applications, including the EPON™, EPIKOTE™, EPIKURE™ and EPI‑REZ™ product lines. Customers are expected to benefit from reliable local supply, technical service and application‑focused formulation support tailored to regional requirements. India’s coatings, adhesives and construction sectors continue to grow, driven by infrastructure investment, urbanization and increasing performance expectations. By combining Westlake Epoxy’s proven epoxy te
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 23:06:00 EET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 23:00:00 EET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 20:50:00 EET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 19:08:00 EET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
