Digi International Launches Digi ConnectCore® 93 Integrated System-on-Module with Wi-Fi® 6 Connectivity
13.3.2023 10:00:00 EET | Business Wire | Press release
Digi International, (NASDAQ: DGII, www.digi.com), a leading global provider of Internet of Things (IoT) solutions, connectivity products and services, is proud to announce the launch and immediate availability of the wireless and highly power-efficient Digi ConnectCore® 93 system-on-module (SOM) platform — designed for a wide range of medical, industrial, smart energy, transportation and Internet of Things (IoT) applications.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230313005120/en/
Digi ConnectCore 93 System-on-Module Unveiled at Embedded World 2023 (Graphic: Business Wire)
Based on the new NXP® i.MX 93 processor, Digi ConnectCore 93 is an integrated SOM platform for industrial and commercial applications, designed to simplify the development of embedded products by incorporating the latest technology as well as complete lifecycle management with Digi ConnectCore Cloud Services. Features such as integrated memory, superior power management, wireless connectivity, advanced security, and the open-source software platform, Digi Embedded Yocto Linux® — enable manufacturers to introduce their products to market faster with minimized expenses and risks using pre-approved wireless connectivity, remote management and cloud integration.
"We are delighted to further expand the Digi ConnectCore® product line," said Steve Ericson, Vice President, OEM Solutions at Digi International. "The launch of Digi ConnectCore 93 underlines our continued commitment to providing advanced solutions that make it easier for original equipment manufacturers to develop secure and connected products, while also reducing the cost of prototyping and development."
Featuring up to two versatile and power-efficient Arm® Cortex®-A55 cores, with a Cortex-M33 core, AI/ML Arm Ethos U65 neural processing unit (NPU) and NXP PMIC for maximum power efficiency, Digi ConnectCore 93 offers flexible connectivity with integrated 802.11ax dual-band Wi-Fi 6 and Bluetooth® 5.2. The Digi SMTplus® form factor (40mm x 45mm) and industrial rating delivers outstanding reliability for a wide range of IoT applications.
With a strong focus on ensuring both security and long-term durability, Digi ConnectCore 93 also features the Digi TrustFence® security framework, enabling OEM developers to incorporate important security and data privacy functions into their products. Furthermore, the i.MX 93 processor has been designed for industrial applications and is backed by NXP's Product Longevity Program, ensuring it will remain accessible for a decade or more, delivering extended assistance and reassurance to its users.
For more information about Digi ConnectCore 93 including a full list of features, please visit https://www.digi.com/products/embedded-systems/digi-connectcore/system-on-modules/digi-connectcore-93.
About Digi International
Digi International (NASDAQ: DGII) is a leading global provider of IoT connectivity products, services, and solutions. It helps companies create next-generation connected products and deploy and manage critical communications infrastructures in demanding environments with high levels of security and reliability. Founded in 1985, Digi has helped customers connect more than 100 million things and counting. For more information, visit www.digi.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230313005120/en/
Contact information
Peter Ramsay
Global Results Communications
digi@globalresultspr.com
949.307.5908
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
IFF to Webcast Fireside Chat at Barclays Global Consumer Conference on Sept. 1018.8.2026 23:15:00 EEST | Press release
IFF (NYSE: IFF) today announced that Chief Executive Officer Erik Fyrwald will participate in a fireside chat at the Barclays Global Consumer Conference on Thursday, Sept. 10, 2026 at 945 a.m. ET. Investors may access the live webcast on the Company's website at ir.iff.com. For those unable to listen to the live webcast, a recorded version will be made available for replay. Welcome to IFF At IFF (NYSE: IFF), we make joy through science, creativity and heart. As the global leader in flavors, fragrances, and health and biosciences, we deliver groundbreaking, sustainable innovations that elevate everyday products—advancing wellness, delighting the senses and enhancing the human experience.Learn more at iff.com, LinkedIn, Instagram and Facebook. View source version on businesswire.com: https://www.businesswire.com/news/home/20260818490253/en/
Lehman Brothers Treasury Announces the Successful Sale of its Remaining Intercompany Claim against Lehman Brothers Holdings Inc.18.8.2026 22:15:00 EEST | Press release
In connection with its previously announced final wind-down, Lehman Brothers Treasury Co. B.V. in liquidation (“LBT”), through its U.S. counsel Herbert Smith Freehills Kramer (US) LLP, announced that its placement agent, Seaport Loan Products LLC, successfully closed the sale of LBT’s remaining $19.6 billion Class 4A intercompany claim against Lehman Brothers Holdings Inc. The net proceeds of the sale, together with certain available cash (but after deducting various sale-related and other administrative costs and expenses), will be used to fund a final distribution to the holders of LBT’s existing notes, after which such existing notes will be canceled and LBT shall be fully wound down. As a result, LBT will cease to exist. LBT expects the final distribution to occur in the course of October 2026 and the wind down to have been completed before the end of 2026. View source version on businesswire.com: https://www.businesswire.com/news/home/20260818004215/en/
GenBio AI Builds First World Model of the Human Cell18.8.2026 16:00:00 EEST | Press release
GenBio AI ('GenBio') is an AI for Science company co-founded by Nobel Laureate David Baker, leading AI scientist Eric Xing, and other prominent life science and artificial intelligence researchers from Stanford, Carnegie Mellon University, Mohamed Bin Zayed University of Artificial Intelligence, Harvard, Weizmann Institute, and other research institutions. Today, the company introduced AIDO Cell, its virtual cell world model — the first system capable of simulating a human cell, both in its natural state and in response to drugs and other interventions, across its full biological hierarchy, from DNA and RNA through protein to the whole-cell level. A Key First in Biological and Medical Sciences: Full-hierarchy virtual cell simulation has been widely identified as a key milestone in computational biology. Compared to the previous efforts by various research labs, AIDO Cell is the first to integrate the entire molecular-to-cellular spectrum into one continuous simulation. Using the system
Xsolla Partner Network Expands Verified Creator Partnerships and Unifies Campaign Management Ahead of gamescom 202618.8.2026 16:00:00 EEST | Press release
Xsolla, a global video game commerce company, today announced an expansion of the Xsolla Partner Network ahead of gamescom 2026 in Cologne, giving game developers a simpler, more reliable way to grow their games through creators. The creator platform now lives within Xsolla Publisher Account, where developers already run their business, with verified creator onboarding and a redesigned and unified campaign workflow. Flat-fee campaigns, a new guaranteed payment option alongside revenue share, and data-driven creator recommendations are coming soon. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260818140062/en/ Graphic: Xsolla Xsolla Partner Network gives developers one place to launch, manage, track, and report on creator campaigns while Xsolla handles payments, payouts, taxes, and compliance. Verified creators, less guesswork. Automated anti-fraud vetting and identity verification at payout means developers partner with rea
KOCCA to Showcase 13 Korean Game Companies at ‘Gamescom 2026’ with PC, Mobile, and VR Lineups18.8.2026 15:48:00 EEST | Press release
The Korea Creative Content Agency (KOCCA) announced that 13 Korean game companies will gather under one roof at Gamescom 2026, Europe’s largest game show, held in Cologne, Germany, from August 26 to 28 (B2B, 09:00~20:00). Located in Booth Hall 3.2 C-050g–D051g, the Korea Joint Pavilion offers visitors hands-on experiences with an expansive lineup of titles, ranging from PC and mobile games to VR-powered titles across diverse genres. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260818271881/en/ KOCCA will bring 13 Korean game companies to Gamescom 2026 in Cologne, Germany (Image: KOCCA) The standout feature of this year’s joint pavilion is its overwhelming genre diversity. The lineup includes roguelike deckbuilders, visual novels, 2D shooters, rhythm action, and cooperative horror survival—catering to a broad spectrum of gamers—alongside immersive content that integrates AI and XR technology. Introducing the Participating T
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom