Digi International Launches Digi ConnectCore® 93 Integrated System-on-Module with Wi-Fi® 6 Connectivity
13.3.2023 10:00:00 EET | Business Wire | Press release
Digi International, (NASDAQ: DGII, www.digi.com), a leading global provider of Internet of Things (IoT) solutions, connectivity products and services, is proud to announce the launch and immediate availability of the wireless and highly power-efficient Digi ConnectCore® 93 system-on-module (SOM) platform — designed for a wide range of medical, industrial, smart energy, transportation and Internet of Things (IoT) applications.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230313005120/en/
Digi ConnectCore 93 System-on-Module Unveiled at Embedded World 2023 (Graphic: Business Wire)
Based on the new NXP® i.MX 93 processor, Digi ConnectCore 93 is an integrated SOM platform for industrial and commercial applications, designed to simplify the development of embedded products by incorporating the latest technology as well as complete lifecycle management with Digi ConnectCore Cloud Services. Features such as integrated memory, superior power management, wireless connectivity, advanced security, and the open-source software platform, Digi Embedded Yocto Linux® — enable manufacturers to introduce their products to market faster with minimized expenses and risks using pre-approved wireless connectivity, remote management and cloud integration.
"We are delighted to further expand the Digi ConnectCore® product line," said Steve Ericson, Vice President, OEM Solutions at Digi International. "The launch of Digi ConnectCore 93 underlines our continued commitment to providing advanced solutions that make it easier for original equipment manufacturers to develop secure and connected products, while also reducing the cost of prototyping and development."
Featuring up to two versatile and power-efficient Arm® Cortex®-A55 cores, with a Cortex-M33 core, AI/ML Arm Ethos U65 neural processing unit (NPU) and NXP PMIC for maximum power efficiency, Digi ConnectCore 93 offers flexible connectivity with integrated 802.11ax dual-band Wi-Fi 6 and Bluetooth® 5.2. The Digi SMTplus® form factor (40mm x 45mm) and industrial rating delivers outstanding reliability for a wide range of IoT applications.
With a strong focus on ensuring both security and long-term durability, Digi ConnectCore 93 also features the Digi TrustFence® security framework, enabling OEM developers to incorporate important security and data privacy functions into their products. Furthermore, the i.MX 93 processor has been designed for industrial applications and is backed by NXP's Product Longevity Program, ensuring it will remain accessible for a decade or more, delivering extended assistance and reassurance to its users.
For more information about Digi ConnectCore 93 including a full list of features, please visit https://www.digi.com/products/embedded-systems/digi-connectcore/system-on-modules/digi-connectcore-93.
About Digi International
Digi International (NASDAQ: DGII) is a leading global provider of IoT connectivity products, services, and solutions. It helps companies create next-generation connected products and deploy and manage critical communications infrastructures in demanding environments with high levels of security and reliability. Founded in 1985, Digi has helped customers connect more than 100 million things and counting. For more information, visit www.digi.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230313005120/en/
Contact information
Peter Ramsay
Global Results Communications
digi@globalresultspr.com
949.307.5908
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Westlake Epoxy Expands Distribution Relationship with Brenntag to India18.2.2026 03:30:00 EET | Press release
Westlake Corporation (NYSE: WLK) today announced that Westlake Epoxy will expand its long‑standing distribution relationship with Brenntag to South and West India. The agreement builds on a successful collaboration across Europe, North and South America, and Southeast Asia, extending Westlake Epoxy’s reach into one of the world’s fastest‑growing coatings, adhesives and construction markets. Under the expanded collaboration, Brenntag will distribute Westlake Epoxy’s established portfolio of epoxy solutions for coatings, adhesives and construction applications, including the EPON™, EPIKOTE™, EPIKURE™ and EPI‑REZ™ product lines. Customers are expected to benefit from reliable local supply, technical service and application‑focused formulation support tailored to regional requirements. India’s coatings, adhesives and construction sectors continue to grow, driven by infrastructure investment, urbanization and increasing performance expectations. By combining Westlake Epoxy’s proven epoxy te
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 23:06:00 EET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 23:00:00 EET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 20:50:00 EET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 19:08:00 EET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
