Business Wire

Digi International Launches Digi WAN Bonding, Delivering Bonded Gigabit Internet Speeds and Improved Connection Reliability

18.4.2023 19:30:00 EEST | Business Wire | Press release

Share

Digi International (NASDAQ: DGII), a leading global provider of Internet of Things (IoT) solutions, connectivity products and services, today announced the release of its latest value-added service — Digi WAN Bonding — to deliver true Gigabit speeds for dramatically enhanced network performance. This solution, which is fully integrated into the Digi technology stack, also dramatically improves Internet reliability and increases bandwidth for customers in the enterprise, industrial and transportation sectors.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230418006030/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

Digi International Launches Digi WAN Bonding, Delivering Bonded Gigabit Internet Speeds and Improved Connection Reliability (Graphic: Business Wire)

Available as an add-on value-added service to the industry-leading IoT device and network management platform, Digi Remote Manager® (Digi RM), Digi WAN Bonding leverages the edge intelligence of Digi Accelerated Linux (DAL) OS, Digi’s powerful Linux-based operating system. Digi WAN Bonding enables customers running DAL OS on their Digi devices to centrally configure, deploy, and manage the bonding together of multiple WAN connections. This WAN aggregation provides a sophisticated blend of increased throughput speeds, WAN smoothing, packet redundancy, and seamless failover for always-on Internet connectivity.

Digi WAN Bonding yields four key benefits:

  • Increased bandwidth: By combining multiple connections, WAN bonding can provide a higher total bandwidth than any single connection for video streaming or file sharing.
  • Increased speed: Additionally, combining multiple WAN links supports increased speed for one or multiple devices, up to 1 Gbps maximum.
  • Improved reliability: WAN bonding also improves the reliability of your bonded communication channels. If a connection fails, the others continue to provide service.
  • Reduced costs: WAN bonding can also reduce costs, for example enabling enterprises to obtain lower monthly rates for multiple connections.

Improved network performance is of extreme benefit to organizations requiring excellent speed and resiliency for data-intensive applications. These include video streaming to multiple media displays, vehicle cameras, and video conferencing. By providing customers with hot failover protection, this service ensures that if one WAN connection fails, the other connection takes over, thereby minimizing network downtime. Digi WAN Bonding also allows companies to take advantage of multiple ISPs, which can result in cost savings when businesses can negotiate better pricing and/or secure a provider that offers the best value for their specific needs.

“Organizations the world over are constantly searching for ways to boost network speed and reliability,” said Kinana Hussain, Vice President of Product Management for Digi International. “By fully integrating bandwidth bonding technology with Digi’s DAL OS and Digi Remote Manager, we’re able to provide businesses that rely on their network for critical operations with ultra-fast, ultra-reliable network performance and cost-efficient connectivity they very much want and need.”

Digi WAN Bonding — developed in collaboration with Bondix Intelligence — is distinct in that it allows for a maximum throughput speed of up to one Gigabit per second, compared to max speeds of 200 Mbps from other WAN bonding services.

“At Bondix, we’ve been thrilled to partner with Digi on rolling out our Bondix S.A.NE technology as an add-on service to Digi Remote Manager,” said Martin Santner, Director of Sales and Business Development for Bondix Intelligence. “This collaboration simplifies WAN aggregation, putting the mission-critical capabilities of WAN bonding into the hands of those who need it, enabling them to offer faster, better, more reliable connectivity when and where it matters.”

S.A.NE, which is short for Simple Aggregation of Networks, is proprietary software engineered by Bondix Technology to ensure reliable voice, video, and data transmission connectivity for mobile and stationary deployments alike.

For more information, visit https://www.digi.com/products/iot-software-services/digi-wan-bonding.

About Digi International

Digi International (NASDAQ: DGII) is a leading global provider of IoT connectivity products, services, and solutions. It helps companies create next-generation connected products and deploy and manage critical communications infrastructures in demanding environments with high levels of security and reliability. Founded in 1985, Digi has helped customers connect more than 100 million things and counting. For more information, visit www.digi.com.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

Contact information

Media Contact:
Peter Ramsay
Global Results Communications
digi@globalresultspr.com
949.307.5908

About Business Wire

For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Murata Begins Mass Production of Seven Automotive MLCCs with World-leading Capacitance for Their Rated Voltage and Size, Supporting Stable Operation of In-vehicle Systems and Greater Design Flexibility8.4.2026 05:00:00 EEST | Press release

Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) has begun mass production of seven AEC-Q200-qualified multilayer ceramic capacitors (MLCCs) that achieve the world’s largest capacitance for a given rated voltage and size*, supporting stable operation of in-vehicle systems and greater design flexibility. Five parts in the GCM series are rated at 2.5-4 Vdc, targeting IC peripheral circuits in advanced driver assistance systems (ADAS) and autonomous driving (AD) applications. The remaining two MLCCs are rated at 25 Vdc for in-vehicle power line applications. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260407486750/en/ [Murata Manufacturing Co., Ltd.] Seven automotive MLCCs In recent years, as ADAS and AD technologies advance, the number and performance level of systems installed in vehicles have continued to increase. As a result, demand for higher capacitance low-voltage MLCCs used around ICs has grown to e

Compass Pathways Announces New Employee Inducement Grants Under Nasdaq Listing Rule 5635(c)(4)7.4.2026 23:30:00 EEST | Press release

Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation in mental health, announced today that Compass granted equity awards under the Compass Pathways plc 2026 Inducement Plan to seven newly hired non-executive employees. The equity awards were granted on April 1, 2026 and consisted of options to purchase an aggregate of 117,445 shares and restricted share units or, in the case of employees in the United Kingdom nominal cost options, covering an aggregate of 55,875 shares. The options have an exercise price per share equal to $5.62, the closing price of the Company’s American Depositary Shares on the Nasdaq Global Select Market on the grant date, and will vest over a four-year period with 25% vesting on the first anniversary of the date of the grant and the remaining 75% vesting in equal monthly installments over the three-year period thereafter, subject to each employee’s continued employment. The restricted s

SLB OneSubsea and Subsea7 Sign Collaboration Agreement with PETRONAS Suriname7.4.2026 23:05:00 EEST | Press release

Global energy technology company SLB (NYSE: SLB) today announced the signing of a strategic collaboration agreement between PETRONAS Suriname E&P B.V. (“PETRONAS Suriname”), a subsidiary of PETRONAS and Subsea Integration Alliance, comprising SLB OneSubsea and Subsea7. This partnership aims to unlock resources in Suriname’s emerging frontier basin through innovative and cost-effective subsea solutions. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260331210557/en/ SLB OneSubsea has signed a strategic collaboration agreement between PETRONAS Suriname E&P B.V. (“PETRONAS Suriname”), a subsidiary of PETRONAS and Subsea Integration Alliance, comprising SLB OneSubsea and Subsea7. This partnership aims to unlock resources in Suriname’s emerging frontier basin through innovative and cost-effective subsea solutions. The agreement establishes a long-term framework for collaboration across the project lifecycle. This approach enables

Nadia Karkar Joins 500 Global as Managing Partner7.4.2026 20:43:00 EEST | Press release

500 Global today announced the appointment of Nadia Karkar as Managing Partner as the firm expands its global investment platform. Nadia’s appointment follows the recent announcement of the appointment of Atul Mehta — former Chief Investment Officer of the International Finance Corporation — to 500 Global's Board of Directors, and reflects the firm's continued build-out of the leadership and capabilities required to deliver on its next stage of global growth. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260407719214/en/ Nadia Karkar Joins 500 Global as Managing Partner Nadia joins from TPG Rise, the $31 billion impact investing platform of TPG Inc., where she most recently served as Head of Business Development, responsible for product innovation, strategic partnerships and corporate development. She played a central role in building TPG Rise Climate’s Global South Initiative, a blended finance vehicle designed to catalyze

Mouser Electronics Explores How Artificial Intelligence Shapes Everyday Technologies and Experiences7.4.2026 18:11:00 EEST | Press release

Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, today announced the first 2026 installment of its Empowering Innovation Together (EIT) technology series, Engineering AI for Daily Life. This installment explores how artificial intelligence is increasingly embedded in everyday products and services, from assisted search and messaging tools to healthcare wearables that monitor personal well-being. As AI capabilities expand across consumer and connected devices, engineers continue to design systems that make these technologies more useful, intuitive, and trustworthy in real-world applications. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260407524737/en/ This installment of Empowering Innovation Together explores how AI is increasingly embedded in everyday products and services, from assisted search and messaging tools to healthcare wearables

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye