Digi International Launches Digi WAN Bonding, Delivering Bonded Gigabit Internet Speeds and Improved Connection Reliability
Digi International (NASDAQ: DGII), a leading global provider of Internet of Things (IoT) solutions, connectivity products and services, today announced the release of its latest value-added service — Digi WAN Bonding — to deliver true Gigabit speeds for dramatically enhanced network performance. This solution, which is fully integrated into the Digi technology stack, also dramatically improves Internet reliability and increases bandwidth for customers in the enterprise, industrial and transportation sectors.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230418006030/en/
Digi International Launches Digi WAN Bonding, Delivering Bonded Gigabit Internet Speeds and Improved Connection Reliability (Graphic: Business Wire)
Available as an add-on value-added service to the industry-leading IoT device and network management platform, Digi Remote Manager® (Digi RM), Digi WAN Bonding leverages the edge intelligence of Digi Accelerated Linux (DAL) OS, Digi’s powerful Linux-based operating system. Digi WAN Bonding enables customers running DAL OS on their Digi devices to centrally configure, deploy, and manage the bonding together of multiple WAN connections. This WAN aggregation provides a sophisticated blend of increased throughput speeds, WAN smoothing, packet redundancy, and seamless failover for always-on Internet connectivity.
Digi WAN Bonding yields four key benefits:
- Increased bandwidth: By combining multiple connections, WAN bonding can provide a higher total bandwidth than any single connection for video streaming or file sharing.
- Increased speed: Additionally, combining multiple WAN links supports increased speed for one or multiple devices, up to 1 Gbps maximum.
- Improved reliability: WAN bonding also improves the reliability of your bonded communication channels. If a connection fails, the others continue to provide service.
- Reduced costs: WAN bonding can also reduce costs, for example enabling enterprises to obtain lower monthly rates for multiple connections.
Improved network performance is of extreme benefit to organizations requiring excellent speed and resiliency for data-intensive applications. These include video streaming to multiple media displays, vehicle cameras, and video conferencing. By providing customers with hot failover protection, this service ensures that if one WAN connection fails, the other connection takes over, thereby minimizing network downtime. Digi WAN Bonding also allows companies to take advantage of multiple ISPs, which can result in cost savings when businesses can negotiate better pricing and/or secure a provider that offers the best value for their specific needs.
“Organizations the world over are constantly searching for ways to boost network speed and reliability,” said Kinana Hussain, Vice President of Product Management for Digi International. “By fully integrating bandwidth bonding technology with Digi’s DAL OS and Digi Remote Manager, we’re able to provide businesses that rely on their network for critical operations with ultra-fast, ultra-reliable network performance and cost-efficient connectivity they very much want and need.”
Digi WAN Bonding — developed in collaboration with Bondix Intelligence — is distinct in that it allows for a maximum throughput speed of up to one Gigabit per second, compared to max speeds of 200 Mbps from other WAN bonding services.
“At Bondix, we’ve been thrilled to partner with Digi on rolling out our Bondix S.A.NE technology as an add-on service to Digi Remote Manager,” said Martin Santner, Director of Sales and Business Development for Bondix Intelligence. “This collaboration simplifies WAN aggregation, putting the mission-critical capabilities of WAN bonding into the hands of those who need it, enabling them to offer faster, better, more reliable connectivity when and where it matters.”
S.A.NE, which is short for Simple Aggregation of Networks, is proprietary software engineered by Bondix Technology to ensure reliable voice, video, and data transmission connectivity for mobile and stationary deployments alike.
For more information, visit https://www.digi.com/products/iot-software-services/digi-wan-bonding.
About Digi International
Digi International (NASDAQ: DGII) is a leading global provider of IoT connectivity products, services, and solutions. It helps companies create next-generation connected products and deploy and manage critical communications infrastructures in demanding environments with high levels of security and reliability. Founded in 1985, Digi has helped customers connect more than 100 million things and counting. For more information, visit www.digi.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230418006030/en/
Contact information
Media Contact:
Peter Ramsay
Global Results Communications
digi@globalresultspr.com
949.307.5908
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Deciphera Announces Oral Presentation of Positive Topline Results from Phase 2a Study of Sapablursen in Polycythemia Vera at the 67 th American Society of Hematology (ASH) Annual Meeting6.12.2025 16:30:00 EET | Press release
Deciphera Pharmaceuticals, a member of Ono Pharmaceutical Co., Ltd. (Headquarters: Osaka, Japan; President and COO: Toichi Takino; “Ono”), today announced the oral presentation of positive results from the Phase 2a IMPRSSION study of sapablursen in patients with polycythemia vera (PV) at the 67th American Society of Hematology (ASH) Annual Meeting, taking place December 6-9, 2025, in Orlando, FL. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251206361611/en/ The results were presented by Ionis Pharmaceuticals, who discovered and developed sapablursen and conducted the IMPRSSION study. In March 2025, Ionis and Ono entered into a license agreement in which Ono obtained exclusive global rights for the development and commercialization of sapablursen. “In the treatment of PV, phlebotomy and cytoreductive therapy are performed as treatments for preventing thrombosis. Phlebotomy is the most common treatment for PV, in which blood
Protagonist and Takeda Present Longer-Term Data at ASH 2025 Showing Rusfertide Delivers Durable Response and Hematocrit Control in Polycythemia Vera6.12.2025 16:30:00 EET | Press release
Protagonist Therapeutics, Inc. (“Protagonist”) (NASDAQ:PTGX) and Takeda (TSE:4502/NYSE:TAK) announce that new 52-week results from the pivotal Phase 3 VERIFY study evaluating rusfertide in patients with polycythemia vera (PV) will be presented in an oral presentation at the 67th American Society of Hematology (ASH) Annual Meeting and Exposition. These findings further reinforce rusfertide’s efficacy and safety and demonstrate durability of response, with 61.9% of patients continuously treated with rusfertide maintaining absence of phlebotomy eligibility from baseline to Week 52. “The 52-week data demonstrated the sustained efficacy of rusfertide, reducing the need for patients to receive phlebotomy while maintaining hematocrit control,” said Dr. Andrew T. Kuykendall, M.D., VERIFY Lead Investigator and Associate Member in the Department of Hematology at Moffitt Cancer Center. “The 32-week VERIFY primary results were already promising, and this deeper understanding of the durability of r
Vertex Presents New Data on CASGEVY ® , Including First-Ever Data in Children Ages 5-11 Years, at the American Society of Hematology Annual Meeting and Announces Plan for Global Regulatory Submissions6.12.2025 14:01:00 EET | Press release
Vertex Pharmaceuticals Incorporated (Nasdaq: VRTX) today announced data from multiple studies demonstrating the clinical benefits of CASGEVY® (exagamglogene autotemcel) in people ages 5 years and older living with severe sickle cell disease (SCD) or transfusion-dependent beta thalassemia (TDT). The results, including the first presentation of clinical data from pivotal studies in children ages 5-11 years, and longer-term data from the pivotal studies of people with severe SCD and TDT ages 12 years and older, will be presented at the American Society of Hematology (ASH) Annual Meeting. CASGEVY is currently approved for eligible people ages 12 years and older with SCD or TDT in the United States, Great Britain, the European Union, the Kingdom of Saudi Arabia, the Kingdom of Bahrain, Kuwait, Qatar, Canada, Switzerland and the United Arab Emirates. “These results — the first clinical data ever presented on any genetic therapy for children ages 5-11 years with SCD — again demonstrate the tr
Leading Global Scientists Gather at Tengchong Scientists Forum to Explore Innovative Pathways in Frontier Technologies6.12.2025 13:31:00 EET | Press release
The 2025 Tengchong Scientists Forum opened on Saturday in southwest China’s Yunnan Province, convening leading scientists and academic figures to examine innovation across frontier fields including artificial intelligence, biodiversity and quantum technology. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251205499197/en/ Opening ceremony of Tengchong Scientists Forum on 6th December, 2025 Notable participants include Nobel Physics laureate Konstantin Novoselov, Fields Medalist Efim Zelmanov and Turing Award winner Andrew Chi-Chih Yao, who join 127 academicians, 77 university presidents from China and abroad, over 400 scholars and more than 600 entrepreneurs and financiers. The gathering aims to deepen collaboration between cutting-edge research and industrial development. Under the theme “Science · AI changing the World,” the forum features ten sub-forums, academic sessions and thematic events supporting major cooperation p
Lattice Wins 2025 Global Semiconductor Alliance Award6.12.2025 01:49:00 EET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced that it was selected as ‘Most Respected Public Semiconductor Company’ at the 2025 Global Semiconductor Alliance (GSA) Awards. The GSA awards recognize companies that have demonstrated excellence through their success, vision, strategy, and future opportunities in the industry as determined by votes from GSA members. “We are honored to be recognized by the Global Semiconductor Alliance and our peers as one of 2025’s most respected public semiconductor companies. This recognition reflects the dedication of the Lattice team and the trust of our customers, partners, suppliers, and investors. Looking ahead, we remain laser-focused on driving innovation and strengthening our role as the trusted low power programmable leader for semiconductor and system solutions,” said Ford Tamer, Chief Executive Officer, Lattice Semiconductor. The annual GSA Awards celebrate the accomplishments of the semiconductor indu
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
