DNP Develops Interposer, a Primary Component in Next-Generation Semiconductor Packaging
7.12.2021 16:05:00 EET | Business Wire | Press release
Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) has developed an interposer, a high-performance intermediate device that electrically connects multiple chips and substrates. The interposer is expected to play a key role in next-generation semiconductor packaging.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20211207005066/en/
Layer Structure (Graphic: Business Wire)
DNP also has participated in Jisso Open Innovation of Tops 2 (JOINT2), targeting further functional developments for mass-production in 2024. JOINT2 is a consortium comprising 12 companies developing semiconductor packaging materials, substrates, and equipment. Showa Denko Materials Co., Ltd. is the managing company, and was selected for the Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems by the New Energy and Industrial Technology Development Organization (NEDO).
“Through cooperation with the other participating JOINT2 companies, DNP will accelerate the further functionality of the interposer as well as advance initiatives aimed at mass production in 2024. We will also promote the development of next-generation semiconductor packaging technology.” says Ryoichi Ohigashi of the Research and Business Development Center, DNP.
Background
The shift to higher functionality, greater speed and lower power consumption for semiconductor products requires miniaturization technology of semiconductor by using photo-lithography. It is said, however, that further miniaturization is rapidly approaching its limit, due to the complexity of the process and high costs. To overcome these challenges, the focus is on next-generation semiconductor packaging technology that improves processing speed by mounting multiple chips (e.g., CPUs, AI processors and memories) at high-densities, on the surface of an interposer.
Features
The interposer overcomes the issue of an increase in wiring resistance, and degradation of insulation resistance between the wirings, to achieve the high-performance necessary for leading edge semiconductor packaging.
DNP manufactures templates for nanoimprint lithography, a next-generation pattern transfer technology by employing microfabrication technology based on printing processes. We also broadly expand businesses through MEMS foundry services for sensors. In this latest development, we have applied glass and silicon substrate processing developed through the aforementioned businesses for advanced packaging technologies, along with handling technology and fine wiring formation technology.
About DNP
Since 1876, DNP is a global leader in the provision of printing solutions that connect people and society, providing new value. We exploit our proprietary strengths in printing and information to propose solutions that support the development of a people-friendly information society, including electronic components targeting next-generation communications, and platforms that boost IoT information security.
https://www.dnp.co.jp/eng/news/detail/10161795_2453.html
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20211207005066/en/
Contact information
DNP: Yusuke Kitagawa, 81-3-6735-0101
kitagawa-y3@mail.dnp.co.jp
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Xsolla and Skich Announce Strategic Partnership to Bring Merchant of Record Payments to an Alternative Mobile Game Marketplace14.5.2026 19:00:00 EEST | Press release
Xsolla, a leading global video game commerce company, today announced a strategic partnership with Skich, an alternative mobile game marketplace operating on iOS in the EU under Apple's Digital Markets Act provisions and on Android globally. Under the agreement, Xsolla will serve as Merchant of Record for in-app purchases and paid game sales distributed through the Skich Store. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260514867730/en/ Graphic: Xsolla Skich serves as an alternative to traditional mobile storefronts, offering developers a way to reach players outside platform-controlled distribution channels. The partnership with Xsolla enables Skich to offer a fully compliant payment and commerce layer, with Xsolla managing payment processing, tax collection, refunds, and regulatory compliance on behalf of developers, removing a significant operational and legal barrier for studios looking to distribute through alternat
Boomi Teams up With Gong to Bring Revenue AI to Boomi Agentstudio14.5.2026 19:00:00 EEST | Press release
Boomi, the data activation company for AI, today announced a collaboration withGong, the leader in Revenue AI, to bring revenue signals captured in Gong natively into the Boomi Enterprise Platform. This collaboration enables enterprises to establish an active data foundation designed to transform customer conversations into coordinated, automated actions across systems and functions enterprise-wide with Boomi Agentstudio. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260514443012/en/ Boomi Teams Up with Gong to Bring Revenue AI to Boomi Agentstudio Gong goes beyond capturing deal activity to surface real-time insights into risk, buyer intent, competitive dynamics, and key engagement signals. That intelligence moves from conversation to coordinated action, flowing across CRM, ERP, product, and operational systems with the governance and security that enterprises require. Through this collaboration, these signals can be serve
Boomi and Guru Partner to Deliver AI-Powered Enterprise Knowledge Enriched by Real-Time Data Activation14.5.2026 17:30:00 EEST | Press release
Boomi, the data activation company for AI, and Guru, the AI-powered enterprise knowledge platform, today announced a technology partnership to help organizations unlock the full value of their enterprise data for AI-driven decision-making. Unveiled at Boomi World 2026, the partnership makes Guru a launch partner for Boomi Connect, Boomi’s new managed connector service, and integrates Guru’s knowledge agents with Agentstudio and the Boomi MCP Registry to deliver richer, more accurate, and more actionable insights to knowledge workers and AI agents alike. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260514440755/en/ Guru was selected as a Boomi Connect launch partner because its AI-powered knowledge platform represents one of the highest-value consumption patterns for managed enterprise connectivity. Knowledge agents are only as effective as the data they can access, and Guru’s ability to synthesize insights across enterpris
IQM and Real Asset Acquisition Corp. Announce Public Filing of Form F-4 Registration Statement with the SEC14.5.2026 16:55:00 EEST | Press release
IQM Finland Oy, a global leader in full-stack superconducting quantum computers (“IQM”, “IQM Quantum Computers” or the “Company”), and Real Asset Acquisition Corp. (Nasdaq: RAAQ), a special purpose acquisition company (“RAAQ”), announced today the public filing of a registration statement on Form F-4 (the “Registration Statement”), which includes a preliminary proxy statement, with the U.S. Securities and Exchange Commission (“SEC”) in connection with the proposed Business Combination Agreement announced February 23, 2026. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260514989293/en/ IQM Radiance quantum computer Jan Goetz, Chief Executive Officer and Co-Founder, IQM, said: “This filing is a milestone we have worked hard to reach, and it signals our readiness to operate at a new level. Public markets will give IQM the platform and capital to accelerate everything we are building as we work towards delivering fault-toleranc
MOBX to Acquire U.S. Defense Rare Earth, Critical Minerals Company14.5.2026 16:40:00 EEST | Press release
Mobix Labs (Nasdaq: MOBX) today announced a non-binding Letter of Intent to acquire Special Project Delivery LLC ("SPD"), a U.S. company building sovereign supply chains for rare earth elements, critical minerals, and energy storage. The proposed acquisition would extend Mobix Labs' national security work — already supplying U.S. and allied fighter jets, missiles, submarines, and satellites — directly into one of the world's most strategically important industrial sectors. MOBX is moving directly into the supply chain powering modern defense, aerospace, and AI infrastructure. Forward-Looking Statements This press release contains forward-looking statements regarding the proposed acquisition of Special Project Delivery LLC ("SPD"), which are subject to risks and uncertainties described in Mobix Labs' SEC filings and similar provisions under applicable non-U.S. securities laws. The Letter of Intent is non-binding, and there can be no assurance that a definitive agreement will be executed
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom