DNP Develops Interposer, a Primary Component in Next-Generation Semiconductor Packaging
Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) has developed an interposer, a high-performance intermediate device that electrically connects multiple chips and substrates. The interposer is expected to play a key role in next-generation semiconductor packaging.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20211207005066/en/
Layer Structure (Graphic: Business Wire)
DNP also has participated in Jisso Open Innovation of Tops 2 (JOINT2), targeting further functional developments for mass-production in 2024. JOINT2 is a consortium comprising 12 companies developing semiconductor packaging materials, substrates, and equipment. Showa Denko Materials Co., Ltd. is the managing company, and was selected for the Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems by the New Energy and Industrial Technology Development Organization (NEDO).
“Through cooperation with the other participating JOINT2 companies, DNP will accelerate the further functionality of the interposer as well as advance initiatives aimed at mass production in 2024. We will also promote the development of next-generation semiconductor packaging technology.” says Ryoichi Ohigashi of the Research and Business Development Center, DNP.
Background
The shift to higher functionality, greater speed and lower power consumption for semiconductor products requires miniaturization technology of semiconductor by using photo-lithography. It is said, however, that further miniaturization is rapidly approaching its limit, due to the complexity of the process and high costs. To overcome these challenges, the focus is on next-generation semiconductor packaging technology that improves processing speed by mounting multiple chips (e.g., CPUs, AI processors and memories) at high-densities, on the surface of an interposer.
Features
The interposer overcomes the issue of an increase in wiring resistance, and degradation of insulation resistance between the wirings, to achieve the high-performance necessary for leading edge semiconductor packaging.
DNP manufactures templates for nanoimprint lithography, a next-generation pattern transfer technology by employing microfabrication technology based on printing processes. We also broadly expand businesses through MEMS foundry services for sensors. In this latest development, we have applied glass and silicon substrate processing developed through the aforementioned businesses for advanced packaging technologies, along with handling technology and fine wiring formation technology.
About DNP
Since 1876, DNP is a global leader in the provision of printing solutions that connect people and society, providing new value. We exploit our proprietary strengths in printing and information to propose solutions that support the development of a people-friendly information society, including electronic components targeting next-generation communications, and platforms that boost IoT information security.
https://www.dnp.co.jp/eng/news/detail/10161795_2453.html
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20211207005066/en/
Contact information
DNP: Yusuke Kitagawa, 81-3-6735-0101
kitagawa-y3@mail.dnp.co.jp
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Kioxia Develops Core Technology that Will Allow the Practical Implementation of High-density, Low-power 3D DRAM12.12.2025 07:24:00 EET | Press release
Kioxia Corporation, a world leader in memory solutions, today announced the development of highly stackable oxide-semiconductor channel transistors that will enable the practical implementation of high-density, low-power 3D DRAM. This technology was presented at the IEEE International Electron Devices Meeting (IEDM) held in San Francisco, USA, on December 10, and has the potential to reduce power consumption across a wide range of applications, including AI servers and IoT components. In the era of AI, there is growing demand for DRAM with larger capacity and lower power consumption that can process large amounts of data. Traditional DRAM technology is reaching the physical limits of memory cell size scaling, prompting research into the 3D stacking of memory cells to provide additional capacity. The use of single-crystal silicon as the channel material for transistors in stacked memory cells, as is the case with conventional DRAM, drives up manufacturing costs, and the power required t
BEYOND Developments Reveals a New Vision for Purposeful Living on Dubai Islands with SIORA11.12.2025 19:02:00 EET | Press release
BEYOND Developments, the bold and design-led real estate developer shaping next-generation waterfront destinations in the UAE, today unveiled SIORA, its first beachfront masterplan on Dubai Islands and the company’s second large-scale community within a year. The launch underscores BEYOND’s accelerated growth and strong alignment with Dubai’s future urban vision. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251211014389/en/ BEYOND Developments - SIORA Masterplan at sunset - Dubai Islands (Photo: AETOSWire) Spanning over 2M square feet, SIORA is conceived as a coastal sanctuary inspired by Japanese garden philosophies, including the pursuit of Ikigai, the Japanese concept of finding purpose and fulfilment in everyday life. In this context, it reflects a philosophy of creating spaces that bring clarity, balance, and a sense of meaning, where architecture nurtures wellbeing and restores harmony between people, nature, and pla
3Degrees Welcomes David Dines to Board of Directors11.12.2025 18:00:00 EET | Press release
3Degrees, a global leader in renewable energy and climate solutions, is pleased to announce the appointment of David Dines to its Board of Directors, effective December 8, 2025. Dines brings more than four decades of leadership experience across global energy, commodities, financial services, transportation, and industrial markets. He served on the executive team as Chief Financial Officer and Corporate Senior Vice President at Cargill, Inc., the largest privately held company in the United States, where he oversaw enterprise-wide financial strategy, capital deployment, and financial performance. During his 29-year career at Cargill, Dines led multiple global businesses, played key roles in major technology and process transformations, and was a member of Cargill’s Commodity Risk, Financial Risk, and Process, Data, and Technology Committees. “We are thrilled to welcome David to the 3Degrees board,” said Philippe Vedrenne, CEO, 3Degrees. “He has an exceptional command of financial stewa
ITC Infotech wins PTC Partner Network Award for FY25 in the PLM Category11.12.2025 16:40:00 EET | Press release
ITC Infotech, a leading global technology services and solutions provider, has been awarded the PTC Partner Network Award for FY25 in the Product Lifecycle Management (PLM) category. This prestigious recognition, awarded to a single partner globally, celebrates excellence in deploying Enterprise PLM software, enabling global and cross-functional teams to effectively manage product data and providing a trusted system for product information. The award underscores ITC Infotech’s leadership in PLM-led digital transformation, as well as its strategic alignment with PTC’s Intelligent Product Lifecycle vision, which helps customers build a structured product data foundation that serves as the backbone for AI-driven transformation. Through its specialized DxP Services, ITC Infotech has helped enterprises transform and modernize their product development lifecycle processes, seamlessly transition to SaaS ecosystem and build digitally connected, intelligent and future-ready solutions to acceler
Andersen Consulting Deepens Offerings with LBC11.12.2025 16:30:00 EET | Press release
Andersen Consulting strengthens its capabilities through a Collaboration Agreement with LBC, a Portugal-based international firm known for its integrated approach to business optimization, digital transformation and human capital development, combining creativity and human ethics with AI to accelerate value creation. Founded in 2001, LBC supports international organizations, government entities, and companies in several sectors, including financial, energy, TMT, transport, and public sectors. Serving clients in Africa, the Americas, and Europe, LBC provides management consulting, digital transformation, capacity building, and AI enablement. Known for a culture of innovative transformation focused on sustained performance, the firm helps clients navigate complex change with measurable impact. Recent investments in enterprise AI enhance its capabilities across UX/UI, automation, analytics, and web solutions. “At LBC, our mission is rooted in co-creating meaningful and enduring impact,” s
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom