DNP Develops Interposer, a Primary Component in Next-Generation Semiconductor Packaging
7.12.2021 16:05:00 EET | Business Wire | Press release
Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) has developed an interposer, a high-performance intermediate device that electrically connects multiple chips and substrates. The interposer is expected to play a key role in next-generation semiconductor packaging.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20211207005066/en/
Layer Structure (Graphic: Business Wire)
DNP also has participated in Jisso Open Innovation of Tops 2 (JOINT2), targeting further functional developments for mass-production in 2024. JOINT2 is a consortium comprising 12 companies developing semiconductor packaging materials, substrates, and equipment. Showa Denko Materials Co., Ltd. is the managing company, and was selected for the Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems by the New Energy and Industrial Technology Development Organization (NEDO).
“Through cooperation with the other participating JOINT2 companies, DNP will accelerate the further functionality of the interposer as well as advance initiatives aimed at mass production in 2024. We will also promote the development of next-generation semiconductor packaging technology.” says Ryoichi Ohigashi of the Research and Business Development Center, DNP.
Background
The shift to higher functionality, greater speed and lower power consumption for semiconductor products requires miniaturization technology of semiconductor by using photo-lithography. It is said, however, that further miniaturization is rapidly approaching its limit, due to the complexity of the process and high costs. To overcome these challenges, the focus is on next-generation semiconductor packaging technology that improves processing speed by mounting multiple chips (e.g., CPUs, AI processors and memories) at high-densities, on the surface of an interposer.
Features
The interposer overcomes the issue of an increase in wiring resistance, and degradation of insulation resistance between the wirings, to achieve the high-performance necessary for leading edge semiconductor packaging.
DNP manufactures templates for nanoimprint lithography, a next-generation pattern transfer technology by employing microfabrication technology based on printing processes. We also broadly expand businesses through MEMS foundry services for sensors. In this latest development, we have applied glass and silicon substrate processing developed through the aforementioned businesses for advanced packaging technologies, along with handling technology and fine wiring formation technology.
About DNP
Since 1876, DNP is a global leader in the provision of printing solutions that connect people and society, providing new value. We exploit our proprietary strengths in printing and information to propose solutions that support the development of a people-friendly information society, including electronic components targeting next-generation communications, and platforms that boost IoT information security.
https://www.dnp.co.jp/eng/news/detail/10161795_2453.html
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20211207005066/en/
Contact information
DNP: Yusuke Kitagawa, 81-3-6735-0101
kitagawa-y3@mail.dnp.co.jp
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Nexo Reaffirms EU Compliance28.7.2026 17:00:00 EEST | Press release
Nexo, a leading digital assets wealth platform, today reaffirmed product compliance across the European Economic Area (EEA), achieved ahead of MiCAR’s entry into force. The company operates with a local setup through two MiCAR-licensed partners bringing technical depth and operational maturity to Nexo's client-facing platform in the region. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260728038475/en/ Nexo's setup pairs its global wealth platform with dedicated, licensed European infrastructure — splitting custody and brokerage across two regulated partners: Tangany, licensed under MiCAR, provides institutional-grade custody infrastructure for digital assets. Meanwhile, DLT Finance, licensed under MiCAR and authorized under MiFID II, provides brokerage infrastructure for digital assets and financial instruments. Together, these partnerships pair Nexo’s global wealth platform with infrastructure specifically built for Europ
Interactive Brokers Opens AI Connectivity to Any Tool Built on the MCP Standard28.7.2026 17:00:00 EEST | Press release
Interactive Brokers (Nasdaq: IBKR), an automated global broker, today announced that clients can now connect their accounts to nearly any AI tool they already use. Previously limited to the certified marketplaces for ChatGPT, Claude, and Grok, clients can now also connect from a growing range of tools that support the Model Context Protocol (MCP), including Claude Code, Cursor, Perplexity, and Windsurf. MCP has become the common standard for connecting AI applications to outside services. Interactive Brokers' AI Integration has been built on MCP since launch, and clients can now connect from any MCP-compatible tool in addition to the certified marketplaces. “Interactive Brokers has long offered open APIs that let clients connect their accounts to the tools and systems they choose,” said Milan Galik, Chief Executive Officer of Interactive Brokers. “Supporting AI tools built on the Model Context Protocol (MCP) is a natural extension of that philosophy. It gives clients the flexibility to
Estée Lauder Announces New Fragrance, Glimmer, with Global Campaign Starring Hailee Steinfeld28.7.2026 17:00:00 EEST | Press release
Today, Estée Lauder announces the launch of Glimmer, a new prestige fragrance created for a new generation of consumers. An amber floral fragrance with a gourmand twist, Glimmer transforms the power of everyday "glimmers” - small moments of joy, hope, and connection - into a sensorial fragrance experience designed to inspire optimism, foster community, and leave a lasting impression. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260727469772/en/ Hailee Steinfeld stars as the face of Glimmer Acclaimed actress and singer Hailee Steinfeld stars as the face of Glimmer. Rooted in the belief that one spark can ignite many, the campaign positions Hailee and her singing voice as catalysts for the joy, optimism, and connection that are at the heart of Glimmer. “Hailee is the embodiment of what Glimmer represents; she is confident, has a contagious sense of joy, and understands the power of connecting with her community,” said Justin
Mindbreeze InSpire Reduces Token Maxxing, Turning Runaway AI Costs Into Predictable Enterprise Value28.7.2026 16:03:00 EEST | Press release
Mindbreeze, a leading global provider of AI-based knowledge management solutions, today announced that Mindbreeze InSpire reduces token maxxing, the costly overconsumption of large language model (LLM) tokens that is straining enterprise AI budgets. By retrieving only the most relevant, grounded content and passing it to LLMs with precision, Mindbreeze InSpire lowers the tokens required per answer while improving accuracy, giving enterprises a path to scalable AI with predictable economics. Token maxxing has become one of the most underestimated risks in enterprise AI. As organizations connect generative AI to their data, many default to injecting large volumes of undifferentiated context into every prompt, repeatedly, across thousands of queries. Industry analysis has warned that tokens are becoming the true unit of AI cost, with usage-driven and nonlinear spending that is difficult to forecast and quick to erode margins. The problem is rarely the model. It is what the model is asked
Uptime Institute 16 th Annual 2026 Global Data Center Survey: Deployment of High Density Racks Rising Fast, Operators Face Continued Recruiting and Retention Pressures28.7.2026 16:02:00 EEST | Press release
Uptime Institute today released the findings of its 16th Annual Global Data Center Survey, the most comprehensive study of the digital infrastructure sector. The 2026 results reveal an industry navigating workforce constraints, escalating outage expenses, even as rising costs remain the top concern for management teams. Financial Pressure and Resource Constraints Intensify: While high costs continue to be a primary concern for data center leaders, the 2026 survey also highlights escalating concerns over capacity forecasting, power availability, and supply chain disruptions. Power efficiency gains remain gradual. The industry saw minor improvements in average Power Usage Effectiveness (PUE) levels this year. While newer facilities may boast highly efficient designs, overall global progress is slowed by legacy infrastructure. The AI and Density Reality Check: Despite market enthusiasm for Artificial Intelligence, expectations for AI in data center operations cooled slightly in 2026. Oper
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom