DNP Develops Interposer, a Primary Component in Next-Generation Semiconductor Packaging
7.12.2021 16:05:00 EET | Business Wire | Press release
Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) has developed an interposer, a high-performance intermediate device that electrically connects multiple chips and substrates. The interposer is expected to play a key role in next-generation semiconductor packaging.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20211207005066/en/
Layer Structure (Graphic: Business Wire)
DNP also has participated in Jisso Open Innovation of Tops 2 (JOINT2), targeting further functional developments for mass-production in 2024. JOINT2 is a consortium comprising 12 companies developing semiconductor packaging materials, substrates, and equipment. Showa Denko Materials Co., Ltd. is the managing company, and was selected for the Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems by the New Energy and Industrial Technology Development Organization (NEDO).
“Through cooperation with the other participating JOINT2 companies, DNP will accelerate the further functionality of the interposer as well as advance initiatives aimed at mass production in 2024. We will also promote the development of next-generation semiconductor packaging technology.” says Ryoichi Ohigashi of the Research and Business Development Center, DNP.
Background
The shift to higher functionality, greater speed and lower power consumption for semiconductor products requires miniaturization technology of semiconductor by using photo-lithography. It is said, however, that further miniaturization is rapidly approaching its limit, due to the complexity of the process and high costs. To overcome these challenges, the focus is on next-generation semiconductor packaging technology that improves processing speed by mounting multiple chips (e.g., CPUs, AI processors and memories) at high-densities, on the surface of an interposer.
Features
The interposer overcomes the issue of an increase in wiring resistance, and degradation of insulation resistance between the wirings, to achieve the high-performance necessary for leading edge semiconductor packaging.
DNP manufactures templates for nanoimprint lithography, a next-generation pattern transfer technology by employing microfabrication technology based on printing processes. We also broadly expand businesses through MEMS foundry services for sensors. In this latest development, we have applied glass and silicon substrate processing developed through the aforementioned businesses for advanced packaging technologies, along with handling technology and fine wiring formation technology.
About DNP
Since 1876, DNP is a global leader in the provision of printing solutions that connect people and society, providing new value. We exploit our proprietary strengths in printing and information to propose solutions that support the development of a people-friendly information society, including electronic components targeting next-generation communications, and platforms that boost IoT information security.
https://www.dnp.co.jp/eng/news/detail/10161795_2453.html
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20211207005066/en/
Contact information
DNP: Yusuke Kitagawa, 81-3-6735-0101
kitagawa-y3@mail.dnp.co.jp
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
MediaCo Appoints Brian Fisher as President21.7.2026 23:15:00 EEST | Press release
MediaCo Holding Inc. (Nasdaq: MDIA) today announced executive leadership appointments that align the Company's leadership structure to support its long-term growth strategy. Effective immediately, Brian Fisher has been appointed President of MediaCo. Albert Rodriguez will continue to serve as Chief Executive Officer, focusing on the Company's long-term strategy, growth initiatives and shareholder value, while Fisher assumes responsibility for leading the Company's day-to-day operations and execution. The Company also announced that Roberto Castro has been appointed Interim Chief Financial Officer and Interim Treasurer, overseeing the Finance organization while a search is conducted for a permanent Chief Financial Officer. "MediaCo has built tremendous momentum, and these leadership appointments position us well for our next phase of growth," said Albert Rodriguez, Chief Executive Officer of MediaCo. "Brian is the right leader to serve as President, and Roberto's financial expertise wil
Footprint Expands Into PE-Free Cups, Bringing a Proven, Recyclable and Home-Compostable Alternative to Plastic-Lined Paper Cups Into Production21.7.2026 19:00:00 EEST | Press release
Footprint, a materials science and technology company focused on eliminating single-use plastics, today announced it has acquired a recyclable, home-compostable, polyethylene (PE)-free hot and cold cup platform from Transcend Packaging, along with next-generation paper lid and straw solutions. Transcend Packaging is a European company focused on innovation in sustainable packaging solutions. Together, the cup, lid, and straw expand Footprint’s portfolio with a proven solution for the global cup market. Footprint will begin scaling its new PE-free solution through its Poland facility as the company expands across Europe, with North America to follow. As operations ramp in Poland, Footprint will work with Transcend through a manufacturing partnership to support customer continuity across Europe and meet growing demand for practical alternatives to plastic-lined cups. Transcend will manufacture product from its Wales facility for Footprint customers, while continuing to serve customers in
Spectro Cloud Launches PaletteAI Inference Launchpad to Reduce Enterprise Token Costs by up to 70%21.7.2026 17:00:00 EEST | Press release
Spectro Cloud, a leading provider of AI infrastructure management software, today launched PaletteAI Inference Launchpad, a turnkey, locally managed solution designed to help enterprises reduce token costs by as much as 70% and run AI inference closer to their data, applications and users. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260721597271/en/ The company also announced expanded PaletteAI support for AMD-powered AI infrastructure, including AMD GPUs, AMD GPU Operator, ROCm™ runtime, and the AMD enterprise AI reference stack — including AMD-optimized models from the AMD Inference Microservices (AIMs) catalog. Together, the announcements expand PaletteAI as one platform for production AI infrastructure across heterogeneous environments — giving enterprises, neoclouds and sovereign cloud providers a more flexible path to run governed AI infrastructure across NVIDIA and AMD silicon. AI infrastructure is entering the tok
RecVue Launches First AI Native Agentic Revenue Operating System21.7.2026 16:03:00 EEST | Press release
RecVue, the leader in billing and revenue management solutions, today announced the evolution of RecVue RevOS into the industry's first Agentic Revenue Operating System. In an architectural shift, the now-native agentic revenue management platform moves revenue operations beyond AI-assisted workflows to fully governed, autonomous execution with more than 50 purpose-built agents that work across contracts, invoices and payment data to predict risk, surface anomalies and escalate exceptions throughout the quote-to-cash lifecycle. Enterprise revenue operations have long suffered from a structural gap between billing systems that generate invoices and ERP systems that record transactions. Finance teams face tedious, manual reconciliation month after month, often resulting in delayed cash, billing errors that generate disputes, revenue leakage from ungoverned contract changes and close cycles that consume weeks. “Enterprise RevOps has always demanded both speed and precision, but traditiona
Yubico Extends Passkeys Beyond Trusted Authentication to Verified Authorization with Launch of YubiKey 5.821.7.2026 16:00:00 EEST | Press release
Yubico (NASDAQ STOCKHOLM: YUBICO), the pioneer of phishing-resistant authentication and creator of the original passkey, the YubiKey, today announced the general availability of its YubiKey 5.8 – marking an expansion of the role of the passkey from secure authentication to include verifiable, hardware-backed authorization. The new firmware delivers a foundation for secure enterprise workflows across identity wallets, document signing, and AI-driven approvals, while also providing developers with the critical capabilities needed to test, design and deploy these next-generation security features early. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260721286409/en/ As generative and agentic AI mature to drive rapid, automated cyberattacks, traditional multi-factor authentication (MFA) is failing to keep pace. Security leaders now face a challenge globally: securing not just who logs into a system, but exactly what actions a us
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom