DNP Develops Interposer, a Primary Component in Next-Generation Semiconductor Packaging
7.12.2021 16:05:00 EET | Business Wire | Press release
Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) has developed an interposer, a high-performance intermediate device that electrically connects multiple chips and substrates. The interposer is expected to play a key role in next-generation semiconductor packaging.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20211207005066/en/
Layer Structure (Graphic: Business Wire)
DNP also has participated in Jisso Open Innovation of Tops 2 (JOINT2), targeting further functional developments for mass-production in 2024. JOINT2 is a consortium comprising 12 companies developing semiconductor packaging materials, substrates, and equipment. Showa Denko Materials Co., Ltd. is the managing company, and was selected for the Research and Development Project of the Enhanced Infrastructures for Post-5G Information and Communication Systems by the New Energy and Industrial Technology Development Organization (NEDO).
“Through cooperation with the other participating JOINT2 companies, DNP will accelerate the further functionality of the interposer as well as advance initiatives aimed at mass production in 2024. We will also promote the development of next-generation semiconductor packaging technology.” says Ryoichi Ohigashi of the Research and Business Development Center, DNP.
Background
The shift to higher functionality, greater speed and lower power consumption for semiconductor products requires miniaturization technology of semiconductor by using photo-lithography. It is said, however, that further miniaturization is rapidly approaching its limit, due to the complexity of the process and high costs. To overcome these challenges, the focus is on next-generation semiconductor packaging technology that improves processing speed by mounting multiple chips (e.g., CPUs, AI processors and memories) at high-densities, on the surface of an interposer.
Features
The interposer overcomes the issue of an increase in wiring resistance, and degradation of insulation resistance between the wirings, to achieve the high-performance necessary for leading edge semiconductor packaging.
DNP manufactures templates for nanoimprint lithography, a next-generation pattern transfer technology by employing microfabrication technology based on printing processes. We also broadly expand businesses through MEMS foundry services for sensors. In this latest development, we have applied glass and silicon substrate processing developed through the aforementioned businesses for advanced packaging technologies, along with handling technology and fine wiring formation technology.
About DNP
Since 1876, DNP is a global leader in the provision of printing solutions that connect people and society, providing new value. We exploit our proprietary strengths in printing and information to propose solutions that support the development of a people-friendly information society, including electronic components targeting next-generation communications, and platforms that boost IoT information security.
https://www.dnp.co.jp/eng/news/detail/10161795_2453.html
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20211207005066/en/
Contact information
DNP: Yusuke Kitagawa, 81-3-6735-0101
kitagawa-y3@mail.dnp.co.jp
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
IFF Identifies Ten Consumer Moments Reshaping Food and Beverage Innovation in the GLP-1 Era27.10.2026 17:00:00 EET | Press release
IFF (NYSE: IFF)—a global leader in flavors, fragrances and health and biosciences, today launched its latest report, “GLP-1 Consumer Moments of Opportunity.” The report uncovers ten emerging consumer moments that reflect the changing needs of consumers using GLP-1 medications. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261026614988/en/ New report from IFF uncovers ten emerging consumer moments that reflect the changing needs of consumers using GLP-1 medications. “What GLP-1 users need from food and beverage products depends on the moment, and those needs can change many times throughout the day,” said Yuvraj Arora, president of IFF Taste. “The most successful innovations will be designed around the occasions that matter most to consumers, delivering the right balance of nutrition, enjoyment and functionality for each one. Understanding these moments can unlock entirely new avenues for innovation." While much of the indus
Phison Receives Micron Global Supplier Awards27.10.2026 16:00:00 EET | Press release
Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, is honored to announce that it was presented with Outstanding Supplier Performance Awards in the Semiconductor category and the Best in Quality – Assembly and Test categoryat the Micron Supplier Day 2026. The event, held in Boise, Idaho, United States was attended by top-level management of Micron and its suppliers, including Phison. The awards highlight our commitment to excellence in quality, innovation and collaboration with Micron, a global leader in semiconductor memory and storage. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261027158504/en/ Phison wins Outstanding Supplier Performance Award in Semiconductor category and the Best in Quality – Assembly and Test category at the Micron Supplier Day 2026 “Receiving our third Micron Supplier Award in a row is a tremendous honor and a testament to the strength of our partnership
Andersen Consulting Adds Collaborating Firm JKIT27.10.2026 15:30:00 EET | Press release
Andersen Consulting expands its digital and business transformation capabilities through a Collaboration Agreement with John Keells IT (JKIT), a Sri Lanka-based technology solutions provider. JKIT provides technology consulting and digital transformation services to organizations across multiple industries, including aviation, financial services, healthcare, manufacturing, retail, and telecommunications. The firm’s capabilities span enterprise applications, cloud transformation, cybersecurity, data and analytics, artificial intelligence, and intelligent automation. Leveraging strategic relationships with leading technology providers, including SAP, Microsoft, Salesforce, Databricks, and AWS, JKIT helps organizations modernize their technology infrastructure, streamline operations, strengthen decision-making, and drive business growth. “Organizations today are looking to accelerate their digital and AI transformation and need practical ways to translate innovation into measurable busine
MUFG Investor Services Appoints McAllister Kirschner Chief Executive Officer27.10.2026 15:15:00 EET | Press release
MUFG Investor Services today announced the appointment of McAllister (Mac) Kirschner as Chief Executive Officer, effective immediately. John Sergides has stepped down as Chief Executive Officer of MUFG Investor Services for health-related reasons. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261027545977/en/ McAllister (Mac) Kirschner Appointed Chief Executive Officer of MUFG Investor Services Kirschner has served as Chief Operating Officer of MUFG Investor Services since 2018, overseeing business and banking operations across public and private markets. He joined MUFG Investor Services in 2016 and previously served as Global Head of Relationship Management, bringing extensive knowledge of the business, its clients, and operations. Before joining MUFG Investor Services, Kirschner was a Managing Director in BlackRock’s Global Fund Services business, where he led teams responsible for shareholder servicing, fund administrati
FEINDEF 27 Has Already Booked 94% of Its Exhibition Space Seven Months Ahead of the Event27.10.2026 15:03:00 EET | Press release
The International Defence and Security Exhibition of Spain (FEINDEF 27) has booked 94% of its exhibition space for 18 to 20 May 2027 at IFEMA Madrid, reflecting strong demand and interest among companies and institutions across the sector. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261027170443/en/ Ángel Olivares, President of the Feindef Foundation Fundación Feindef announced the figure on Monday at the official presentation of the exhibition's fifth edition, held at Madrid's Rafael del Pino Auditorium. The fair is expected to cover more than 89,000 square metres, 46% more than in 2025. More than 746 exhibitors have been confirmed, up 19% on the previous edition. Of these, 37% are first-time participants and over 250 are international exhibitors, accounting for 33% of the total. The event will feature 14 international pavilions, strengthening its international reach as the defence and security industry gains prominence
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom