Business Wire

Embedded Finance Provider HUBUC Secures Prestigious Y-Combinator Backing

18.3.2021 12:00:00 EET | Business Wire | Press release

Share

The next generation banking-as-a-service platform, HUBUC has been selected to join one the world’s most prestigious start-up incubators, Y-Combinator (YC).

YC’s intensive three-month accelerator is designed to equip entrepreneurs with the skills, knowledge and contacts to develop and scale their businesses as well as connecting them with potential investors. The scheme’s alumni includes the likes of Airbnb, Doordash, Stripe and Dropbox, and the combined valuation of YC companies is more than $300bn.

HUBUC enables companies to incorporate a number of payment capabilities into their offering, from onboarding and payments to FX and card issuance. It offers companies the convenience of having just one API, just one contract, and no regulatory requirements, meaning companies don’t have to sign up to seven different contracts and integrate seven APIs. It also helps them bring payment services online much faster than existing methods.

Hasan Nawaz, CEO of HUBUC added: “It’s a huge accolade for us to join such a renowned incubator and we hope to follow in the footsteps of its successful alumni. The embedded finance opportunity is set to grow and with the added firepower of Y-Combinator, we have the capabilities to help realise its full potential.

“As well as absorbing as much knowledge as possible, we plan to use the investment funds to build our compliance team, further product development and expand the sales and marketing teams in preparation of international expansion.”

Ignacio Javierre, COO of HUBUC commented: "To be selected to join the Y-Combinator is a significant step in HUBUC’s development. Hasan and I have experience launching a number of fintech solutions, all of which have contributed to the success of HUBUC today. To be recognised for this by YC is incredibly rewarding for us.

“We hope this experience will turn into an opportunity to accelerate the growth of our company so we can bring the benefits of embedded finance - such as improving payment methods, easy bank account opening, currency exchange and better analytics - to even more businesses.”

Securing a place with YC recognises both the expert team at HUBUC, as well as the wider value of the embedded finance opportunity, which is expected to be worth $3.6 trillion by 20301.

1 Source: 11:FS

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

Contact information

To learn more please contact Polina Medvedeva and Robyn Margetts at press@hubuc.com

About Business Wire

For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

TreviPay Partners with Dynatos to Add e-Invoicing Capabilities to its B2B Payments Infrastructure15.9.2026 08:00:00 EEST | Press release

TreviPay, a global B2B payments infrastructure partner, today announced a partnership with Dynatos to expand e-invoicing capabilities for TreviPay clients operating across Europe and other markets. Through the partnership, Dynatos Routty Cloud proposition will provide embedded e-invoicing technology and compliance support, helping TreviPay clients exchange invoices across different formats, networks and country requirements in Europe and other global markets. E-invoicing requirements continue to expand across Europe and other global markets, adding complexity for businesses managing invoices across more than 60 countries with mandates announced or already in place. At the same time, invoicing has become an increasingly important part of the B2B buyer experience. TreviPay research found 68% of B2B buyers are more likely to choose a supplier offering invoice terms, up from 51% in 2023. As businesses expand across markets, delivering the invoicing experience buyers expect also requires na

Meiji Group to Showcase Japanese-Quality CMO/CDMO Services and a Global Manufacturing Network at CPHI Milan 202615.9.2026 08:00:00 EEST | Press release

Meiji Seika Pharma Co., Ltd. (HQ: Chuo-ku, Tokyo; President and CEO: Toshiaki Nagasato) will debut as the Meiji Group’s Pharmaceutical Segment at CPHI Milan 2026, at Fiera Milano, Milan, Italy, October 6–8, 2026. At the exhibition, the Meiji Group’s Pharmaceuticals Segment will showcase 80 years of expertise in Japanese standard quality control, manufacturing, and supply network from Japan to Europe, India, and Southeast Asia. It will also highlight group-wide contract manufacturing, from development to supply, tailored to customer needs. Through the exhibition, Meiji Seika Pharma aims to raise global awareness of the Meiji Group’s Pharmaceutical Segment, its brands, capabilities, production capacity, and contract manufacturing services, and to forge new global partnerships to expand its CMO/CDMO business. “CPHI Milan 2026” Exhibition Overview Exhibition Name: CPHI Milan 2026 Dates: October 6 (Tue) – 8 (Thu), 2026 Venue: Fiera Milano (Milan, Italy) Exhibition Area: CMO Area Booth Numbe

Signaloid joins Open Chiplet Atlas Alliance and Announces Plans to Make Its UxHw ASICs Available via OCA Ecosystem15.9.2026 07:00:00 EEST | Press release

British compute hardware company Signaloid has joined the Open Chiplet Atlas (OCA) and announced plans to make its UxHw® compute acceleration technology available as chiplets within the OCA ecosystem. The UxHw technology targets AI and simulation workloads that rely on stochastic methods, including quantitative finance, reinforcement learning, engineering simulations, and world models. The announcement follows Signaloid’s recent tapeout of a UxHw ASIC for robotics and physical AI in an ultra-low-power TSMC process. “The Open Chiplet Atlas (OCA) increases innovation in chip design by defining an open architecture for multi-vendor chiplet interoperability. In doing so, it enables new Systems-in-Package (SiPs) with reduced non-recurring engineering (NRE) costs and a vastly expedited time-to-market,” says Wei-han Lien, Chief CPU Architect and Senior Fellow of Tenstorrent. “We are thrilled to welcome Signaloid to the OCA ecosystem. Their unique, innovative accelerator for stochastic workloa

Rimini Street and Datacom Announce Strategic Partnership to Accelerate AI Adoption and Drive IT Optimisation Across ANZ14.9.2026 23:00:00 EEST | Press release

Rimini Street Inc. (Nasdaq: RMNI), the Software Support and Agentic AI ERP Company™ and the leading third-party support provider for Oracle and SAP software, today announced a strategic partnership with Datacom, one of Australasia’s largest homegrown technology services and solutions providers. The reseller agreement will see Datacom offer Rimini Support™ for Oracle and SAP software to its public and private sector customers across Australia and New Zealand. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260914070894/en/ Rimini Street and Datacom Announce Strategic Partnership to Accelerate AI Adoption and Drive IT Optimisation Across ANZ This collaboration brings together Rimini Street's third-party software support, trusted by thousands of leading organisations including Fortune Global 100, Fortune 500, midmarket, public sector and government agencies, with Datacom’s extensive market presence and implementation expertise.

Lattice to Showcase Next Gen Automotive Sensing Innovations at AutoSens Europe 202614.9.2026 23:00:00 EEST | Press release

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced its exhibition plan for the upcoming AutoSens Europe 2026, taking place on Sept. 22 – 24, 2026, in Barcelona, Spain. As part of the event, Lattice will deliver a technical presentation and host a demo showcase focused on how its low power FPGA solutions are enabling next-generation automotive sensing, ADAS, and in-vehicle networking applications. Who: Lattice Semiconductor What / When (GMT+2): Sept. 22 – 24, 2026 Lattice Demo Showcase at Booth #215 from local dimming, camera monitoring system, sensor security, and more. Presentation (Sept. 23 at 2:30 p.m., Room 5) “Efficient 360° threat detection for parked vehicles – A distributed, event-driven approach” Where: La Farga de L’Hospitalet, Barcelona, Spain AutoSens Europe is the automotive industry's premier conference and exhibition for perception systems, ADAS, and autonomous vehicle technology. Bringing together over 1,000 en

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye