Embedded Safety & Security Summit (ESSS) 2021 Announces Speaker Line-up for Virtual Conference
11.5.2021 15:00:00 EEST | Business Wire | Press release
The Embedded Safety & Security Summit (ESSS) today announced its first set of speakers for the inaugural virtual event, scheduled for June 17, 2021. Based on LDRA’s long-running annual conference, ESSS brings together embedded technology enthusiasts, industry thought leaders and regulators worldwide to share emerging trends, best practices, technical deep dive, and practical examples on empowering the development of safe and secure embedded systems.
In addition to Ian Hennell, Operations Director of LDRA, confirmed speakers and their presentations include:
Technical Panel : Next-gen Technologies: Safety and Security Implications
Dr Nigel Tracey, Vice President – RTA Solutions, ETAS, Germany
Suresh Kumar R, CTO CCS India & Digital Incubators, GE-Healthcare, India
Bill. St. Clair, Director – US Operations, LDRA, USA
Shinto Joseph, Director – South East Asia Operations, LDRA, India
Industrial Cybersecurity System (ICS) defenses what is next?
Felipe Sabino Costa, LATAM Industrial Cybersecurity (IACS) Expert, Brazil
MISRA C in the ISO 26262 Context
Andrew Banks, Chairman of the MISRA C Working Group, Technical Specialist, LDRA, UK
UNECE WP.29 Regulations for Automotive Security – A View from India
Khushwant Pawar, Head, Cybersecurity Solutions – Mobility, ETAS, India
Balancing the Load of a Safety Critical Multi Core System
Mohamed Zuhair, Electronics Engineer, TASKING, India
Challenges in Testing & Certification of AI-ML based systems in Aerospace
Shashi Kumar P, Principal Engineer – Certification, Honeywell Aerospace, India
Koilpillai George, Chief Engineers – Software, Honeywell Aerospace, India
Do All Your Build Tools Need To Be Qualified?
Chris Tapp, Chairman of the MISRA C++ Working Group, Technical Specialist, LDRA, UK
Hardware Enablers for Security in Industrial IoT
Mini TT, Principal Engineer, ABB, India
FACE Standard Verification and Validation for Safety Environments
Ehsan Salehi, Field Application Manager & FACE™ VA, LDRA, USA
System Safety Enhancement using Fault Tolerant Design
Manju Maheve, System Safety Engineer, Collins Aerospace, India
Priya Peter, System Safety and Reliability Engineer, Collins Aerospace, India
Verification Activities to be Considered for Achieving IEC 62304 Compliance
Anil Kumar N.G, Sr. Technical Manager, LDRA, India
“The deep-dive technical sessions from industry experts across the aerospace & defence, automotive, industrial, and medical domain offer an ideal mix of insights into the growing significance of implementing safe and secure practices and technologies in embedded systems,” Hennell said. “While we’ll miss being in-person this year, we expect even more within the embedded community will benefit from these valuable virtual sessions and the networking opportunities that everyone has grown to expect at ESSS.”
The virtual conference platform will offer industry-focused tracks and allow myriad networking opportunities for attendees and speakers with chat room features and live Q&As. For more information and to register for free, please visit https://www.embedded-safety-security.com/.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210511005073/en/
Contact information
Kelly Wanlass, HCI Marketing and Communications, Inc., Media Relations
Tel: +1 (801) 602-4723, Email: kelly@hci-marketing.com
Mark James, LDRA, Marketing Manager
Tel: +44 (0) 151 649 9300, Email: mark.james@ldra.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
The Estée Lauder Companies Announces Expanded Roles for Brian Franz and Amber English9.9.2026 00:05:00 EEST | Press release
The Estée Lauder Companies Inc. (NYSE: EL) today announced expanded leadership roles for two members of its Executive Team. Brian Franz has been appointed Chief Technology & Transformation Officer,expanding his responsibilities to include leading the company's enterprise-wide transformation. Amber English has been named President, Digital & Online, The Americas and Global Amazon Lead, assuming new enterprise-wide responsibility for The Estée Lauder Companies’ global relationship with Amazon. Both will continue to report directly to Stéphane de La Faverie, President and Chief Executive Officer, and remain members of The Estée Lauder Companies’ Executive Team. Both appointments are effective immediately. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260908417554/en/ Brian Franz, Chief Technology & Transformation Officer, and Amber English, President, Digital & Online, The Americas and Global Amazon Lead “Transformation at The
Samsung and Mistral AI Announce Strategic Partnership for Intelligence-Driven Semiconductor Infrastructure8.9.2026 19:15:00 EEST | Press release
Samsung Electronics Co., Ltd., today announced it has entered into a strategic partnership with Mistral AI to enhance its semiconductor engineering and manufacturing capabilities that will reinforce its leadership in AI chip technologies. The announcement of the partnership was made during the state summit held in Paris between South Korea and France. Under the agreement, Samsung will integrate Mistral’s AI services and solutions—including its flagship large language model, Mistral Large—across its semiconductor operations to develop customized on-premises AI models optimized for intelligence-driven infrastructure. Mistral’s powerful AI platform is expected to provide Samsung with a unique stack of tools that will transform how semiconductors are designed and manufactured. The on-premises enterprise solutions will especially ensure security and flexibility required to process highly sensitive technologies and operational data entirely within the boundaries of Samsung’s semiconductor in
Sensereo Airo Wins IFA Berlin Innovation Award8.9.2026 18:00:00 EEST | Press release
Sensereo, an environmental intelligence company developing next-generation sensing products for safer, healthier and smarter living, was presented with the prestigious IFA Berlin Innovation Award for its Airo modular indoor air quality system. The award was presented during IFA Berlin on Thursday, Sept. 4, recognizing Airo for its innovative approach to helping consumers better understand and manage the quality of their indoor environments. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260906292649/en/ Winner of a 2026 IFA Innovation Award, Airo is Sensereo’s flagship environmental intelligence platform, combining advanced sensing technology with a modular design that allows users to monitor multiple aspects of indoor air quality and environmental conditions through a single, consumer-friendly system. Designed to transform complex environmental data into useful, actionable information, Airo helps households better understan
Verdantis Rebrands as the AI Super-Agent for MRO, Sets Sights on AI-Native Enterprise Asset Management8.9.2026 17:06:00 EEST | Press release
Verdantis, the AI company for spare parts and MRO inventory optimization in asset-intensive industries, today unveiled its new brand identity as the AI Super-agent for MRO and announced it is building toward a fully AI-native Enterprise Asset Management (EAM) platform. Verdantis’s super-agent orchestrates nine specialized AI agents across the decisions that decide plant uptime: spare parts, criticality, demand, reorder, and work order planning. These decisions set working capital, maintenance spend, and whether a critical asset runs and, in most plants, they are still made in spreadsheets and disconnected systems. The positioning is for the teams who own uptime - maintenance, reliability, and MRO supply chain leaders in oil and gas, mining, utilities, chemicals, and manufacturing. And it reflects an AI-first architecture: agents decide and act by default; people supervise, override, and teach the system. Every human override creates feedback that helps the system learn. That principle
HyperLight Welcomes VentureTech Alliance to Series C, Deepening TFLN Integration Across the Semiconductor Ecosystem8.9.2026 17:00:00 EEST | Press release
HyperLight Corporation ("HyperLight"), a leader in thin-film lithium niobate (TFLN) photonics, today announced that VentureTech Alliance ("VTA") has joined its Series C financing round. VTA is a venture investment firm focused on the semiconductor industry, with a portfolio built across the semiconductor technology stack — including circuit design, foundry-adjacent process technology, EDA, advanced packaging, and photonics. VTA's participation extends the ecosystem alignment that defined the round, which brought together investors spanning silicon ICs, foundry manufacturing, electronics manufacturing services, networking, and global infrastructure capital. With VTA's addition, the syndicate now reaches further into the semiconductor manufacturing and design-enablement layers on which high-volume photonics production depends. "The transition to TFLN is not a component decision — it is an ecosystem decision," said Mian Zhang, CEO of HyperLight. "Getting TFLN into volume requires the proc
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom