European DataWarehouse designated as a Securitisation Repository by the Financial Conduct Authority
11.1.2022 22:29:00 EET | Business Wire | Press release
European DataWarehouse Ltd. (EDW) today announced it has been designated as a Securitisation Repository by the Financial Conduct Authority (FCA).
Following an extensive application process, the registration of the first UK Securitisation Repositories will become effective from 17 January 2022 and closes the final gap in the disclosure regime.
European DataWarehouse Ltd., a subsidiary of European DataWarehouse GmbH, was established in November 2018 and in December 2020 submitted its application to be registered as a UK Securitisation Repository.
The decision, along with its registration in June 2021 as an EU Securitisation Repository under the European Securities and Markets Authority (ESMA), consolidates EDW’s decade-long role as the first European-wide data repository for the asset-backed securities market.
Since 2012, EDW has worked tirelessly towards enhancing transparency in the securitisation market and delivering market-leading regulatory reporting solutions.
Prof. José Manuel González-Páramo, Chairman of European DataWarehouse stated: “European DataWarehouse has been serving UK issuers for almost a decade. The registration of EDW as a Securitisation Repository in the UK will close the regulatory gap between the EU and this important market.”
Alexandre Linden, Co-Head Portfolio Management, BNP Paribas said: “For almost ten years UK issuers have benefitted from the experience of European DataWarehouse as well as its focus on superior data quality and client service. Following its registration in the EU in June 2021, it is reassuring that EDW will also be registered as a Securitisation Repository in the UK to continue serving its UK customers.”
EDW Executive Director, Markus Schaber stated: “I am pleased that our commitment to the UK securitisation market has been recognised and, with our registration as a Securitisation Repository, we now enter a new market phase. The UK market, as the largest in Europe, can continue to rely on EDW’s expertise in providing efficient transparency solutions. We look forward to working with our UK customers on market-leading reporting solutions.”
EDW was established as part of the implementation of the European Central Bank’s ABS loan-level initiative. Since its inception as an initiative by the leading participants of the European securitisation market, EDW has acted as a repository, collecting over 3 billion loan records and relevant documentation for more than 1,600 transactions. Its team of data experts supports over 280 data owners and data providers, communicating in over 15 languages.
About European DataWarehouse
European DataWarehouse (EDW) is a Securitisation Repository designated by both the European Securities and Markets Authority and the Financial Conduct Authority. It was established in 2012 as the first Securitisation Repository in Europe to facilitate the collection, validation, and download of standardised loan-level data for Asset-Backed Securities and private whole loan portfolios.
EDW stores loan-level data and corresponding documentation for investors and other market participants. Operating as a market infrastructure, EDW aims to increase transparency and restore confidence in the ABS market. Through EDW's data, users can analyse underlying portfolios in a more efficient way and compare portfolios on a systematic basis.
For the latest updates from European DataWarehouse, follow us on LinkedIn or visit our website at www.eurodw.co.uk.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20220111006019/en/
Contact information
Media Contact:
European DataWarehouse GmbH
Carla Scarsella
Marketing & Communications Manager
Tel. 49 (0) 69 50986 9320
Email: carla.scarsella@eurodw.eu
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 23:06:00 EET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 23:00:00 EET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 20:50:00 EET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 19:08:00 EET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 17:00:00 EET | Press release
ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent chip teams. ChipAgents is building the foundational AI infrastructure for chip design, with coordinated AI Agents that can plan, reason, execut
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
