Business Wire

Fibocom and Aetina Collaborate to Bring 5G Release 16 Capabilities to AI Edge Computer Based on NVIDIA® Jetson Xavier™ NX

22.6.2022 10:00:00 EEST | Business Wire | Press release

Share

Fibocom (Stock Code: 300638), a global leading provider of IoT (Internet of Things) wireless solutions and wireless communication modules, announced the collaboration with Aetina Corporation, the provider of high-performance GPGPU and edge AI computing solutions, during Embedded World 2022. The joint effort aims to bring high-speed, ultra-reliable and low-latency 5G capacities, enabled by Fibocom’s 5G R16-compliant module FM160-EAU, to Aetina’s AN810-XNX AI edge computing platform, empowering robotics, UAV, industrial IoT, smart healthcare and more.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20220622005419/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

Fibocom and Aetina Collaborate to Bring 5G Release 16 Capabilities to AI Edge Computer Based on NVIDIA® Jetson Xavier™ NX (Photo: Fibocom)

Combining Artificial Intelligence (AI) and IoT, dubbed AIoT, has opened up new possibilities for an era of smarter, faster decision-making. The rapid reaction time that AIoT offers is the result of shifting computing power to the edge. Based on NVIDIA Jetson Xavier NX, Aetina AN810-XNX is the world's leading platform for high-performance and energy-efficient AI computing. This edge computing platform fully supports M.2 device with extension slot, that assist developers expand their systems communication ability, I/O connectivity flexibly and quickly.

5G allows AIoT to overcome the data-transmission bottleneck, while analyzing and learning from data with rapid precision. Compliant with 3GPP Release16 (R16) standards, Fibocom FM160-EAU is a high-performance 5G M.2 module supporting NR Carrier Aggregation (CA), which optimizes 5G user experience with lightning-fast speed, extended coverage, boosted throughput and increased capacity. Embedded in Aetina AN810-XNX AI edge computing platform, FM160-EAU delivers enhanced 5G R16 capabilities to the edge, allowing businesses and industry benefit from intelligent and autonomous decision-making.

Moving forward, Fibocom and Aetina will deepens relationship, optimizing AI edge computing solutions based on Nvidia Jetson AGX Orin platform with high-performance 5G module featuring latest 3GPP standards. In collaboration with industry partners, Fibocom and Aetina are committed to enhance the development of 5G AIoT.

“Aetina has been building a wide and strong ecosystem network in global edge AI industry,” said Austin Lin, Jetson Series Product Division Head, Aetina. “This partnership with Fibocom benefits our clients with their growing demand of developing reliable AI platforms with real-time connectivity at the edge.”

“Our collaboration with Aetina reflects Fibocom’s commitment to building out the AIoT world,” said Simon Tao, General Manager of MBB Product Management Dept., Fibocom. “By bringing 5G capacities to the edge, AIoT can deliver on the full promise of its potential, ushering in a new era of massive connectivity that will revolutionize how we live, work and play.”

About Aetina

Aetina Corporation, founded in 2012 in Taipei, Taiwan, is a leading provider of high-performance GPGPU and Jetson edge AI computing solutions for embedded applications. With a focus on the industrial market, we provide industrial components and longevity services, and we are also an integrator in the AIoT market, easing customer pain points by offering smart, innovative, and reliable GPU solutions that satisfy their needs.

About Fibocom

Fibocom is a leading global provider of wireless communication modules and solutions in the sector of IoT (Internet of Things), as well as the first stock-listed (Stock Code:300638) wireless module provider in China. We provide end-to-end IoT wireless communication solutions for telecom operators, IoT equipment manufacturers, and IoT system integrators. With over two decades' engagement in M2M and IoT communication technology and extensive expertise, we are capable of independently developing high-performance wireless communication modules including 5G, LTE/LTE-A, NB-IoT/LTE-M, Android Smart, Automotive, WCDMA/HSPA(+), GSM/GPRS, Wi-Fi, GNSS, etc. Besides reliable, convenient, safe and intelligent IoT communication solutions for almost all vertical industries, we are also geared to customize the best and optimal IoT modules and solutions catering to your special requirements.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

Contact information

Media
Ellie Cai
pr@fibocom.com

About Business Wire

For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

IQM and Real Asset Acquisition Corp. to Host Conference Call/Webcast to Discuss Proposed Transaction27.2.2026 14:00:00 EET | Press release

IQM Finland Oy, a global leader in full-stack superconducting quantum computers (“IQM”, “IQM Quantum Computers” or the “Company”), and Real Asset Acquisition Corp. (Nasdaq: RAAQ), a special purpose acquisition company (“RAAQ”), announced that they will host a conference call to discuss their recently announced business combination, including certain transaction highlights. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260227472716/en/ IQM Radiance quantum computer As previously disclosed, on February 23, 2026, IQM and RAAQ announced they have entered into a definitive business combination agreement, which will result in IQM becoming a public company and listing American Depositary Shares on one of the two leading U.S. stock exchanges. The transaction provides funding with the aim to accelerate IQM’s technology and commercial development towards fault-tolerance quantum computing, further advancing its position as a leading p

HighRadius Launches $0 Implementation Fee, $0 Subscription Fee via Outcome Based Pricing for oCFO Software27.2.2026 13:00:00 EET | Press release

HighRadius launches Office of the CFO first Outcome Based Pricing with $0 Implementation fee and $0 Subscription until Go-Live. Customers only pay a fraction of realized gains based on P&L impact. Chapter 1: Outcome Based Pricing (OBP) Introduction of OBP: HighRadius, a provider of 190+ AI agents for Order-to-Cash, Accounts Payable, Record-to-Report, and Treasury introduces Outcome Based Pricing (OBP). Three Components of OBP: Customers pay a) $0 in Implementation fees, b) $0 in Subscription fees until Go Live, c) HighRadius earns a fraction of the actual savings realized by the client. Chapter 2: US GAAP & ASC 606 Constraints Not Designed for Innovation: The traditional ASC 606 model requires companies to standardize and recognize revenue based on contractual obligations. For a traditional SaaS subscription, the obligation is access to software over time. AI agents are designed to deliver quantifiable, real-time Business Outcomes that do not fit the traditional accounting framework. C

Kioxia Appoints Yoshihiko Kawamura as Chief Financial Officer27.2.2026 10:15:00 EET | Press release

Kioxia Holdings Corporation (TOKYO:285A), a world leader in memory solutions, today announced the appointment of Yoshihiko Kawamura as Chief Financial Officer (CFO), effective April 1, 2026. Mr. Kawamura brings extensive international experience to Kioxia, having held assignments at Mitsubishi Corporation’s U.S. headquarters, served as General Manager of its Chicago office, and completed a tenure at the World Bank. At Hitachi, Ltd., he held senior leadership positions, including Chief Strategy Officer (CSO), Chief Financial Officer (CFO), and Chief Risk Management Officer (CRMO), where he was instrumental in leading the company’s management reforms. Since joining Kioxia as Executive Vice President in June 2025, Mr. Kawamura has worked closely with the executive team to advance the business through strategic capital and financial planning. Following its initial public offering on the Prime Market of the Tokyo Stock Exchange in December 2024, Kioxia is entering a new phase of growth char

DNP Invests in Rapidus to Support the Establishment of Mass Production for Next-Generation Semiconductors27.2.2026 09:18:00 EET | Press release

Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) today announced that it has participated in Rapidus Corporation’s funding round as one of the round investors. This strategic funding initiative supports Rapidus’ plan to steadily progress from its current R&D phase to mass production of 2nm (10⁻⁹ meters) logic semiconductors by 2027. Through this initiative, DNP will advance the development and mass production of EUV lithography photomasks and support Rapidus as it establishes a mass production system for 2nm & next-generation semiconductors. Background In recent years, the rise in energy consumption, in line with increased data generation, has become a challenge, driving demand for next-generation semiconductors capable of improving device performance and reducing power consumption. Next-generation semiconductors manufactured using EUV lithography enable the formation of finer patterns on silicon wafers compared to currently available technologies. This in turn is boosting expectations

EdgeConneX Looks to Enter Swedish Market as Part of European Data Center Expansion Strategy27.2.2026 09:05:00 EET | Press release

EdgeConneX®, an EQT portfolio company with an extensive Pan-European data center footprint, looks to expand its presence with a new site located in Skellefteå, Sweden. The data center site will be acquired from Lyten, a global company that specializes in lithium-sulfur batteries and energy storage. The site would support EdgeConneX broader strategy to expand digital infrastructure capacity across the Nordics. Subject to the completion of applicable administrative and regulatory processes, EdgeConneX will look to develop a data center campus with potential capacity of up to one gigawatt in support of future AI and cloud computing workloads. Upon completion, the data center campus would be one of the largest facilities in Europe that would be primarily powered by renewable energy. “Sweden represents an attractive long‑term market for digital infrastructure investment. The country’s access to renewable energy, stable power grid, technical workforce and strong sustainability framework alig

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye