Fibocom Launches FM350 5G Module with Intel and MediaTek to Inspire New 5G Solutions for PC
28.6.2021 19:00:00 EEST | Business Wire | Press release
Fibocom (Stock Code: 300638), a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules, today announces the joint release of the FM350 5G wireless module. Partnered with Intel and MediaTek, Fibocom’s FM350 is designed to offer high-speed 5G wireless connectivity for better PC platform support and user experience.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210628005274/en/
Inspire New 5G Solutions for PC (Photo: Fibocom)
Based on the MediaTek T700 chipset platform, Fibocom’s FM350 module supports the 5G NR Sub-6 band with up to 4.67 Gbps on the downlink and 1.25 Gbps on the uplink theoretically.
Supporting 5G standalone network (SA) and non-standalone (NSA) network architectures, the Fibocom FM350 5G module is backward compatible with LTE/WCDMA network standards, which helps to reduce complexity in end product configuration.
Fibocom’s FM350 module is ideally suitable for PCs (laptop, desktop, tablet, etc.), and it supports Windows, Linux and Chrome operating systems. Designed with standard M.2 form factor, the module has various interfaces, including PCIe 3.0, USIM, I2C, Body SAR, MIPI Tuner, tunable antenna, etc., unleashing the potential of cellular technology to meet high speed bandwidth application demand. In addition, FM350 has a built-in eSIM, providing end users the flexibility to select carrier profiles. It also supports GNSS, including GPS, GLONASS, BeiDou, and Galileo.
The Fibocom FM350 module is globally certified by regional regulatory bodies, mainstream carriers, industry institutions, and has obtained approval from several technical certification laboratories.
“We are very excited to partner with Intel and MediaTek to deliver a new generation of 5G solution for PC. Based on the MediaTek T700 chipset, Fibocom’s FM350 5G module is an excellent step forward in the proliferation of 5G in PC, allowing users to seamlessly connect to the 5G networks worldwide. The module is an excellent addition to our 5G wireless module family, enabling the high-bandwidth and secure PC experience brought by 5G technology,” said Tiger Ying, CEO, Fibocom.
“Intel strives to deliver the best possible experience across all of our mobile computing platforms. With anytime, anywhere wireless access coupled with multi-gigabit speeds (where available), 5G technology enables Modern Connected PC users to stay productive and enjoy next-generation applications.1 We are delighted to collaborate with Fibocom and MediaTek to launch the new Intel® 5G Solution 5000. Together, we provide leading 5G capabilities for our latest 11th Gen Intel® Core™ mobile platforms,” said Eric A. McLaughlin, VP Client Computing Group & GM Wireless Solutions Group, Intel Corporation.
“MediaTek’s T700 is helping to redefine the next generation of PC experiences. With our groundbreaking 5G modem technology, the new module will deliver connected experiences to consumers everywhere at unparalleled data speeds, unleashing more potential for productivity, gaming, and even entertainment whether users are at home or on the go,” said Dr. JC Hsu, Corporate VP and GM of MediaTek’s Wireless Communications Business Unit. “We look forward to continuing to work with Intel and Fibocom to bring the latest 5G technologies to consumers around the world.”
About Fibocom
Fibocom is a leading global provider of wireless communication modules and solutions in the sector of IoT (Internet of Things), as well as the first stock-listed (Stock Code:300638) wireless module provider in China. We provide end-to-end IoT wireless communication solutions for telecom operators, IoT equipment manufacturers, and IoT system integrators. With over two decades' engagement in M2M and IoT communication technology and extensive expertise, we are capable of independently developing high-performance wireless communication modules including 5G, LTE/LTE-A, NB-IoT/LTE-M, Android Smart, Automotive, WCDMA/HSPA(+), GSM/GPRS, Wi-Fi, GNSS, etc. Besides reliable, convenient, safe, and intelligent IoT communication solutions for almost all vertical industries, we are also geared to customize the best and optimal IoT modules and solutions catering to your special requirements.
1 Visit www.intel.com/PerformanceIndex (connectivity) for more information
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210628005274/en/
Contact information
Media
Ellie Cai
pr@fibocom.com
+86 755-26733555
www.fibocom.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
30 Years of Restylane ® : Reshaping the Aesthetics Field Through Science-Led, Patient-Centric Innovation6.10.2026 08:00:00 EEST | Press release
Galderma (SIX: GALD), the pure-play dermatology category leader, celebrates 30 years since Restylane was launched in Europe as the first hyaluronic acid (HA) injectable.1 With HA closest to the skin’s own, Restylane is designed to deliver personalized, natural-looking outcomes that meet diverse patient needs across key areas of the face, décolletage, and hands.8,10,12,21-31 With three decades of innovation across technology, packaging, and treatment areas, Restylane remains at the forefront of innovation, evolving from its original NASHA®, technology into a comprehensive portfolio spanning three distinct technologies: NASHA HD™, NASHA®, and OBT™.1,8,21,22 Together, these technologies offer solutions ranging from firmer gels that provide contouring and structural support, to soft, flexible formulations that smooth facial lines and wrinkles for a more youthful look.8,12,21-31 This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/202610
Posiflex Unveils AI-Powered SCO Series Kiosk to Accelerate the Future of Self-Service Retail6.10.2026 05:33:00 EEST | Press release
Posiflex Technology, Inc., a global leader in Point of Sale (POS) systems and Online-to-Offline (O2O) solutions, proudly introduces the SCO Series Self-Service Kiosks, an AI-powered platform designed to redefine self-service retail by offering flexible system configurations that support either precise weighing-scale transactions or RFID-enabled automated checkout. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261004628458/en/ Posiflex Unveils AI-Powered SCO Series Kiosk to Accelerate the Future of Self-Service Retail Built to address the evolving needs of both traditional fresh-goods environments and modern RFID-driven retail concepts, the SCO Series enables retailers to elevate operational accuracy, accelerate checkout processes, and future-proof store deployments through modular architecture, intelligent automation, and adaptable form factors engineered for next-generation retail. AI-Enabled Self-Checkout Solution for Wei
Cities Integrating AI Into Public Services With No Common Framework for Assessing Readiness, Oxford Insights Finds6.10.2026 05:00:00 EEST | Press release
Cities are integrating artificial intelligence into public services and operations with no shared framework for measuring or comparing how prepared they are to do so safely, effectively or accountably. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261005281462/en/ Cover of Oxford Insights' latest report on City AI Readiness. (Graphic: AETOSWire) Existing global indices compare countries on legislation, investment and research output, but the AI efforts happening at city level – the level of government where the technology most directly shapes daily life – are not systematically captured. To start closing that gap, Oxford Insights researchers studied AI readiness across six cities. They found that all share the same core priorities, from governance and funding to talent and infrastructure, but take distinct routes to AI readiness, shaped both by structural conditions and by deliberate strategic choices. The findings draw on
NEG Develops “BDX-3,” a New Starveil™ Ultra-thin Cover Glass for a Wider Range of Space Environments6.10.2026 04:00:00 EEST | Press release
Nippon Electric Glass Co., Ltd. (NEG) (TOKYO: 5214) has developed “BDX-3,” a new Starveil™ ultra-thin cover glass for space applications. BDX-3 is designed to reduce radiation-induced discoloration while providing greater ultraviolet (UV) shielding performance than BDX-2. While primarily intended for low Earth orbit (LEO), it can also be used in medium Earth orbit (MEO) and high Earth orbit, making it suitable for a wider range of space environments. Samples are now available for purchase, and NEG aims to achieve commercial adoption of BDX-3 in satellites and other spaceborne equipment. About BDX-3 Satellites and other equipment operating in space are exposed to intense UV radiation and other forms of radiation. Low Earth orbit is widely used for Earth observation and communications, medium Earth orbit for positioning systems, and high Earth orbit for communications and weather observation. Cover glass used in these environments must not only protect precision equipment from harsh cond
AM Intelligence Expands NVIDIA Vera Rubin AI Factory Buildout in India and Malaysia5.10.2026 21:16:00 EEST | Press release
AM Intelligence (“AMI”), the AI infrastructure platform set up by Promoters of Greenko, today announced two further firm and binding orders for 20,000 NVIDIA Rubin GPUs, to be deployed as NVIDIA Vera Rubin NVL72 rack-scale systems. Building on its first AI factory in Hyderabad, the expansion is designed to give cloud providers, enterprises and AI developers access to large-scale computing capacity closer to where they build and deploy AI. These orders are in addition to the AMI's inaugural commitment announced on August 25, 2026, for 9,000 NVIDIA Rubin GPUs at its first AI Factory in Hyderabad. This follow-on capacity totalling ~70 megawatts (MW) will be deployed at Malaysia and India with delivery scheduled for Q2 2027. Taken together, the three orders bring AMI's committed frontier compute to approximately 29,000 Rubin GPUs and close to 100 MW of capacity, establishing AMI among the earliest and largest committed buyers of Rubin GPUs outside of North America. AMI plans to bring addit
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom