Fibocom Launches FM350 5G Module with Intel and MediaTek to Inspire New 5G Solutions for PC
28.6.2021 19:00:00 EEST | Business Wire | Press release
Fibocom (Stock Code: 300638), a leading global provider of IoT (Internet of Things) wireless solution and wireless communication modules, today announces the joint release of the FM350 5G wireless module. Partnered with Intel and MediaTek, Fibocom’s FM350 is designed to offer high-speed 5G wireless connectivity for better PC platform support and user experience.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210628005274/en/
Inspire New 5G Solutions for PC (Photo: Fibocom)
Based on the MediaTek T700 chipset platform, Fibocom’s FM350 module supports the 5G NR Sub-6 band with up to 4.67 Gbps on the downlink and 1.25 Gbps on the uplink theoretically.
Supporting 5G standalone network (SA) and non-standalone (NSA) network architectures, the Fibocom FM350 5G module is backward compatible with LTE/WCDMA network standards, which helps to reduce complexity in end product configuration.
Fibocom’s FM350 module is ideally suitable for PCs (laptop, desktop, tablet, etc.), and it supports Windows, Linux and Chrome operating systems. Designed with standard M.2 form factor, the module has various interfaces, including PCIe 3.0, USIM, I2C, Body SAR, MIPI Tuner, tunable antenna, etc., unleashing the potential of cellular technology to meet high speed bandwidth application demand. In addition, FM350 has a built-in eSIM, providing end users the flexibility to select carrier profiles. It also supports GNSS, including GPS, GLONASS, BeiDou, and Galileo.
The Fibocom FM350 module is globally certified by regional regulatory bodies, mainstream carriers, industry institutions, and has obtained approval from several technical certification laboratories.
“We are very excited to partner with Intel and MediaTek to deliver a new generation of 5G solution for PC. Based on the MediaTek T700 chipset, Fibocom’s FM350 5G module is an excellent step forward in the proliferation of 5G in PC, allowing users to seamlessly connect to the 5G networks worldwide. The module is an excellent addition to our 5G wireless module family, enabling the high-bandwidth and secure PC experience brought by 5G technology,” said Tiger Ying, CEO, Fibocom.
“Intel strives to deliver the best possible experience across all of our mobile computing platforms. With anytime, anywhere wireless access coupled with multi-gigabit speeds (where available), 5G technology enables Modern Connected PC users to stay productive and enjoy next-generation applications.1 We are delighted to collaborate with Fibocom and MediaTek to launch the new Intel® 5G Solution 5000. Together, we provide leading 5G capabilities for our latest 11th Gen Intel® Core™ mobile platforms,” said Eric A. McLaughlin, VP Client Computing Group & GM Wireless Solutions Group, Intel Corporation.
“MediaTek’s T700 is helping to redefine the next generation of PC experiences. With our groundbreaking 5G modem technology, the new module will deliver connected experiences to consumers everywhere at unparalleled data speeds, unleashing more potential for productivity, gaming, and even entertainment whether users are at home or on the go,” said Dr. JC Hsu, Corporate VP and GM of MediaTek’s Wireless Communications Business Unit. “We look forward to continuing to work with Intel and Fibocom to bring the latest 5G technologies to consumers around the world.”
About Fibocom
Fibocom is a leading global provider of wireless communication modules and solutions in the sector of IoT (Internet of Things), as well as the first stock-listed (Stock Code:300638) wireless module provider in China. We provide end-to-end IoT wireless communication solutions for telecom operators, IoT equipment manufacturers, and IoT system integrators. With over two decades' engagement in M2M and IoT communication technology and extensive expertise, we are capable of independently developing high-performance wireless communication modules including 5G, LTE/LTE-A, NB-IoT/LTE-M, Android Smart, Automotive, WCDMA/HSPA(+), GSM/GPRS, Wi-Fi, GNSS, etc. Besides reliable, convenient, safe, and intelligent IoT communication solutions for almost all vertical industries, we are also geared to customize the best and optimal IoT modules and solutions catering to your special requirements.
1 Visit www.intel.com/PerformanceIndex (connectivity) for more information
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210628005274/en/
Contact information
Media
Ellie Cai
pr@fibocom.com
+86 755-26733555
www.fibocom.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
David Hagan, Dean and Pegasus Professor at CREOL, The College of Optics and Photonics, Will Serve as Vice President of SPIE26.8.2026 06:00:00 EEST | Press release
David Hagan has been elected to serve as the 2027 Vice President of SPIE, the international society for optics and photonics. He will serve as President-Elect in 2028, and as the Society’s President in 2029. The SPIE Board of Directors is influential in the scientific community, establishing policy and strategy and conducting activities of interest to SPIE Members. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260825934622/en/ Top row, from left to right: David Hagan, Jim McNally, Mark Clampin. Bottom row, from left to right: Marla Dowell, Jana Kainerstorfer, Katie Schwertz The 2026 SPIE President, Julie Bentley, professor of optics at the University of Rochester, made the new electees announcement at the Annual General Meeting of the Society on 25 August during SPIE Optics + Photonics. Terms begin on 1 January 2027. In addition to his work at CREOL (University of Florida, USA), Hagan has been an SPIE Fellow since 2017.His
FORTÉ Acquires Vega Global, APAC's Largest Systems Integrator, Expanding Global Reach26.8.2026 04:00:00 EEST | Press release
FORTÉ, the leader in communication and collaboration solutions designed for the modern workplace, today announced its acquisition of Vega Global, APAC’s largest systems integrator and a leading provider of workplace technology and audiovisual solutions serving corporate, education, government and other market segments. With this acquisition, FORTÉ adds to its international presence, including established office locations in Hong Kong, Mainland China, India, Japan, Taiwan, Thailand, Singapore, Korea, Vietnam, Australia, Philippines, Malaysia, Macau, New Zealand, Indonesia, and United Arab Emirates. With its headquarters in Minneapolis, Minn., FORTÉ also has operations in the U.S., Ireland, Germany, Sweden, the United Kingdom, and Mexico. “Multinational organizations need strategic partners who can deliver consistent communication and collaboration experiences wherever their people work and do business,” said Jeff Stoebner, Chairman and CEO of FORTÉ. “With Vega Global now part of FORTÉ,
Access Advance Launches Exploration Phase for an AV1/AV2 Device and Software Patent Pool, Invites Participation of Potential Licensors26.8.2026 03:00:00 EEST | Press release
Access Advance LLC announced today that in conjunction with the recent release of the AV2 video codec specification, it has launched the exploratory phase for a new patent pool covering devices and software implementing the AV2 video codec, as well as its predecessor AV1. During this exploratory phase, Access Advance will engage with market participants to seek their input, including holding pool formation discussions with potential licensors to gather their feedback on the scope, structure, and terms of a prospective program. All patent owners with a good-faith belief that they own or control AV1 and/or AV2 essential patents are invited to participate in the pool formation discussions. AV1 adoption is being driven largely by members of the Alliance for Open Media (“AOM”). AOM members such as Google, Meta, and Netflix increasingly utilize AV1 to deliver video, and adoption now spans smart TVs, streaming media players, mobile devices, web browsers, and chipsets. AV2, AOM’s successor to
Lattice to Showcase Industrial FPGA Innovations at FPGAWorld Conference 202625.8.2026 23:00:00 EEST | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced its exhibition plan for the upcoming FPGAWorld Conference 2026, taking place on Sept. 8, 2026, in Stockholm, Sweden. As part of the event, Lattice will deliver technical presentations and host a demo showcase focused on how its low power FPGA solutions are advancing Industrial IoT and sensor bridging applications. Who: Lattice Semiconductor What / When (GMT+2): Tuesday, Sept. 8, 2026 Lattice Demo Showcase Presentations (Track: 12:20 – 13:35, Room Brave 05) “Solving Your Power Puzzle: Lattice FPGAs’ Path to Uncompromised Low Power” “Practical Security Fundamentals for FPGA Engineers” Where: AFRY, Frösundaleden 2A, 169 70 Solna, Sweden The FPGAWorld Conference is an international forum for researchers, engineers, teachers, students, and hackers. It covers topics such as complex analog/digital/software FPGA SoC systems, FPGA/ASIC-based products, educational and industrial cases,
France Becomes First Official Participant at Expo 2030 Riyadh25.8.2026 20:40:00 EEST | Press release
France is the first country to officially sign its Participation Contract for Expo 2030 Riyadh, a major milestone in its preparations and growing international momentum. The signing took place on the sidelines of the visit to France by His Royal Highness Prince Mohammed bin Salman bin Abdulaziz Al Saud, Crown Prince and Prime Minister. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260825634516/en/ The ceremony in Paris was attended by H.H. Prince Faisal bin Farhan Al Saud, Minister of Foreign Affairs of the Kingdom of Saudi Arabia, and Dimitri S. Kerkentzes, Secretary General of the BIE. The Participation Contract was signed by Talal Al-Marri, Chief Executive Officer of Expo 2030 Riyadh, and Jacques Maire, Chairman of the Compagnie Française des Expositions (COFREX). The agreement formally establishes France’s participation in Expo 2030 Riyadh, providing the framework for its presence throughout the six-month event. It spec
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
