First System on Chip Developed in a Pioneering Project Between Tampere University, Finland, and Companies
13.12.2021 16:34:00 EET | Business Wire | Press release
The first System on Chip (SoC) developed by the Finnish SoC Hub consortium has been taped out. The project partners will focus next on improving the design, automation and performance of the SoC. The first of the three chips to be developed by the consortium will be ready for deployment in early 2022. The project contributes to strengthening Europe’s technological sovereignty.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20211213005527/en/
The bonding diagram image shows how the chip IO pads are wired to the package pins. The package is soldered to the printed circuit board. The layout picture depicts how the functional blocks are physically located on the chip. The IO pads that are bonded to the package pins are shown on the sides. Photos: SoC Hub. (Graphic: Business Wire)
The Finnish SoC Hub has set out to develop the domain of SoC design as a pioneer in Europe and to enhance Finland’s competitive position. The SoC Hub initiative, coordinated by Tampere University, Finland, and Nokia, was launched last year. The co-creation activities carried out by the partners go well beyond the scope of a conventional research project.
“The SoC has been developed using the same methods that are used in industrial production, such as design for testability, extensive verification and focusing on system-level integration instead of single modules,” says Ari Kulmala, professor of practice in SoC design at Tampere University.
According to Kulmala, the chip can also be tested by external stakeholders as it includes a development kit, and it can be integrated into a wide range of other systems.
One of the key goals of the SoC Hub project is to enable rapid prototyping for new ideas, for example, in the Internet of things (IoT), machine learning and 5G and 6G technologies in silicon.
The newly taped-out Ballast chip is the first in a series of three chips. The chip will be manufactured by TSMC, the world’s largest manufacturer of semiconductor chips.
The chip is manufactured using TSMC’s recent 22nm Ultra Low Leakage process, which is especially well suited for IoT and Edge devices. Ballast contains several different RISC-V CPU cores, a Digital Signal Processor, an AI accelerator, rich sensor-like interfaces and an extension interface to FPGA. A full software stack – including drivers, software development tools and chip debugging support – has also been implemented. The chip supports both real-time operating systems and Linux simultaneously.
“It has been a pleasure to work with the SoC Hub team. They have been extremely quick to develop the chip, and the quality of the work has been top class,” says Bas Dorren, Director of Business Development at imec.IC-link, part of imec (an R&D hub for nano and digital technologies).
Another two chips taped out in the next two years
Considering its large size, the chip was created in a very short time. The ambitious goal was achieved thanks to the good team spirit and the expertise and experience of the specialists involved.
“A great deal of work has been done to enable seamless collaboration between the University and company partners. Several early career researchers have participated in designing Ballast and have therefore had the opportunity to apply the knowledge they acquired from their studies in an industrial project,” says Timo Hämäläinen, head of the Computing Sciences Unit at Tampere University.
Besides the development of the SoC, the first phase of the project was also a major undertaking, involving building the consortium and the preparation of the necessary software and licence agreements. Headed by Tampere University and Nokia, the consortium comprises CoreHW, VLSI Solution, Siru Innovations, TTTEch Flexibilis, Procemex, Wapice and Cargotec as partners.
In the project funded by Business Finland, three SoCs will be taped out by the end of 2023. Use cases for the chips will be planned together with the project consortium.
“In the next phases of the project, we will be able to focus even more on the systematics, automation and performance of the SoCs. Despite having achieved our first goal, we continue moving forward right away. The time to invest in SoC development is now, not tomorrow,” emphasises Timo Hämäläinen.
Tampere University
The multidisciplinary Tampere University is the second largest university in Finland. The spearheads of our research and learning are technology, health and society. The University is committed to addressing the greatest challenges that are facing our society and creating new opportunities. Almost all the internationally recognised fields of study are represented at the University. Together, Tampere University and Tampere University of Applied Sciences comprise the Tampere Universities community made up of more than 30,000 students and close to 5,000 employees. www.tuni.fi/en
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20211213005527/en/
Contact information
Inquiries:
SoC Hub consortium
sochub@tuni.fi
Timo Hämäläinen
Head of the Computing Sciences Unit at Tampere University
timo.hamalainen@tuni.fi
Ari Kulmala
Professor of practice in System-on-Chip design at Tampere University
ari.kulmala@tuni.fi
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Meiji Seika Pharma’s Morcamilast (ME3183) was Granted Orphan Medicinal Product Designation by the European Commission for Palmoplantar Pustulosis3.3.2026 03:00:00 EET | Press release
Meiji Seika Pharma Co., Ltd. (Headquarters: Tokyo, President and Representative Director: Toshiaki Nagasato) today announced that morcamilast (proposed international nonproprietary name; development code: ME3183), a selective phosphodiesterase-4 (PDE4) inhibitor, has been granted orphan medicinal product designation by the European Commission (EC) for the treatment of palmoplantar pustulosis (PPP). Palmoplantar pustulosis is a chronic inflammatory disease characterized by the development of multiple sterile pustules on the palms and soles. Patients often experience pain and pruritus of the skin, and the condition can be accompanied by nail involvement and joint pain. Because lesions on the palms are visible to others and lesions on the soles can cause pain while walking, daily functioning can be significantly restricted, leading in a substantial reduction in quality of life. PPP has a pathophysiology distinct from psoriasis and pustular psoriasis, and treatment can be challenging, unde
IFF Completed the Divestiture of Soy Crush, Concentrates and Lecithin Businesses2.3.2026 23:15:00 EET | Press release
IFF (NYSE: IFF) today announced that it has successfully completed the previously announced divestiture of its soy crush, concentrates and lecithin businesses to Bunge. This transaction does not include IFF’s soy isolates business. Welcome to IFF At IFF (NYSE: IFF), we make joy through science, creativity and heart. As the global leader in taste, scent, food ingredients, health and biosciences, we’re innovating for the future. Every day, we deliver groundbreaking, sustainable solutions that elevate products people love — advancing wellness, delighting the senses and enhancing the human experience. Learn more at iff.com, LinkedIn, Instagram and Facebook. © 2026 by International Flavors & Fragrances Inc. IFF is a Registered Trademark. All Rights Reserved. View source version on businesswire.com: https://www.businesswire.com/news/home/20260302231096/en/
Verimatrix ReAccess Earns Gold 2026 Merit Award for Telecom & Wireless2.3.2026 18:50:00 EET | Press release
Regulatory News: Verimatrix (Euronext Paris: VMX), a leading provider of security solutions for a safer connected world, today announced that its Verimatrix ReAccess solution was honored with a gold 2026 Merit Award for Telecom & Wireless. The industry accolade recognizes the company’s next-generation content security solution that modernizes legacy Conditional Access Systems (CAS) across DVB, IPTV and OTT networks without requiring costly hardware replacements or field service interventions. Judged by industry executives, media professionals and technology consultants, the Merit Awards evaluate submissions from across the telecommunications landscape. Verimatrix ReAccess enables secure, over-the-air (OTA) software updates to deployed set-top boxes (STBs), delivering operator cost savings, reduced operational complexity, and ongoing protection against piracy. It also empowers operators to continuously strengthen content security, eliminating the need for costly hardware replacements. U
Textron Aviation Launches Donation Campaign to Support 2026 Special Olympics Airlift; Continues Nationwide Call for Volunteer Doves2.3.2026 18:00:00 EET | Press release
Textron Aviation Inc., a Textron Inc. (NYSE: TXT) company, today announced the launch of a donation campaign benefitting Special Olympics in support of the 2026 Special Olympics Airlift, a nationwide effort that brings athletes and coaches to the Special Olympics USA Games through the generosity of volunteer pilots, aircraft owners and operators known as Doves. Financial contributions go directly to the Special Olympics, a 501(c)(3) charitable organization. New for the 2026 event, the donation campaign serves a vital role in ensuring each delegation has what it needs for a smooth and welcoming travel experience. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260302196418/en/ Textron Aviation launches donation campaign to support 2026 Special Olympics Airlift; continues nationwide call for volunteer Doves (Photo credit: Textron Aviation). “This campaign reflects the spirit of unity and generosity that defines the Special Olym
Forrester Announces The Agenda For Its 2026 CX Events To Help Address The Challenges AI Can’t Handle Alone2.3.2026 16:30:00 EET | Press release
Forrester (Nasdaq: FORR) today announced the agenda for its global customer experience (CX) event series: CX Summit EMEA, being held in Amsterdam, June 8–10, 2026; CX Forum East, being held in New York City, June 16–17, 2026; and CX Forum West, being held in San Francisco, June 29–30, 2026. Today, CX, marketing, and digital business leaders are under mounting pressure to leverage AI to architect smarter end-to-end customer journeys, automate service, operationalize AI agents, and deliver true personalization at scale — all while consumer trust is at an all-time low. While AI is promising to raise the bar for speed and efficiency, beneath every customer experience is a foundation that AI alone can’t build. To forge trust, organizations need to embed human creativity, context, customer identity, and quality data into every customer interaction. This year’s theme, “Build The Experience AI Can’t,” will empower leaders to shift from doing more with AI to creating better experiences powered
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
