Business Wire

First System on Chip Developed in a Pioneering Project Between Tampere University, Finland, and Companies

Share

The first System on Chip (SoC) developed by the Finnish SoC Hub consortium has been taped out. The project partners will focus next on improving the design, automation and performance of the SoC. The first of the three chips to be developed by the consortium will be ready for deployment in early 2022. The project contributes to strengthening Europe’s technological sovereignty.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20211213005527/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

The bonding diagram image shows how the chip IO pads are wired to the package pins. The package is soldered to the printed circuit board. The layout picture depicts how the functional blocks are physically located on the chip. The IO pads that are bonded to the package pins are shown on the sides. Photos: SoC Hub. (Graphic: Business Wire)

The Finnish SoC Hub has set out to develop the domain of SoC design as a pioneer in Europe and to enhance Finland’s competitive position. The SoC Hub initiative, coordinated by Tampere University, Finland, and Nokia, was launched last year. The co-creation activities carried out by the partners go well beyond the scope of a conventional research project.

“The SoC has been developed using the same methods that are used in industrial production, such as design for testability, extensive verification and focusing on system-level integration instead of single modules,” says Ari Kulmala, professor of practice in SoC design at Tampere University.

According to Kulmala, the chip can also be tested by external stakeholders as it includes a development kit, and it can be integrated into a wide range of other systems.

One of the key goals of the SoC Hub project is to enable rapid prototyping for new ideas, for example, in the Internet of things (IoT), machine learning and 5G and 6G technologies in silicon.

The newly taped-out Ballast chip is the first in a series of three chips. The chip will be manufactured by TSMC, the world’s largest manufacturer of semiconductor chips.

The chip is manufactured using TSMC’s recent 22nm Ultra Low Leakage process, which is especially well suited for IoT and Edge devices. Ballast contains several different RISC-V CPU cores, a Digital Signal Processor, an AI accelerator, rich sensor-like interfaces and an extension interface to FPGA. A full software stack – including drivers, software development tools and chip debugging support – has also been implemented. The chip supports both real-time operating systems and Linux simultaneously.

“It has been a pleasure to work with the SoC Hub team. They have been extremely quick to develop the chip, and the quality of the work has been top class,” says Bas Dorren, Director of Business Development at imec.IC-link, part of imec (an R&D hub for nano and digital technologies).

Another two chips taped out in the next two years

Considering its large size, the chip was created in a very short time. The ambitious goal was achieved thanks to the good team spirit and the expertise and experience of the specialists involved.

“A great deal of work has been done to enable seamless collaboration between the University and company partners. Several early career researchers have participated in designing Ballast and have therefore had the opportunity to apply the knowledge they acquired from their studies in an industrial project,” says Timo Hämäläinen, head of the Computing Sciences Unit at Tampere University.

Besides the development of the SoC, the first phase of the project was also a major undertaking, involving building the consortium and the preparation of the necessary software and licence agreements. Headed by Tampere University and Nokia, the consortium comprises CoreHW, VLSI Solution, Siru Innovations, TTTEch Flexibilis, Procemex, Wapice and Cargotec as partners.

In the project funded by Business Finland, three SoCs will be taped out by the end of 2023. Use cases for the chips will be planned together with the project consortium.

“In the next phases of the project, we will be able to focus even more on the systematics, automation and performance of the SoCs. Despite having achieved our first goal, we continue moving forward right away. The time to invest in SoC development is now, not tomorrow,” emphasises Timo Hämäläinen.

Tampere University

The multidisciplinary Tampere University is the second largest university in Finland. The spearheads of our research and learning are technology, health and society. The University is committed to addressing the greatest challenges that are facing our society and creating new opportunities. Almost all the internationally recognised fields of study are represented at the University. Together, Tampere University and Tampere University of Applied Sciences comprise the Tampere Universities community made up of more than 30,000 students and close to 5,000 employees. www.tuni.fi/en

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

Contact information

Inquiries:
SoC Hub consortium
sochub@tuni.fi

Timo Hämäläinen
Head of the Computing Sciences Unit at Tampere University
timo.hamalainen@tuni.fi

Ari Kulmala
Professor of practice in System-on-Chip design at Tampere University
ari.kulmala@tuni.fi

About Business Wire

For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

“e4life” is Present at Expomed Eurasia with its Innovative Device Able to Inactivate Flu and Covid Viruses With an Efficacy over 90%19.4.2024 18:13:00 EEST | Press release

Expomed Eurasia, the most important medical exhibition between Europe and Asia, is ready to house more than a hundred companies, to discover new technological trends and the most innovative products which are going to change deeply the health market. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240419226980/en/ e4life: e4ambient and e4you devices (Photo: Business Wire) This is a perfect occasion for e4life to present its device based on the e4shield technology which is able to inactivate flu and Covid viruses present in the air. A technology, patented in Italy, that uses neither chemical agents nor filtering materials, but it is based on the transmission of electromagnetic waves able to inactivate the viral load in aerosol. “This Exhibition represents an extraordinary opportunity to present our innovative technology (e4shield) in a dynamic and rapidly evolving region as Eurasia. In a climate of growing consciousness of the

Qualcomm Schedules Second Quarter Fiscal 2024 Earnings Release and Conference Call19.4.2024 16:00:00 EEST | Press release

Qualcomm Incorporated (NASDAQ: QCOM) today announced that it will publish the Company’s financial results for its second quarter fiscal 2024 on Wednesday, May 1, 2024, after the close of the market on the Company’s Investor Relations website, at https://investor.qualcomm.com/financial-information. The earnings release will also be furnished to the Securities and Exchange Commission (SEC) on a Form 8-K, which will be available on the SEC website at http://www.sec.gov. Qualcomm will host a conference call to discuss its second quarter fiscal 2024 results which will be broadcast live on May 1, 2024, beginning at 1:45 p.m. Pacific Time (PT) at https://investor.qualcomm.com/news-events/events. An audio replay will be available at https://investor.qualcomm.com/news-events/events and via telephone following the live call for 30 days thereafter. To listen to the replay via telephone, U.S. callers may dial (877) 660-6853 and international callers may dial (201) 612-7415. Callers should use rese

Newmont Appoints Mining Industry Veteran Francois Hardy as Chief Technology Officer19.4.2024 15:56:00 EEST | Press release

Newmont Corporation (NYSE: NEM, TSX: NGT, ASX: NEM, PNGX: NEM) today announced the appointment of Francois Hardy as Chief Technology Officer (CTO). Francois will join Newmont’s Executive Leadership Team and lead the technical work across the business to improve operational performance and drive growth. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240419973025/en/ Newmont Appoints Mining Industry Veteran Francois Hardy as Chief Technology Officer (Photo: Business Wire) Francois will take over from interim CTO, Dean Gehring, who also served in a dual role as Newmont’s Chief Integration Officer. After a period of transition, Dean will be leaving the company in early July. Francois brings more than 30 years of technical and operational experience in mining to the role. He commenced with Newmont in 2002 and has held roles including Group Head Exploration, Managing Director Africa and General Manager Tanami. “Francois is a stron

SLB Announces First-Quarter 2024 Results, Targeting to Return $7 Billion to Shareholders Over 2024–202519.4.2024 13:50:00 EEST | Press release

SLB (NYSE: SLB) today announced results for the first-quarter 2024. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240417469361/en/ The exterior of the SLB headquarters in Houston, Texas (Photo: Business Wire) First-Quarter Results (Stated in millions, except per share amounts) Three Months Ended Change Mar. 31, 2024 Dec. 31, 2023 Mar. 31, 2023 Sequential Year-on-year Revenue $8,707 $8,990 $7,736 -3% 13% Income before taxes - GAAP basis $1,357 $1,433 $1,161 -5% 17% Income before taxes margin - GAAP basis 15.6% 15.9% 15.0% -35 bps 58 bps Net income attributable to SLB - GAAP basis $1,068 $1,113 $934 -4% 14% Diluted EPS - GAAP basis $0.74 $0.77 $0.65 -4% 14% Adjusted EBITDA* $2,057 $2,277 $1,788 -10% 15% Adjusted EBITDA margin* 23.6% 25.3% 23.1% -171 bps 51 bps Pretax segment operating income* $1,649 $1,868 $1,391 -12% 19% Pretax segment operating margin* 18.9% 20.8% 18.0% -184 bps 95 bps Net income attributable to SLB, exclud

Zayo Group Appoints New CEO of Zayo Europe19.4.2024 10:00:00 EEST | Press release

Zayo Group, a leading global provider of network infrastructure, has appointed Colman Deegan as its new CEO of Zayo Europe to drive the business’ growth as cloud and AI adoption continues across the continent. This appointment is effective as of April 16, 2024. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20240419471253/en/ Colman Deegan, CEO Zayo Europe (Photo: Business Wire) Steve Smith, CEO Zayo Group, says, “Colman’s experience and proven track record as a CEO leading large teams and businesses makes him perfectly equipped to take our European business to new heights, together with our outstanding local team. Colman will drive Zayo forward, strengthening our partnerships with data centres, hyperscalers, and enterprises across Europe. Under Colman’s leadership, we are confident that we will achieve our bold ambitions and maximise our impact in the European market.” Deegan spent more than two decades at Vodafone where he h

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
HiddenA line styled icon from Orion Icon Library.Eye