Business Wire

First System on Chip Developed in a Pioneering Project Between Tampere University, Finland, and Companies

Share

The first System on Chip (SoC) developed by the Finnish SoC Hub consortium has been taped out. The project partners will focus next on improving the design, automation and performance of the SoC. The first of the three chips to be developed by the consortium will be ready for deployment in early 2022. The project contributes to strengthening Europe’s technological sovereignty.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20211213005527/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

The bonding diagram image shows how the chip IO pads are wired to the package pins. The package is soldered to the printed circuit board. The layout picture depicts how the functional blocks are physically located on the chip. The IO pads that are bonded to the package pins are shown on the sides. Photos: SoC Hub. (Graphic: Business Wire)

The Finnish SoC Hub has set out to develop the domain of SoC design as a pioneer in Europe and to enhance Finland’s competitive position. The SoC Hub initiative, coordinated by Tampere University, Finland, and Nokia, was launched last year. The co-creation activities carried out by the partners go well beyond the scope of a conventional research project.

“The SoC has been developed using the same methods that are used in industrial production, such as design for testability, extensive verification and focusing on system-level integration instead of single modules,” says Ari Kulmala, professor of practice in SoC design at Tampere University.

According to Kulmala, the chip can also be tested by external stakeholders as it includes a development kit, and it can be integrated into a wide range of other systems.

One of the key goals of the SoC Hub project is to enable rapid prototyping for new ideas, for example, in the Internet of things (IoT), machine learning and 5G and 6G technologies in silicon.

The newly taped-out Ballast chip is the first in a series of three chips. The chip will be manufactured by TSMC, the world’s largest manufacturer of semiconductor chips.

The chip is manufactured using TSMC’s recent 22nm Ultra Low Leakage process, which is especially well suited for IoT and Edge devices. Ballast contains several different RISC-V CPU cores, a Digital Signal Processor, an AI accelerator, rich sensor-like interfaces and an extension interface to FPGA. A full software stack – including drivers, software development tools and chip debugging support – has also been implemented. The chip supports both real-time operating systems and Linux simultaneously.

“It has been a pleasure to work with the SoC Hub team. They have been extremely quick to develop the chip, and the quality of the work has been top class,” says Bas Dorren, Director of Business Development at imec.IC-link, part of imec (an R&D hub for nano and digital technologies).

Another two chips taped out in the next two years

Considering its large size, the chip was created in a very short time. The ambitious goal was achieved thanks to the good team spirit and the expertise and experience of the specialists involved.

“A great deal of work has been done to enable seamless collaboration between the University and company partners. Several early career researchers have participated in designing Ballast and have therefore had the opportunity to apply the knowledge they acquired from their studies in an industrial project,” says Timo Hämäläinen, head of the Computing Sciences Unit at Tampere University.

Besides the development of the SoC, the first phase of the project was also a major undertaking, involving building the consortium and the preparation of the necessary software and licence agreements. Headed by Tampere University and Nokia, the consortium comprises CoreHW, VLSI Solution, Siru Innovations, TTTEch Flexibilis, Procemex, Wapice and Cargotec as partners.

In the project funded by Business Finland, three SoCs will be taped out by the end of 2023. Use cases for the chips will be planned together with the project consortium.

“In the next phases of the project, we will be able to focus even more on the systematics, automation and performance of the SoCs. Despite having achieved our first goal, we continue moving forward right away. The time to invest in SoC development is now, not tomorrow,” emphasises Timo Hämäläinen.

Tampere University

The multidisciplinary Tampere University is the second largest university in Finland. The spearheads of our research and learning are technology, health and society. The University is committed to addressing the greatest challenges that are facing our society and creating new opportunities. Almost all the internationally recognised fields of study are represented at the University. Together, Tampere University and Tampere University of Applied Sciences comprise the Tampere Universities community made up of more than 30,000 students and close to 5,000 employees. www.tuni.fi/en

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

Contact information

Inquiries:
SoC Hub consortium
sochub@tuni.fi

Timo Hämäläinen
Head of the Computing Sciences Unit at Tampere University
timo.hamalainen@tuni.fi

Ari Kulmala
Professor of practice in System-on-Chip design at Tampere University
ari.kulmala@tuni.fi

About Business Wire

For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

ClickHouse Raises $400M Series D Led by Dragoneer to Accelerate Expansion Across Analytics and AI Infrastructure16.1.2026 16:30:00 EET | Press release

ClickHouse, a leader in real-time analytics, data warehousing, observability, and AI/ML, announced today the close of its Series D financing, raising $400 million. The round was led by Dragoneer Investment Group, with participation from Bessemer Venture Partners, GIC, Index Ventures, Khosla Ventures, Lightspeed Venture Partners, accounts advised by T. Rowe Price Associates, Inc., and WCM Investment Management. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260116008883/en/ ClickHouse Co-Founders (left to right): Yury Izrailevsky, Aaron Katz, Alexey Milovidov The financing follows a period of sustained, accelerating growth for ClickHouse. The company now serves more than 3,000 customers on its fully managed service, ClickHouse Cloud, with ARR growing more than 250 percent year over year. Over the past three months, customers including Capital One, Lovable, Decagon, Polymarket, and Airwallex have adopted the platform or expand

Qualcomm Announces Quarterly Cash Dividend16.1.2026 16:00:00 EET | Press release

Qualcomm Incorporated (NASDAQ: QCOM) today announced a quarterly cash dividend of $0.89 per common share, payable on March 26, 2026, to stockholders of record at the close of business on March 5, 2026. About Qualcomm Qualcomm relentlessly innovates to deliver intelligent computing everywhere, helping the world tackle some of its most important challenges. Building on our 40 years of technology leadership in creating era-defining breakthroughs, we deliver a broad portfolio of solutions built with our leading-edge AI, high-performance, low-power computing, and unrivaled connectivity. Our Snapdragon® platforms power extraordinary consumer experiences, and our Qualcomm Dragonwing™ products empower businesses and industries to scale to new heights. Together with our ecosystem partners, we enable next-generation digital transformation to enrich lives, improve businesses, and advance societies. At Qualcomm, we are engineering human progress. Qualcomm Incorporated includes our licensing busine

Nominations open for The MIDORI Prize for Biodiversity 2026 by AEON Environmental Foundation and the Secretariat of the Convention on Biological Diversity16.1.2026 10:00:00 EET | Press release

The call for nominations for The MIDORI Prize for Biodiversity 2026 is open from 2 February to 31 March 2026. Nominations are invited from members of the public through the AEON Environmental Foundation website at https://www.aeonkankyozaidan.or.jp/en/prize/. The Award Ceremony and Award Winners Forum of the 2026 edition of the Prize will be held on 27 August in Tokyo, Japan. These events will contribute to the global mobilization around COP 17 of the Convention on Biological Diversity (CBD), which will take place in Yerevan (Armenia) under the theme of “Taking action for Nature”. Co-organized by the AEON Environmental Foundation and the Secretariat of the CBD, the Prize is awarded to individuals who make outstanding contributions to global biodiversity-related objectives, including the conservation and sustainable use of biodiversity, and other environmental challenges such as climate change. To date, 21 individuals from 20 countries have received the prize. Established by the AEON En

Tigo Energy and Weco Certify MLPE-Inverter Compatibility to Simplify PV System Design16.1.2026 07:00:00 EET | Press release

Tigo Energy, Inc. (NASDAQ: TYGO) (“Tigo” or “Company”), a leading provider of intelligent solar and energy software solutions, today announced the Company has signed a certificate of compatibility with Weco S.r.l., documenting the compatibility between Tigo Flex MLPE products and hybrid solar inverters from Weco. The certification covers certain single-phase and three-phase Weco products and members of the Tigo TS4-A and TS4-X product families, when properly designed and installed. Together, these products are designed to deliver high-quality, enhanced value through a system that generates and manages solar energy more efficiently and delivers the features residential energy customers demand. “The compatibility between our inverter solutions and Tigo optimizers represents a significant step forward for the entire industry, and confirms our commitment to simplifying the work of solar professionals,” said Federico Cusumano, R&D manager at Weco S.r.l. “Thanks to this certification, design

Binarly to Unveil “Broken Trust” Research: Firmware Bypass Chains, BMC Persistence, and EDR Evasion16.1.2026 00:04:00 EET | Press release

Binarly, the industry leader in software and firmware supply-chain security, today announced an upcoming DistrictCon presentation “Broken Trust: Firmware Bypass Chains, BMC Persistence, and EDR Evasion.” The session will detail how firmware-level attack chains observed in shipped enterprise devices can effectively undermine modern endpoint defenses, enabling stealthy compromise and long-lived persistence. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260115834965/en/ Binarly Unveils Broken Trust Research: Firmware Bypass, BMC Persistence In this presentation, the Binarly REsearch team will dismantle the assumption of hardware trust by presenting multiple real-world firmware bypass chains. Alex Matrosov and Fabio Pagani will provide a deep dive into the specific vulnerability classes and exploitation primitives that make these attacks reliable in practice. The team will also deliver a live demonstration compromising a fully

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye