Business Wire

First System on Chip Developed in a Pioneering Project Between Tampere University, Finland, and Companies

13.12.2021 16:34:00 EET | Business Wire | Press release

Share

The first System on Chip (SoC) developed by the Finnish SoC Hub consortium has been taped out. The project partners will focus next on improving the design, automation and performance of the SoC. The first of the three chips to be developed by the consortium will be ready for deployment in early 2022. The project contributes to strengthening Europe’s technological sovereignty.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20211213005527/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

The bonding diagram image shows how the chip IO pads are wired to the package pins. The package is soldered to the printed circuit board. The layout picture depicts how the functional blocks are physically located on the chip. The IO pads that are bonded to the package pins are shown on the sides. Photos: SoC Hub. (Graphic: Business Wire)

The Finnish SoC Hub has set out to develop the domain of SoC design as a pioneer in Europe and to enhance Finland’s competitive position. The SoC Hub initiative, coordinated by Tampere University, Finland, and Nokia, was launched last year. The co-creation activities carried out by the partners go well beyond the scope of a conventional research project.

“The SoC has been developed using the same methods that are used in industrial production, such as design for testability, extensive verification and focusing on system-level integration instead of single modules,” says Ari Kulmala, professor of practice in SoC design at Tampere University.

According to Kulmala, the chip can also be tested by external stakeholders as it includes a development kit, and it can be integrated into a wide range of other systems.

One of the key goals of the SoC Hub project is to enable rapid prototyping for new ideas, for example, in the Internet of things (IoT), machine learning and 5G and 6G technologies in silicon.

The newly taped-out Ballast chip is the first in a series of three chips. The chip will be manufactured by TSMC, the world’s largest manufacturer of semiconductor chips.

The chip is manufactured using TSMC’s recent 22nm Ultra Low Leakage process, which is especially well suited for IoT and Edge devices. Ballast contains several different RISC-V CPU cores, a Digital Signal Processor, an AI accelerator, rich sensor-like interfaces and an extension interface to FPGA. A full software stack – including drivers, software development tools and chip debugging support – has also been implemented. The chip supports both real-time operating systems and Linux simultaneously.

“It has been a pleasure to work with the SoC Hub team. They have been extremely quick to develop the chip, and the quality of the work has been top class,” says Bas Dorren, Director of Business Development at imec.IC-link, part of imec (an R&D hub for nano and digital technologies).

Another two chips taped out in the next two years

Considering its large size, the chip was created in a very short time. The ambitious goal was achieved thanks to the good team spirit and the expertise and experience of the specialists involved.

“A great deal of work has been done to enable seamless collaboration between the University and company partners. Several early career researchers have participated in designing Ballast and have therefore had the opportunity to apply the knowledge they acquired from their studies in an industrial project,” says Timo Hämäläinen, head of the Computing Sciences Unit at Tampere University.

Besides the development of the SoC, the first phase of the project was also a major undertaking, involving building the consortium and the preparation of the necessary software and licence agreements. Headed by Tampere University and Nokia, the consortium comprises CoreHW, VLSI Solution, Siru Innovations, TTTEch Flexibilis, Procemex, Wapice and Cargotec as partners.

In the project funded by Business Finland, three SoCs will be taped out by the end of 2023. Use cases for the chips will be planned together with the project consortium.

“In the next phases of the project, we will be able to focus even more on the systematics, automation and performance of the SoCs. Despite having achieved our first goal, we continue moving forward right away. The time to invest in SoC development is now, not tomorrow,” emphasises Timo Hämäläinen.

Tampere University

The multidisciplinary Tampere University is the second largest university in Finland. The spearheads of our research and learning are technology, health and society. The University is committed to addressing the greatest challenges that are facing our society and creating new opportunities. Almost all the internationally recognised fields of study are represented at the University. Together, Tampere University and Tampere University of Applied Sciences comprise the Tampere Universities community made up of more than 30,000 students and close to 5,000 employees. www.tuni.fi/en

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

Contact information

Inquiries:
SoC Hub consortium
sochub@tuni.fi

Timo Hämäläinen
Head of the Computing Sciences Unit at Tampere University
timo.hamalainen@tuni.fi

Ari Kulmala
Professor of practice in System-on-Chip design at Tampere University
ari.kulmala@tuni.fi

About Business Wire

For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

GasEntec Announces New Ownership Structure, Accelerating Next Phase of Global Growth10.9.2026 12:00:00 EEST | Press release

GasEntec Holdings Inc., a global LNG technology and assets company, today announced a new ownership structure designed to accelerate GasEntec’s next phase of growth and expand the commercialization of its proprietary LNG technologies and solutions. A consortium led by the Groupe Mimran has acquired a majority stake in GasEntec Holdings Inc., the US holding company, supporting GasEntec’s global growth. Under the new structure, GasEntec Holdings is the parent company of GasEntec’s South Korean operating business. Prior shareholders have exited in full. GasEntec’s customer relationships, contracts, engineering organization and ongoing global operations remain unchanged. GasEntec will continue to operate independently, with its technology development, engineering and operations centered in South Korea and an expanding commercial presence across global markets. The new structure provides GasEntec with additional capital and strategic resources to build on its history of LNG innovation and p

EUMETSAT Takes Control of MTG-I210.9.2026 10:30:00 EEST | Press release

EUMETSAT’s Mission Control Centre in Darmstadt, Germany, took over control of the newest addition to its fleet of meteorological satellites, Meteosat Third Generation Imager 2 (MTG-I2), on 9 September 2026, following the successful completion of its Launch and Early Orbit Phase (LEOP). This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260909889951/en/ MTG-I2 in orbit MTG-I2 launched from Europe’s Spaceport in French Guiana on 27 August 2026 and has now reached its geostationary orbit, around 36,000 km above Earth. During LEOP, carried out for EUMETSAT by Telespazio, communications with the satellite were established, its solar arrays deployed and a series of precise manoeuvres brought it to its designated orbital position. The spacecraft has now been handed over to EUMETSAT’s flight operations teams. EUMETSAT, working with ESA and European industry, will now begin extensive calibration and validation activities to prepare the s

LUMI AI Factory Selects IQM's Staged Path to Europe's First Superconducting Quantum Computer With Logical Qubits10.9.2026 10:08:00 EEST | Press release

IQM Quantum Computers (Nasdaq: IQMX) today announced its upgrade path for a logical-qubit-capable quantum computer. The deployment to the LUMI AI Factory, led by CSC – IT Center for Science, will support R&D efforts toward fault-tolerant quantum computing and advancements in hybrid computing. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260910712470/en/ UMI AI Factory selects IQM's staged path to Europe's first superconducting quantum computer with logical qubits The system, named LUMI-IQ, is an integral part of the wider LUMI AI Factory initiative, and is jointly funded by the EuroHPC Joint Undertaking and the participating countries: Finland, Czechia, Norway, and Poland. LUMI-IQ will be hosted in CSC’s new data center in Kajaani, Finland. LUMI-IQ will be delivered in three steps: the first installation of an IQM Halocene H4 system in 2027 with 150 physical qubits and early quantum error correction capabilities. The syste

Cyviz and SWISS Create Flexible Collaboration Hub for Hybrid Work at Scale10.9.2026 10:00:00 EEST | Press release

Cyviz AS has delivered a flexible collaboration hub for Swiss International Air Lines Ltd. (SWISS), designed to support hybrid meetings, workshops, training, town halls, and internal events at scale. The project highlights how global enterprises are investing in reliable, intuitive, and versatile collaboration environments as hybrid work becomes embedded in day-to-day operations. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260910985990/en/ Inside the SWISS collaboration hub at their headquarters in Zurich Located at SWISS headquarters in Zurich-Kloten, Switzerland, the new collaboration hub demonstrates how enterprise collaboration spaces are evolving from traditional meeting rooms into strategic workplace infrastructure. Delivered by Cyviz, the environment supports a wide range of hybrid formats while making advanced room technology simple for everyday users. Designed to switch seamlessly between separate and combined ro

Nothing Cleans Like Oral‑B iO: The Electric Toothbrush That Cleans Deeper, Smarter and Better10.9.2026 10:00:00 EEST | Press release

Oral‑B, the #1 brand most used by dentists worldwide, today spotlights its most advanced brushing technology: the Oral‑B iO range. Powered by a unique 2-in-1 cleaning technology, iO is engineered to clean deeper into every gap, brush smarter with real-time pressure guidance, and deliver results that are clinically proven to be better. The proof is everything — and nothing cleans like Oral‑B iO. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260904320713/en/ Oral-B iO10 Most people know that an electric toothbrush outperforms a manual one — but not everyone knows why, or what makes one electric brush stand apart from another. Oral‑B iO makes the difference clear: deeper, smarter, better — everywhere. Cleans Deeper: The Technology Behind the Clean At the heart of iO is a unique 2-in-1 technology: ultra-precise round head rotations work together with bristle-generated micro vibrations to break down and remove plaque simultaneou

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye