First System on Chip Developed in a Pioneering Project Between Tampere University, Finland, and Companies
13.12.2021 16:34:00 EET | Business Wire | Press release
The first System on Chip (SoC) developed by the Finnish SoC Hub consortium has been taped out. The project partners will focus next on improving the design, automation and performance of the SoC. The first of the three chips to be developed by the consortium will be ready for deployment in early 2022. The project contributes to strengthening Europe’s technological sovereignty.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20211213005527/en/
The bonding diagram image shows how the chip IO pads are wired to the package pins. The package is soldered to the printed circuit board. The layout picture depicts how the functional blocks are physically located on the chip. The IO pads that are bonded to the package pins are shown on the sides. Photos: SoC Hub. (Graphic: Business Wire)
The Finnish SoC Hub has set out to develop the domain of SoC design as a pioneer in Europe and to enhance Finland’s competitive position. The SoC Hub initiative, coordinated by Tampere University, Finland, and Nokia, was launched last year. The co-creation activities carried out by the partners go well beyond the scope of a conventional research project.
“The SoC has been developed using the same methods that are used in industrial production, such as design for testability, extensive verification and focusing on system-level integration instead of single modules,” says Ari Kulmala, professor of practice in SoC design at Tampere University.
According to Kulmala, the chip can also be tested by external stakeholders as it includes a development kit, and it can be integrated into a wide range of other systems.
One of the key goals of the SoC Hub project is to enable rapid prototyping for new ideas, for example, in the Internet of things (IoT), machine learning and 5G and 6G technologies in silicon.
The newly taped-out Ballast chip is the first in a series of three chips. The chip will be manufactured by TSMC, the world’s largest manufacturer of semiconductor chips.
The chip is manufactured using TSMC’s recent 22nm Ultra Low Leakage process, which is especially well suited for IoT and Edge devices. Ballast contains several different RISC-V CPU cores, a Digital Signal Processor, an AI accelerator, rich sensor-like interfaces and an extension interface to FPGA. A full software stack – including drivers, software development tools and chip debugging support – has also been implemented. The chip supports both real-time operating systems and Linux simultaneously.
“It has been a pleasure to work with the SoC Hub team. They have been extremely quick to develop the chip, and the quality of the work has been top class,” says Bas Dorren, Director of Business Development at imec.IC-link, part of imec (an R&D hub for nano and digital technologies).
Another two chips taped out in the next two years
Considering its large size, the chip was created in a very short time. The ambitious goal was achieved thanks to the good team spirit and the expertise and experience of the specialists involved.
“A great deal of work has been done to enable seamless collaboration between the University and company partners. Several early career researchers have participated in designing Ballast and have therefore had the opportunity to apply the knowledge they acquired from their studies in an industrial project,” says Timo Hämäläinen, head of the Computing Sciences Unit at Tampere University.
Besides the development of the SoC, the first phase of the project was also a major undertaking, involving building the consortium and the preparation of the necessary software and licence agreements. Headed by Tampere University and Nokia, the consortium comprises CoreHW, VLSI Solution, Siru Innovations, TTTEch Flexibilis, Procemex, Wapice and Cargotec as partners.
In the project funded by Business Finland, three SoCs will be taped out by the end of 2023. Use cases for the chips will be planned together with the project consortium.
“In the next phases of the project, we will be able to focus even more on the systematics, automation and performance of the SoCs. Despite having achieved our first goal, we continue moving forward right away. The time to invest in SoC development is now, not tomorrow,” emphasises Timo Hämäläinen.
Tampere University
The multidisciplinary Tampere University is the second largest university in Finland. The spearheads of our research and learning are technology, health and society. The University is committed to addressing the greatest challenges that are facing our society and creating new opportunities. Almost all the internationally recognised fields of study are represented at the University. Together, Tampere University and Tampere University of Applied Sciences comprise the Tampere Universities community made up of more than 30,000 students and close to 5,000 employees. www.tuni.fi/en
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20211213005527/en/
Contact information
Inquiries:
SoC Hub consortium
sochub@tuni.fi
Timo Hämäläinen
Head of the Computing Sciences Unit at Tampere University
timo.hamalainen@tuni.fi
Ari Kulmala
Professor of practice in System-on-Chip design at Tampere University
ari.kulmala@tuni.fi
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Darktrace Selects Navan to Modernise Travel Program25.2.2026 11:00:00 EET | Press release
Navan (NASDAQ: NAVN), the global AI-powered business travel and expense platform, today announced it has been selected by Darktrace, a global leader in AI for cybersecurity, to upgrade its global travel program. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260225522665/en/ Darktrace Selects Navan to Modernise Travel Program “As Darktrace accelerates its expansion, in-person collaboration is critical,” said David Smith, Chief People Officer at Darktrace. “Navan’s inventory and user experience will ensure our teams and customers can easily connect, while we can maintain financial control.” As the UK-based cybersecurity company grows, Darktrace sought a partner to consolidate its travel operations, minimize administrative burden, and improve the booking experience for its workforce. Previously hampered by fragmented processes, Darktrace required a solution that would increase platform adoption and empower its employees to tra
Zuper and Vonage Reimagine Network Connectivity for Skilled Trades with Quality on Demand25.2.2026 10:00:00 EET | Press release
Zuper, the AI operating system for the trades, and Vonage, part of Ericsson, have entered into a Memorandum of Understanding (MoU) to enter into a collaboration to integrate Vonage’s network APIs into the Zuper platform. The collaboration will provide Zuper with early access to Vonage network powered solutions, starting with Quality on Demand (QoD), where mobile network performance can be selectively applied to support critical field workflows, delivering improved latency, reliability, and connected experiences for mobile workforces. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260225852261/en/ QoD is the first advanced network API being integrated¹ and represents one component of a larger vision for mobile networks as a platform that aligns network behaviour with application intent as these capabilities continue to be exposed. The ambition is to provide Zuper with programmable mobile network capabilities, powered by Vonag
AI: The New Insider Threat Facing Organizations25.2.2026 10:00:00 EET | Press release
According to the Thales 2026 Data Threat Report, organizations across various markets including automotive, energy, finance and retail say the rapid pace of AI-driven transformation is now their biggest security challenge. Based on the report’s research, conducted by S&P Global 451 Research, 61% cite AI as their top data security risk. The concern is not only about malicious AI, but about the access it is being granted as it shifts from a tool to a trusted insider. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260225599723/en/ ©Thales As enterprises embed AI into workflows, analytics, customer service, and development pipelines, these systems are being granted broad, automated access to enterprise data, often with fewer controls than those applied to human users in a corporate environment. “Insider risk is no longer just about people. It is also about automated systems that have been trusted too quickly,” says Sebastien Can
Industrial Decarbonization: Calderion, WenCo and Terravent Invest in Graforce to Scale Plasma Pyrolysis Globally25.2.2026 09:07:00 EET | Press release
The investor consortium comprising the Paris-based Next Generation Fuels Industrial & Technological fund Calderion (Audacia), alongside infrastructure developer Terravent and WenCo Family Office, announces the closing of a strategic double-digit million-euro financing round for Berlin-based Graforce GmbH. The investment is dedicated to the industrial scale-up of Graforce’s proprietary plasma pyrolysis technology, addressing the growing global demand for cost-efficient low-carbon hydrogen, syngas, and carbon removal solutions that are compatible with existing industrial infrastructures. Disruptive alternative to conventional processes Graforce’s technology aims at replacing CO₂-intensive legacy routes such as steam reforming and classical gasification. By applying plasma to methane, biogas, flare gas, and landfill gas, the process converts these streams into their valuable molecular components instead of emitting them. The result is a high-efficiency production of clean hydrogen and syn
Mevion Medical Systems Announces CE Marking of the MEVION S250-FIT™ Proton Therapy System, Expanding Global Access to Compact Proton Therapy25.2.2026 09:00:00 EET | Press release
Mevion Medical Systems, the global leader in compact proton therapy, today announced that the MEVION S250-FIT Proton Therapy System has successfully completed the conformity assessment process and has received CE Marking under Regulation (EU) 2017/745 (EU MDR). This regulatory milestone enables the marketing, sale, and clinical use of the MEVION S250-FIT system throughout the European Union, building on the system’s existing U.S. FDA 510(k) clearance granted in September 2025. The MEVION S250-FIT is the first and only proton therapy system designed to fit into a standard radiation therapy vault. By enabling cancer centers to use their existing infrastructure, the MEVION S250-FIT dramatically reduces the cost, complexity, and timeline traditionally associated with proton therapy adoption. This opens a new pathway for hospitals and cancer centers across Europe to bring advanced proton treatment to their patients. “With both FDA clearance and CE Marking now in hand, the MEVION S250-FIT is
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
