Former Flex Executive Paul Humphries Joins Westfall Technik’s Board of Directors
19.4.2021 04:19:00 EEST | Business Wire | Press release
Westfall Technik Inc. has added industry veteran Paul Humphries to its board of directors. Humphries worked with Westfall CEO Brian Jones and COO Mark Gomulka while at NASDAQ-listed Flex Ltd. (formerly Flextronics), and he has three decades of experience leading outsourced manufacturing services businesses.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210418005057/en/
Paul Humphries, a former long-time, senior Flex executive, brings a wealth of experience to Westfall's board. He has spent years in the medical industry building global, high-reliability businesses. (Photo: Business Wire)
Until his retirement in November 2020, Humphries spent two decades at Flex, the 160,000-employee, Singapore-based, multinational electronics contract manufacturer. In his most recent role at Flex, Humphries served as president for its High Reliability Solutions (HRS) unit, which generated $11 billion in annual revenue and served the medical, automotive, and industrial sectors (including industrial equipment, aerospace and defense, energy and power).
Humphries stated, “I know the Westfall team and their capabilities. They are dynamic executives and committed to investing in their teams, customers, and technologies. Great examples include their new clean rooms in California, Wisconsin and Chicago, as well as their stable of proprietary technologies.”
“We are thrilled to have Paul on our board,” said Gomulka. “He is one of the industry’s leading thinkers and a valued personal mentor. We look forward to his insights into our ambitious investment strategy.”
Jones added, “Paul is a highly talented executive with a wealth of experience in the medical industry building global, high-reliability businesses. We look forward to Paul’s help in developing strategies and plans for growth and success.” (For more on Westfall Technik’s growth strategy, read http://bit.ly/Westfallfeature_PENG).
Before heading Flex HRS, Humphries served as Flex’s executive vice president of human resources, with a strong focus on driving diversity, environmental compliance, and improving management systems. He joined Flex in April 2000, via the acquisition of Chatham Technologies Inc. where he was senior VP of global operations. Prior to Chatham, Humphries held several senior management positions at AlliedSignal, Honeywell and Borg-Warner Corp. He has also served for many years on the boards of both the nonprofit Silicon Valley Education Foundation (promoting STEM education) and Superior Industries International Inc. Humphries holds a bachelor’s degree (Hons) in applied social studies from Coventry University in the U.K. and postgraduate certification in human resource management from West Glamorgan Institute of Higher Education, also in England.
About Westfall Technik Inc.
Westfall Technik provides highly-productive plastics manufacturing solutions to the medical, consumer packaging and consumer goods industries. Across its 18 operations, Westfall Technik’s competitive advantages include modern automated systems, correlative molding processes, and effective industry 4.0 concepts. Brand owners can expect high-quality products at an excellent value, a fast response for decreased time-to-market, 100% inspection and traceability from pellet to pallet, supply chain security compliance, and reliability from a trustworthy team. For more information, visit www.westfalltechnik.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210418005057/en/
Contact information
Merritt Williams
Chief Sales & Marketing Officer
merritt.williams@westfall-technik.com
Tel: (502) 386-1399
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Medscape Brings AI to the Hematology Frontline at EHA 20262.6.2026 09:00:00 EEST | Press release
Medscape Education will launch Future-Ready Hematologists: Practical and Ethical Use of AI in Hematology and Oncology at EHA 2026 on June 11, where leading experts will convene to explore responsible AI in one of medicine's most complex, rapidly evolving specialties. Registration is free for all EHA delegates. Reserve your seat here. The session is chaired by Prof. Jakob N. Kather, MD, MSc, Else Kroener Fresenius Center for Digital Health, Technical University Dresden, and NCT, University Hospital Heidelberg. He is joined by Prof. Chan Cheah, MBBS, DMSc, Consultant Hematologist, Sir Charles Gairdner Hospital, Perth, Australia; and Prof. Matthew Lunning, DO, FACP, Chief of Hematology and Assistant Vice Chancellor of Research, University of Nebraska Medical Center. Hematology moves faster than any clinician can track alone. AI can close that gap, but only if it's built on validated, evidence-backed science. Medscape AI shows what responsible clinical AI looks like in practice. — Jakob N.
Signaloid Announces Preview of New ASIC Targeted at Physical AI and Robotics Applications2.6.2026 07:00:00 EEST | Press release
Signaloid (https://signaloid.com), a computing platform company providing hardware and binary-translation-based acceleration of AI, robotics, aerospace, and quantitative finance workloads, today announced the tapeout and preliminary specifications documents for its C0-ASIC. Delivery of engineering samples to the first customer is due in Q3 2026 and additional FPGA-based systems implementing the ASIC’s design are under discussion for deployment in the UK and Switzerland later in 2026. The C0-ASIC was targeted specifically at energy-efficient physical AI workloads. The UK Advanced Research and Invention Agency (ARIA) will take delivery of systems based on the ASIC for use in next-generation AI workloads such as second order methods. “The Scaling Compute program at ARIA commissioned several innovative technology prototypes pursuing unconventional ideas to design new AI accelerators,” says ARIA Program Director Suraj Bramhavar. “We commissioned Signaloid’s C0-ASIC for evaluation in randomi
Blackstone Raises its Largest Asia Private Equity Fund at $13.1 Billion2.6.2026 04:00:00 EEST | Press release
Blackstone (NYSE: BX) today announced the final close of Blackstone Capital Partners Asia III (“BCP Asia III”) at $13.1 billion, exceeding its $10 billion target and marking the firm’s largest private equity fundraise in the region. The oversubscribed fund reached its hard cap and builds on the strong performance of the strategy’s first two vintages, with this close representing more than double the amount of capital raised for its predecessor vehicle. Joe Baratta, Global Head of Blackstone Private Equity Strategies,said: “We are grateful for the continued trust of our investors in Blackstone and our leading Asia Private Equity franchise. This successful fundraise reflects the strength of our platform and our ability to perform through cycles. Asia Pacific is the fastest-growing region in the world, presenting compelling opportunities to invest at scale behind our high-conviction themes and deliver for our investors.” Amit Dixit, Head of Asia for Blackstone Private Equity, said: “For t
Phison Collaborates with Intel to Bring Larger Local AI Workloads to Intel AI PC Platforms2.6.2026 03:00:00 EEST | Press release
COMPUTEX — Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a collaboration with Intel to enable AI PCs to deploy larger, more capable AI applications locally. The collaboration combines Intel® Core™ Ultra Series 3 processors with Phison’s Pascari aiDAPTIV, a memory extension solution that unblocks memory-constrained systems to support larger Mixture-of-Experts (MoE) AI models, longer-running AI sessions and agentic AI workflows. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601878925/en/ Phison and Intel collaborate to bring larger local AI workloads to Intel AI PC Platforms Today, AI PCs are moving beyond simple assistant applications toward more advanced local AI use cases. These solutions now support end users and businesses in document analysis, multi-step workflow execution and private data protection while reducing reliance on cloud-only AI services. As
Phison Unlocks Full-Scale AI Deployment Across Industries2.6.2026 03:00:00 EEST | Press release
Phison Electronics (8299TT), a global leader in NAND flash controllers and storage solutions, today announced a new strategic initiative at COMPUTEX 2026 under the theme “AI Enabler: Evolving Data Storage Intelligence.” Expanding beyond its role as a storage technology leader, Phison is taking a systems-level approach to AI solutions spanning AI infrastructure, edge AI computing and AI software platforms. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260601070396/en/ Phison evolving data storage intelligence at COMPUTEX 2026 At COMPUTEX 2026, Phison is showcasing comprehensive AI storage and computing architecture solutions designed to address key challenges facing enterprises and end users in the AI era, including high AI deployment costs, GPU and memory limitations, data privacy concerns and the increasing storage bandwidth and power demands driven by AI workloads. Four Core Technology Directions for AI and High-Speed Sto
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
