Business Wire

Hagiwara Solutions to Exhibit at SPS 2019

15.11.2019 12:00:00 EET | Business Wire | Press release

Share

Hagiwara Solutions Co., Ltd. (Elecom group) will exhibit at sps – smart production solution from the 26th to 28th of November 2019, Trade Fair Nuremberg.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20191115005082/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

Introduction Map (Graphic: Hagiwara Solutions)

Hagiwara Solutions Co., Ltd. is with Elecom group which is offering solutions with sensing technologies, industrial computers, and SSDs. D-Clue Technologies Co., Ltd. of Elecom group which is good for sensing technologies will join us at sps.

SEVEN solutions for your own:

  1. Coolant Contamination Detection:

    How do you manage machine tool coolant for precise products?
    You can maintain the coolant correctly, using our live sensing system.
    Let us suggest you make precise products with our coolant contamination detection system.

  2. AR Goggle Devices:

    How do you browse reference documents during your tasks?
    Workers with our AR goggles don’t need to worry about it.
    The AR goggle device displays instructions inside of the goggle. Easy to browse instructions during your tasks.
    Let us suggest you make your hands free in your factories.

  3. Sound Sensing for Connector Mating:

    How do your workers recognize their mating connectors correctly?
    If they fail to mate them, it must affect your manufacturing processes. Our sound sensing system can pick up just click sounds to make their mating assured.
    Let us suggest you reduce assembling failures.

  4. umati OPC UA Server on Tiny Gateway:

    How do you arrange M2M communications?
    Old factory machines can communicate with the other machines on the different platforms, using our gateway certified with umati OPC UA which is the world industrial standard.
    Let us suggest you arrange M2M communications freely.

  5. Rugged PCs, wherever you work:

    What computer is good for your tough working environment?
    Our rugged PC, ZEROSHOCK TABLET is good for you.
    You must be satisfied with its shock resistant, water and dust resistant, and touch operation with gloves on.
    In addition, the thickness is only 13.3mm and the weight is only 795g!
    Let us suggest you work wherever you are.

  6. Maintenance Free PC Which Diagnoses Itself:

    What do you think of a predictive maintenance?
    You can see computer troubles before something happens to factory machines which Maintenance Free PC controls.
    Let us suggest you say “Unexpected troubles are GONE!”

  7. The Robustness of SSDs Under Power Fault:
    What should you do in case of power fault in your factory?
    You may lose data, your computer systems may be damaged under power fault. Our SSDs can solve it with UWF of Windows10.
    Let us suggest you protect your systems and data.

Press briefing:

A press briefing will be held by Mr. Hada, Hagiwara Solutions President as below:

Date and time:

Tuesday, 26th of November, 2019; 4:00 – 5:00 PM

Place:

Hagiwara Solutions Booth: 8-403 in HALL 8

Presenter:

Mr. Jamie Hada, Hagiwara Solutions President
Mr. Setsuo Misaizu, D-Clue Technologies CTO

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

Contact information

Shinobu Apostol ITO
Hagiwara Solutions Co., Ltd.
pr@hagisol.co.jp

About Business Wire

For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 23:06:00 EET | Press release

Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana

Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 23:00:00 EET | Press release

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp

Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 20:50:00 EET | Press release

Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve

ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 19:08:00 EET | Press release

ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material

ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 17:00:00 EET | Press release

ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent chip teams. ChipAgents is building the foundational AI infrastructure for chip design, with coordinated AI Agents that can plan, reason, execut

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye