Business Wire

HKSTP Crowns Overall Champion Skyland Innovation at EPiC 2023 Pitching Competition Beating Over 610 Global Startups

28.4.2023 18:11:00 EEST | Business Wire | Press release

Share

Hong Kong Science and Technology Parks Corporation (HKSTP) today successfully held its 7th Elevator Pitch Competition (EPiC), naming Hong Kong startup, Skyland Innovation, as the overall 2023 champion, beating over 610 startups from 55 economies around the world. The signature event has partnered with the city’s leading corporations: Cathay, HSBC, MTR Lab, plus global accelerator Plug & Play, to become a true iconic mega event that has hit a global scale.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230428005353/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

Mr Albert Wong, CEO of HKSTP (Centre), alongside EPiC 2023 Top 10 overall finalists. (Photo: Business Wire)

As Hong Kong’s flagship and largest pitching contest, 50 Grand Finale semi-finalists joined the city’s most eagerly anticipated pitch event this year at sky100 at the top of the International Commerce Centre in West Kowloon to re-create a real-life 60-second elevator pitch experience.

The EPiC 2023 judging panel of the region’s top entrepreneurs, investors and innovation ecosystem leaders selected Skyland Innovation from Hong Kong, as this year’s overall champion. The winner of the grand prize of US$ 90,000, helps property owners and contractors to coordinate and communicate seamlessly on construction sites through the use of robotics and AI. The local proptech is also a spinoff from the Hong Kong Center for Construction Robotics (HKCRC) within the HKSAR Government backed AIR@InnoHK research cluster located at Hong Kong Science Park.

Along with all 50 semi-finalists, Skyland Innovation also qualifies to be considered by the HKSTP Venture Fund for additional investment deals. If selected, each company can potentially receive up to a maximum investment of US$5 million.

EPiC 2023 competitors were split across the two themes of FinTech and PropTech with FinCrime Dynamics from the UK named as the overall FinTech category winner, and Skyland Innovation Company Ltd named the overall PropTech winner from Hong Kong. This year, Canvasland, a FinTech startup from Hong Kong was also voted by the public as the “My Favourite Pitcher" winner, taking away US$10,000 and 200,000 Asia Miles. The top 10 overall finalists also won US$10,000 each (Full winners and finalists list below).

Paul Chan, Financial Secretary of Hong Kong SAR, said: “Hong Kong has a strong, thriving startup ecosystem with 4000 startups, up more than 50% from 2018. Hong Kong is also a natural gateway to the GBA, which offers tremendous growth opportunities. Successful products and services will surely have an edge in the GBA, the whole of the nation and around the world. I am truly excited to be here at EPiC 2023 where startups strive to make their 60-second pitch truly count. I congratulate all the EPiC 2023 winners and invite startups from all over the world to join us in Hong Kong where the future is built.”

Sunny Chai, Chairman, HKSTP, said: “EPiC 2023 showcases the most exciting innovations from the world’s star-studded next-generation global tech ventures. Together with the Hong Kong Government's solid commitment, as reinforced by the Hong Kong I&T Development Blueprint, our city provides the ideal platform to expand into the vast Asian market. Hong Kong is also Asia’s world city and a bridge between the mainland and the world, making us a magnet for global innovation talent and enterprises.”

Albert Wong, CEO, HKSTP, said: “This year’s EPiC competition features a record international turnout and shows Hong Kong is truly back with a strong show of unicorns and soonicorns from around the world among this year’s finalists. But EPiC is more than just a competition, it is a prime example of Hong Kong’s unique ability to help startups grow fast and go beyond by providing a network of global investment opportunities and innovation talent to turn cutting-edge science, technologies, and ideas into game-changing solutions."

A magnet for global investors and innovation talent

EPiC 2023 surpassed all expectations, attracting over 610 entries from 55 countries and cities across five continents. Over 75% of contestants come from overseas, a record high proportion of overseas contestants and economies participation since 2016. Startups joining EPiC 2023 can fully leverage the largest I&T ecosystem in Hong Kong and HKSTP’s direct connections to over 1,000 investors and more than 300 corporate partners.

In addition to the EPiC final pitching contest, the 50 semi-finalists have also taken part in the "Grow Beyond Hong Kong" Immersion Programme. This exclusive 2-day programme ran from 25-26 April, immersed the EPiC 2023 semi-finalists directly into HKSTP’s innovation ecosystem. Participants will unlock growth opportunities through educational talks, business matching and networking with leading corporate partners and investors in our ecosystem.

Winners List:

Overall Champion

Skyland Innovation Company Ltd.

“My Favourite Pitcher” Winner

Canvasland Limited

FinTech Winner

FinCrime Dynamics

PropTech Winner

Skyland Innovation Company Ltd.

Top 10 Overall Finalists

FinTech Finalists:
DoconomyAB

FinCrime Dynamics

Homebase

Ultipa

VoiceAI Technologies

 

PropTech Finalists:

I2Cool Limited
Tensorflight, Inc.

Mimicrete

VoltSafe, Inc.

Skyland Innovation Company Ltd.

Contestants Breakdown:

Category

 

 

No. of applicants

PropTech

 

 

266 (43%)

FinTech

 

 

352 (57%)

 

 

 

 

 

 

 

No. of applicants

Overseas

 

 

465 (75%)

Hong Kong

 

 

153 (25%)

A record high proportion of overseas contestants and economies participation since 2016.

For more information on EPiC 2023, please visit: https://epic.hkstp.org/

About Hong Kong Science and Technology Parks Corporation
Hong Kong Science and Technology Parks Corporation (HKSTP) has for over 20 years committed to building up Hong Kong as an international innovation and technology hub to propel success for local and global pioneers today and tomorrow. HKSTP has established a thriving I&T ecosystem that is home to two unicorns and Hong Kong’s leading R&D hub with over 13,000 research professionals and over 1,300 technology companies focused on healthtech, AI and robotics, fintech and smart city technologies.

Established in 2001, we attract and nurture talent, accelerate and commercialise innovation and technology for entrepreneurs on their journey of growth in Hong Kong, to the Greater Bay Area, Asia and beyond. Our growing innovation ecosystem is built around our key locations of Hong Kong Science Park in Shatin, InnoCentre in Kowloon Tong and three modern INNOPARKs in Tai Po, Tseung Kwan O and Yuen Long. The three INNOPARKs are realising a vision of new industrialisation for Hong Kong. The goal is sectors like advanced manufacturing, electronics and biotechnology are being reimagined for a new generation of industry.

Through our infrastructure, services, expertise and network of partnerships, HKSTP will help establish innovation and technology as a pillar of growth for Hong Kong, while reinforcing Hong Kong’s international I&T hub status as a launchpad for global growth at the heart of the GBA innovation powerhouse.

More information about HKSTP is available at www.hkstp.org.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

Contact information

Media Contact:
Hong Kong Science and Technology Parks Corporation
Betsy Leung
Tel: +852 2629 2300
Email: betsy.leung@hkstp.org

Edelman Public Relations
Lisa Tse
Tel: +852 3756 8632 / 6347 2009
Email: Lisa.Tse@edelman.com / Edelmanhkstppr@edelman.com

About Business Wire

For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Lattice Delivers Industry-First PQC-Enabled Platform Firmware Resilience for AI Infrastructure with Lattice Sentry Solution Stack12.10.2026 23:00:00 EEST | Press release

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced the latest version of its Lattice Sentry™ solution stack (v5.0), the industry’s first post-quantum cryptography (PQC)-enabled Platform Firmware Resilience (PFR) and attestation solution. Extending Lattice's post-quantum cryptography leadership from silicon to a complete platform security stack, Lattice Sentry now delivers CNSA 2.0-aligned, NIST-compliant protection across AI data centers, and critical infrastructure, giving system designers a validated, production-ready path to quantum-resistant security. Lattice Sentry extends the company’s PQC leadership, combining the industry's first CNSA 2.0-compliant FPGA portfolio with AMI's platform management software to deliver a complete, integrated platform security solution. “AI infrastructure and the threat landscape are evolving rapidly. Platform firmware has become a primary attack vector, and the quantum era will upend decades

Cooler Master Expands End-to-End Cooling Solutions for AI Infrastructure12.10.2026 20:00:00 EEST | Press release

Cooler Master, a global leader in digital infrastructure cooling solutions, has outlined its end-to-end cooling portfolio for AI infrastructure, designed to support high-density computing deployments in new data centers and existing facilities expanding AI capacity. Anchored by a 2,500 kW Liquid-to-Liquid In-Row Coolant Distribution Unit (CDU), the portfolio spans facility-level heat transfer, rack and server cooling, and the equipment used to prepare liquid cooling systems for operation. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012102572/en/ “Customers need choices that bring fast time-to-market, flexibility, and scalability for the deployment of their facilities,” said Thomas Chen, CEO at Cooler Master Corporation. “We aim to help them put liquid cooling to work, whether that means retrofitting an existing data center or building a new site. That requires comprehensive plans about how the equipment being assembled

GigaDevice Deepens Ecosystem Collaboration with LVGL to Advance GD32’s Global Open-Source GUI Ecosystem12.10.2026 16:00:00 EEST | Press release

GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, is deepening its ecosystem collaboration with LVGL. LVGL's Open graphics library is one of the world’s most widely‑adopted open‑source embedded frameworks. Eight GD32 MCU product families have now been officially included in the LVGL ecosystem, providing developers worldwide with more convenient and efficient support for embedded graphics development. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012320702/en/ Eight GD32 product series supported on LVGL website LVGL is an open-source graphical user interface framework designed for embedded devices, commercially supported by LVGL Ltd., a technology company based in Cambridge, UK. Lightweight, efficient, and cross-platform, it can be widely used in applications such as smart home devices, industrial control systems, consumer electronics, a

W. L. Gore & Associates Launches GORE® Battery Vents – MultiVent Series at the Battery Show12.10.2026 15:00:00 EEST | Press release

Today, W. L. Gore & Associates (Gore) introduced GORE® Battery Vents – MultiVent Series at The Battery Show North America 2026, a new integrated venting architecture that combines all three functions into a single device. Designed for lithium-ion battery packs in electric vehicles and energy storage systems, GORE® MultiVent is an integrated battery vent: one device that equalizes pressure, protects against moisture and evacuates gas during thermal runaway, then reseals. It gives pack designers an alternative to combining dual-stage vents, separate evacuation valves and desiccants. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012625188/en/ GORE® MultiVent GORE MultiVent builds on technology Gore acquired from Vernay Laboratories in 2026 and combines Gore membrane expertise with Vernay’s advanced valve technology. Battery pack designers have traditionally relied on multiple components to manage pressure equalization, mois

Echodyne and ACS Sign Strategic Collaboration Agreement to Advance Counter-UAS Capabilities Worldwide12.10.2026 15:00:00 EEST | Press release

Echodyne, the radar platform company, and ACS, a precision robotics company for defense, today announced the signing of a Strategic Collaboration Agreement to accelerate the development, demonstration, and deployment of integrated counter-unmanned aircraft system (C-UAS) solutions. The agreement establishes collaboration across Echodyne’s high-performance commercial counter-UAS radar hardware and software roadmaps and ACS’s Bullfrog robotic weapon station capabilities, and follows the recent announcement of each company’s award from Joint Interagency Task Force 401 for Domestic Shield, the JIATF-401 C-UAS Marketplace, and other critical counter-drone requirements. Bullfrog combines computer vision, autonomous control, and precision robotics with existing weapon systems to detect, track, identify, and engage unmanned threats. Integrating Echodyne’s precise radar track data extends this capability with persistent airspace positional information, providing earlier awareness and high-confi

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye