I-PEX and Teramount Announce Collaboration on Detachable Fiber Interconnect for Silicon Photonics
2.3.2023 19:00:00 EET | Business Wire | Press release
I-PEX, a leader in the field of high-frequency and high-speed transmission connectors and Teramount Ltd, the leader in silicon photonics fiber packaging, today announced they are collaborating to advance silicon photonics optical detachable connectivity for data centers and for other high-speed datacom and telecom applications.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230302005012/en/
Detachable Photonic Plug for co-packaged optics serviceable fiber assembly (Photo: Teramount)
The ever-growing demand for high bandwidth, low power and low latency in networking and advanced computing applications has led to growing adoption of silicon photonics, and for a continuous need to connect more and more optical fibers to silicon chips. That connectivity needs to be reliable, reworkable, serviceable, and cost-effective, which creates a huge challenge. The collaboration between I-PEX and Teramount will provide a breakthrough solution of detachable fiber to chip connectivity based on Teramount’s self-aligning optics technology and I-PEX’s ultra-precision plug and holder systems.
“Detachable fiber connectivity to silicon photonic chips is a game changer for the industry. We have recently seen a growing number of customers who are interested in Teramount's Detachable Photonic Plug for their silicon photonics applications, as it enables a new era of serviceable and reliable fiber connectivity solutions” said Hesham Taha, chief executive officer. “I-PEX is a leader in the connector industry, and we are thrilled to partner with them to advance our technology to high volume industrial grade level manufacturing”
“We are very pleased to support the realization of Teramount's ground-breaking Detachable Photonic Plug concept with I-PEX's ultra-precise design and manufacturing capabilities” said Koichi Fujii, general manager, marketing of I-PEX. "We look forward to working with them to help penetrate silicon photonics solutions into data centers and other applications”
About I-PEX:
I-PEX is a unique and high-quality manufacturer of the world's most advanced connectors, sensors, complex molded parts, and other products based on the ultra-precision manufacturing process that has been perfected over the past 60 years. I-PEX, as an innovative product development and engineering solutions expert, is committed to exceeding the customer expectations around the world through global teamwork, aiming to be the company that our customers choose first. For more information, visit www.i-pex.com
About Teramount
Teramount changes the world of optical connectivity by offering a novel solution for connecting optics to silicon for data center, advanced computing, sensors and other datacom and telecom applications. Its innovative PhotonicPlug solution provides scalable connectivity of fibers to photonic chips and aligns photonics with standard semiconductor high-volume manufacturing and packaging capabilities. Teramount office is located in Jerusalem Israel. for more information, visit www.teramount.com
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230302005012/en/
Contact information
Teramount Contacts:
Hesham Taha
Chief Executive Officer
Teramount Ltd.
Tel: + 972 50 641 9792
E-mail: info@teramount.com
I-PEX Contacts:
Koichi Fujii
General Manager, Marketing
I-PEX Inc.
Tel : + 81 45 472 7111
URL: www.i-pex.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Estithmar Holding Pays the Third Semi-Annual coupon of the 8.75% Sukuk Tranche12.3.2026 22:50:00 EET | Press release
Estithmar Holding Q.P.S.C. has paid the third semi-annual coupon of its Qatari Riyal-denominated Sukuk (first tranche), at an annual profit rate of 8.75%. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260312880092/en/ Estithmar Holding Pays the Third Semi-Annual coupon of the 8.75% Sukuk Tranche (Photo: AETOSWire) The first tranche, part of the company’s broader Sukuk program valued at QAR 3.4 billion and listed on the London Stock Exchange’s International Securities Market, was issued in August 2024. The issuance attracted a diverse pool of institutional investors including banks, insurance companies, and asset managers, with strong interest from both government-affiliated and private institutions. This demand reflects growing investor confidence in Estithmar Holding’s ability to deliver sustained value to stakeholders. EstithmarHolding was recently included in the FTSE Russell Global Equity Index, in Qatar’s Mid-Cap segme
REPLY: The Board of Directors Approved the Draft Financial Statements for the Year 202512.3.2026 16:38:00 EET | Press release
Today the Board of Directors of Reply S.p.A. [MTA, STAR: REY] approved the draft financial statement for the year 2025, which will be submitted for approval to the Shareholders’ Meeting to be held in first call in Turin on 23 April 2026. The Reply Group closed 2025 with a consolidated turnover of €2,483.6 million, an increase of 8.0% compared to €2,300.5 million in 2024. All indicators are positive for the period. Consolidated EBITDA was €467.6 million, an increase of 13.9% compared to €410.6 million at December 2024. EBIT, from January to December, was at €391.7 million, which is an increase of 18.5% compared to €330.4 million at December 2024. The Group net profit was at €250.9 million. In 2024, the corresponding value was €211.1 million. Following the results achieved in 2025, the Reply Board of Directors decided to propose to the next Shareholders’ Meeting a dividend distribution of €1.35 per share, which will be payable on 20 May 2026, with dividend date set on 18 May 2026 (record
LZE GmbH Introduces Fraunhofer’s RFicient® Technology to the Market12.3.2026 15:51:00 EET | Press release
LZE GmbH is expanding its technology transfer portfolio and making the RFicient® ultra-low-power wake-up receiver technology from the Fraunhofer Institute for Integrated Circuits IIS available for the first time as a standard chip for close-to-production industrial applications. The solution enables energy-efficient IoT designs that remain continuously reachable while consuming only microamps – a key step for long-lasting, low-maintenance IoT products. LZE GmbH drives technology transfer to market: standard chip availability for close-to-production applications As a bridge between research and industry, LZE GmbH is making it easier for companies to access innovative technologies and helping them to quickly and reliably transform new developments into market-ready solutions. With RFicient®-IC (FH101RF), LZE is providing another high-tech product that comes directly from Fraunhofer research and can now be ordered in volume and integrated into close-to-production product development for t
Owkin Creates New Spin out Waiv, Formerly Owkin Dx, With $33M Financing12.3.2026 15:30:00 EET | Press release
Owkin, the AI company on a mission to solve the complexity of biology, today announced the spin out of Waiv, formerly known as Owkin Dx. The move follows significant investor interest and positions Waiv to bring AI-powered precision testing for better identification of patients in the clinic and in clinical trials, to transform patient care. This follows on from the successful launch of Bioptimus, an Owkin incubated company, in February 2024. Waiv translates AI innovation into real-world clinical impact, developing tests that predict biomarkers and patient outcomes, including RlapsRisk BC for prognostic risk profiling. With multiple tests already in use in clinical settings, its deployment platform Destra, and collaborations with leading pharmaceutical companies, including MSD since 2023 for MSIntuit, Waiv is establishing itself as a leader in translational medical AI. Waiv leverages a decade of Owkin's foundational medical AI research, including access to an extensive patient data net
RQM+ Launches SMART Solutions Life Cycle Partnership Model12.3.2026 15:30:00 EET | Press release
RQM+, a leading MedTech CRO offering regulatory consulting, clinical trial, laboratory, and reimbursement services, today announced the launch of SMART Solutions, a life cycle partnership model designed to help medical device and diagnostics companies manage growing regulatory and development complexity. SMART Solutions introduces a strategy-led operating framework that unifies regulatory, quality, clinical, reimbursement, and laboratory expertise to support MedTech companies across the entire product life cycle to help reduce risk from early development through post-market. “MedTech companies are navigating unprecedented complexity as regulatory expectations evolve, product innovation accelerates, and post-market expectations are expanding,” said John Potthoff, Ph.D., chief executive officer of RQM+. “SMART Solutions moves beyond traditional consulting by providing an integrated life cycle partnership that helps sponsors gain earlier clarity, reduce risk, and execute complex programs
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
