I-PEX and Teramount Announce Collaboration on Detachable Fiber Interconnect for Silicon Photonics
I-PEX, a leader in the field of high-frequency and high-speed transmission connectors and Teramount Ltd, the leader in silicon photonics fiber packaging, today announced they are collaborating to advance silicon photonics optical detachable connectivity for data centers and for other high-speed datacom and telecom applications.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230302005012/en/
Detachable Photonic Plug for co-packaged optics serviceable fiber assembly (Photo: Teramount)
The ever-growing demand for high bandwidth, low power and low latency in networking and advanced computing applications has led to growing adoption of silicon photonics, and for a continuous need to connect more and more optical fibers to silicon chips. That connectivity needs to be reliable, reworkable, serviceable, and cost-effective, which creates a huge challenge. The collaboration between I-PEX and Teramount will provide a breakthrough solution of detachable fiber to chip connectivity based on Teramount’s self-aligning optics technology and I-PEX’s ultra-precision plug and holder systems.
“Detachable fiber connectivity to silicon photonic chips is a game changer for the industry. We have recently seen a growing number of customers who are interested in Teramount's Detachable Photonic Plug for their silicon photonics applications, as it enables a new era of serviceable and reliable fiber connectivity solutions” said Hesham Taha, chief executive officer. “I-PEX is a leader in the connector industry, and we are thrilled to partner with them to advance our technology to high volume industrial grade level manufacturing”
“We are very pleased to support the realization of Teramount's ground-breaking Detachable Photonic Plug concept with I-PEX's ultra-precise design and manufacturing capabilities” said Koichi Fujii, general manager, marketing of I-PEX. "We look forward to working with them to help penetrate silicon photonics solutions into data centers and other applications”
About I-PEX:
I-PEX is a unique and high-quality manufacturer of the world's most advanced connectors, sensors, complex molded parts, and other products based on the ultra-precision manufacturing process that has been perfected over the past 60 years. I-PEX, as an innovative product development and engineering solutions expert, is committed to exceeding the customer expectations around the world through global teamwork, aiming to be the company that our customers choose first. For more information, visit www.i-pex.com
About Teramount
Teramount changes the world of optical connectivity by offering a novel solution for connecting optics to silicon for data center, advanced computing, sensors and other datacom and telecom applications. Its innovative PhotonicPlug solution provides scalable connectivity of fibers to photonic chips and aligns photonics with standard semiconductor high-volume manufacturing and packaging capabilities. Teramount office is located in Jerusalem Israel. for more information, visit www.teramount.com
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230302005012/en/
Contact information
Teramount Contacts:
Hesham Taha
Chief Executive Officer
Teramount Ltd.
Tel: + 972 50 641 9792
E-mail: info@teramount.com
I-PEX Contacts:
Koichi Fujii
General Manager, Marketing
I-PEX Inc.
Tel : + 81 45 472 7111
URL: www.i-pex.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
INNIO to Supply Technology for a Landmark Project in Texas, Reinforcing Grid Stability12.12.2025 10:59:00 EET | Press release
INNIO Group, a leading energy solution and service provider, is collaborating with the U.S. power utility Greenville Electric Utility System (GEUS) on a landmark 104-megawatt (MW) power plant. The new plant is designed to help reinforce grid stability, cover peak loads, and enable greater integration of renewable energy. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251211712708/en/ Jenbacher J920 FleXtra “This project is a milestone for Texas and for INNIO. With fast-start capability, flexibility, and sustainability, we are creating the energy infrastructure that modern grids need: reliable, growth-promoting, and supporting the expansion of renewables,” said Dr. Olaf Berlien, President and CEO of INNIO Group. Groundbreaking for the plant’s construction took place in early December, with commissioning scheduled for summer 2027. The groundbreaking marks the beginning of the largest installation to date of Jenbacher J920 FleX
Kioxia Develops Core Technology that Will Allow the Practical Implementation of High-density, Low-power 3D DRAM12.12.2025 07:24:00 EET | Press release
Kioxia Corporation, a world leader in memory solutions, today announced the development of highly stackable oxide-semiconductor channel transistors that will enable the practical implementation of high-density, low-power 3D DRAM. This technology was presented at the IEEE International Electron Devices Meeting (IEDM) held in San Francisco, USA, on December 10, and has the potential to reduce power consumption across a wide range of applications, including AI servers and IoT components. In the era of AI, there is growing demand for DRAM with larger capacity and lower power consumption that can process large amounts of data. Traditional DRAM technology is reaching the physical limits of memory cell size scaling, prompting research into the 3D stacking of memory cells to provide additional capacity. The use of single-crystal silicon as the channel material for transistors in stacked memory cells, as is the case with conventional DRAM, drives up manufacturing costs, and the power required t
BEYOND Developments Reveals a New Vision for Purposeful Living on Dubai Islands with SIORA11.12.2025 19:02:00 EET | Press release
BEYOND Developments, the bold and design-led real estate developer shaping next-generation waterfront destinations in the UAE, today unveiled SIORA, its first beachfront masterplan on Dubai Islands and the company’s second large-scale community within a year. The launch underscores BEYOND’s accelerated growth and strong alignment with Dubai’s future urban vision. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251211014389/en/ BEYOND Developments - SIORA Masterplan at sunset - Dubai Islands (Photo: AETOSWire) Spanning over 2M square feet, SIORA is conceived as a coastal sanctuary inspired by Japanese garden philosophies, including the pursuit of Ikigai, the Japanese concept of finding purpose and fulfilment in everyday life. In this context, it reflects a philosophy of creating spaces that bring clarity, balance, and a sense of meaning, where architecture nurtures wellbeing and restores harmony between people, nature, and pla
3Degrees Welcomes David Dines to Board of Directors11.12.2025 18:00:00 EET | Press release
3Degrees, a global leader in renewable energy and climate solutions, is pleased to announce the appointment of David Dines to its Board of Directors, effective December 8, 2025. Dines brings more than four decades of leadership experience across global energy, commodities, financial services, transportation, and industrial markets. He served on the executive team as Chief Financial Officer and Corporate Senior Vice President at Cargill, Inc., the largest privately held company in the United States, where he oversaw enterprise-wide financial strategy, capital deployment, and financial performance. During his 29-year career at Cargill, Dines led multiple global businesses, played key roles in major technology and process transformations, and was a member of Cargill’s Commodity Risk, Financial Risk, and Process, Data, and Technology Committees. “We are thrilled to welcome David to the 3Degrees board,” said Philippe Vedrenne, CEO, 3Degrees. “He has an exceptional command of financial stewa
ITC Infotech wins PTC Partner Network Award for FY25 in the PLM Category11.12.2025 16:40:00 EET | Press release
ITC Infotech, a leading global technology services and solutions provider, has been awarded the PTC Partner Network Award for FY25 in the Product Lifecycle Management (PLM) category. This prestigious recognition, awarded to a single partner globally, celebrates excellence in deploying Enterprise PLM software, enabling global and cross-functional teams to effectively manage product data and providing a trusted system for product information. The award underscores ITC Infotech’s leadership in PLM-led digital transformation, as well as its strategic alignment with PTC’s Intelligent Product Lifecycle vision, which helps customers build a structured product data foundation that serves as the backbone for AI-driven transformation. Through its specialized DxP Services, ITC Infotech has helped enterprises transform and modernize their product development lifecycle processes, seamlessly transition to SaaS ecosystem and build digitally connected, intelligent and future-ready solutions to acceler
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
