Inspur Information and NEC Deutschland Launch an HPCaaS Solution Accelerating Automotive Design Simulation in Europe
31.5.2022 10:09:00 EEST | Business Wire | Press release
Inspur Information, a leading IT infrastructure solutions provider, and NEC Deutschland, an HPC solutions provider for scientific and engineering applications, have joined forces to provide an HPC as a Service (HPCaaS) solution for computer-aided engineering (CAE) to auto manufactures in Europe. Inspur and NEC seek to bring infrastructure resilience and energy efficiency to high-performance computing (HPC) via on-demand usage, deep integration, and advanced cooling technologies.
In Automotive R&D, design verification is the most lengthy and expensive process in vehicle development, including real-life collision testing. However, an HPC cluster powering CAE applications can virtualize this process. Simulations can be performed faster, and without the expense of damaging real vehicles. The joint HPCaaS solution with Inspur-powered hardware and NEC system integration and implementation, allows for precise CAE simulations, such as vehicle crash simulations, computational fluid dynamics (CFD), structural mechanics, wind resistance, wind noise, thermal management, fatigue durability, welding simulation, stamping analysis, noise analysis, etc. This solution can provide more flexible and scalable computing resources and efficiency to meet the needs of customers' on-demand requirements.
The use of Inspur’s leading HPC servers for automotive CAE, greatly improve performance, lower energy consumption, and reduce data center space requirements by up to 50%. This results in virtualized simulations that are environmentally friendly, increased development speed, and a reduction in new vehicle R&D costs by up to 70%. This power is further harnessed via Inspur’s parameter tuning and application optimization for CAE simulations, along with NEC’s rich experience in system integration.
A German auto manufacturer with an annual production of over 450,000 vehicles is one of the largest recipients of this new HPC solution for CAE automotive manufacturing from Inspur and NEC. The company required powerful and green HPC clusters to support its manufacturing development over the next 3-4 years as part of an overall HPCaaS concept.
The Inspur-NEC HPC cluster significantly improved HPC performance for this auto manufacturer while still fulfilling the requirements for environmental sustainability, restricted power consumption, and reduced TCO. It utilizes Inspur’s NF5180M6 1U dual-socket rack server for maximum performance, high-density, and low power consumption.
The Inspur NF5180M6 servers are powered by 3rd Generation Intel® Xeon® Scalable processors, DDR4 3200MhHz memory, and Mellanox's latest HDR InfiniBand network, giving it the ultimate performance-to-size ratio in a petite 1U chassis. Trapezoidal radiators increase the surface area for improved heat dissipation and the BMC control strategy is optimized for peak efficency. This reduces fan power consumption, and enables support up to two 270W high-performance CPUs. Further power savings comes from an advanced platinum power supply that limits energy losses to less than 5%. Using the same power consumption levels, Inspur’s NF5180M6 performance in collision simulations improved by 30% compared to previous generation solutions.
This is a testament to Inspur’s ability to design infrastructure solutions that are both green and powerful, offering improved utilization of CAE software applications and collision simulation in the fields of engine development, cooling systems, vehicle flow field, and aerodynamic development design. With its green and efficient HPC server products, Inspur helped this automotive manufacturer run multiple HPC subsystems and more than 150 CAE applications that satisfy performance requirements, significantly reduce TCO, and promote environmental sustainability.
“Demand for vehicle personalization, autonomous driving, and electrification is growing,” said Liu Jun, Vice President of Inspur Information and General Manager of AI and HPC. “The automotive industry’s R&D investment in the field of high-performance computing continues to grow. The joint solution with NEC Deutschland will help automobile companies to improve competitiveness, innovation, and efficiency.”
Yuichi Kojima, Managing Director at NEC Deutschland said that “Computing power is fundamental to innovation speed and product quality. Based on Inspur’s high performance products and energy-saving technologies, and our capability to meet customers’ demands faster and easier, we can help Europe advance its digitalization efforts and be a showcase for sustainable development.”
Inspur Information is the world’s second largest server provider. Its servers and solutions have been widely used in various industries globally. According to Gartner, Inspur server shipments ranked second worldwide in 2021 with a 9.4% market share. It is a member of the European Technology Platform for High Performance Computing (ETP4HPC) and is committed to co-building an ecosystem boosting the development of HPC industry in the region.
About Inspur Information
Inspur Information is a leading provider of data center infrastructure, cloud computing, and AI solutions. It is the world’s 2nd largest server manufacturer. Through engineering and innovation, Inspur Information delivers cutting-edge computing hardware design and extensive product offerings to address important technology sectors such as open computing, cloud data center, and AI. Performance-optimized and purpose-built, our world-class solutions empower customers to tackle specific workloads and real-world challenges. To learn more, visit https://www.inspursystems.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20220531005362/en/
Contact information
Fiona Liu
PR Manager
Inspur Information
liuxuan01@inspur.com
Constanze Kreil
constanze.kreil@allisonpr.com
+49 (0)151 210 289 97
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Biocytogen Announces Clinical Milestone with First Patient Dosed in Phase 1 Trial of IDEAYA’s First-in-Class B7H3/PTK7 Bispecific TOP1 ADC IDE03428.2.2026 02:00:00 EET | Press release
Biocytogen Pharmaceuticals (Beijing) Co., Ltd. (Biocytogen, SSE: 688796; HKEX: 02315), a global biotechnology company that drives the research and development of novel antibody-based drugs with innovative technologies, today announced that its partner IDEAYA Biosciences, Inc. (“IDEAYA”; Nasdaq: IDYA) has dosed the first patient in IDEAYA’s Phase 1 dose-escalation/expansion clinical trial of IDE034, an investigational B7H3/PTK7 bispecific TOP1 ADC. Pursuant to the companies’ option and license agreement, first patient dosing triggers a $5 million milestone payment to Biocytogen. According to IDEAYA, the Phase 1 study is designed to characterize IDE034’s safety profile, tolerability, and PK as a monotherapy, and IDEAYA also intends to evaluate combination regimens with DNA damage response (DDR) -targeting agents such as its oral PARG inhibitor IDE161 as the program advances. IDE034 is a potential first-in-class bispecific B7H3/PTK7 TOP1 ADC, independently developed by Biocytogen and lice
IQM and Real Asset Acquisition Corp. to Host Conference Call/Webcast to Discuss Proposed Transaction27.2.2026 14:00:00 EET | Press release
IQM Finland Oy, a global leader in full-stack superconducting quantum computers (“IQM”, “IQM Quantum Computers” or the “Company”), and Real Asset Acquisition Corp. (Nasdaq: RAAQ), a special purpose acquisition company (“RAAQ”), announced that they will host a conference call to discuss their recently announced business combination, including certain transaction highlights. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260227472716/en/ IQM Radiance quantum computer As previously disclosed, on February 23, 2026, IQM and RAAQ announced they have entered into a definitive business combination agreement, which will result in IQM becoming a public company and listing American Depositary Shares on one of the two leading U.S. stock exchanges. The transaction provides funding with the aim to accelerate IQM’s technology and commercial development towards fault-tolerance quantum computing, further advancing its position as a leading p
HighRadius Launches $0 Implementation Fee, $0 Subscription Fee via Outcome Based Pricing for oCFO Software27.2.2026 13:00:00 EET | Press release
HighRadius launches Office of the CFO first Outcome Based Pricing with $0 Implementation fee and $0 Subscription until Go-Live. Customers only pay a fraction of realized gains based on P&L impact. Chapter 1: Outcome Based Pricing (OBP) Introduction of OBP: HighRadius, a provider of 190+ AI agents for Order-to-Cash, Accounts Payable, Record-to-Report, and Treasury introduces Outcome Based Pricing (OBP). Three Components of OBP: Customers pay a) $0 in Implementation fees, b) $0 in Subscription fees until Go Live, c) HighRadius earns a fraction of the actual savings realized by the client. Chapter 2: US GAAP & ASC 606 Constraints Not Designed for Innovation: The traditional ASC 606 model requires companies to standardize and recognize revenue based on contractual obligations. For a traditional SaaS subscription, the obligation is access to software over time. AI agents are designed to deliver quantifiable, real-time Business Outcomes that do not fit the traditional accounting framework. C
Kioxia Appoints Yoshihiko Kawamura as Chief Financial Officer27.2.2026 10:15:00 EET | Press release
Kioxia Holdings Corporation (TOKYO:285A), a world leader in memory solutions, today announced the appointment of Yoshihiko Kawamura as Chief Financial Officer (CFO), effective April 1, 2026. Mr. Kawamura brings extensive international experience to Kioxia, having held assignments at Mitsubishi Corporation’s U.S. headquarters, served as General Manager of its Chicago office, and completed a tenure at the World Bank. At Hitachi, Ltd., he held senior leadership positions, including Chief Strategy Officer (CSO), Chief Financial Officer (CFO), and Chief Risk Management Officer (CRMO), where he was instrumental in leading the company’s management reforms. Since joining Kioxia as Executive Vice President in June 2025, Mr. Kawamura has worked closely with the executive team to advance the business through strategic capital and financial planning. Following its initial public offering on the Prime Market of the Tokyo Stock Exchange in December 2024, Kioxia is entering a new phase of growth char
DNP Invests in Rapidus to Support the Establishment of Mass Production for Next-Generation Semiconductors27.2.2026 09:18:00 EET | Press release
Dai Nippon Printing Co., Ltd. (DNP, TOKYO:7912) today announced that it has participated in Rapidus Corporation’s funding round as one of the round investors. This strategic funding initiative supports Rapidus’ plan to steadily progress from its current R&D phase to mass production of 2nm (10⁻⁹ meters) logic semiconductors by 2027. Through this initiative, DNP will advance the development and mass production of EUV lithography photomasks and support Rapidus as it establishes a mass production system for 2nm & next-generation semiconductors. Background In recent years, the rise in energy consumption, in line with increased data generation, has become a challenge, driving demand for next-generation semiconductors capable of improving device performance and reducing power consumption. Next-generation semiconductors manufactured using EUV lithography enable the formation of finer patterns on silicon wafers compared to currently available technologies. This in turn is boosting expectations
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
