Inspur Information Releases 2020 Global Computing Index Report
26.2.2021 11:07:00 EET | Business Wire | Press release
Inspur Information, a leading IT infrastructure solutions provider, has sponsored an International Data Corporation (IDC) white paper on the 2020 Global Computing Index (henceforth referred to as The Report). As the world’s first index report on computing, The Report unveils the relationship between computing power and economic development and serves as a reference for the outlook of the global digital economy.
Global digital transformation has entered a phase marked by exponential growth in innovation, with the size of the digital economy projected to continue on an upward trend. As a key factor that underlies digital technology development, computing is now defining the productivity of the digital economy era. According to The Report, economic growth directly correlates with the development of computing—one point of growth in the computing index translates to a 3.3‰ rise in the size of the digital economy and a 1.8‰ growth in GDP. Specifically, AI computing market share is projected to continue on this upward trajectory. Research on computing markets in sample countries shows that AI computing market share has grown from 7% in 2015 to 12% of the overall computing market in 2019 and is expected to reach 23% in 2024. With the largest number of hyper-scale data centers in the world, the United States has demonstrated its strong infrastructure support for computing power growth, ranking first on the index ranking with a score of 75. In second place with a score of 66 is China, followed by Japan (55), Germany (52), and the United Kingdom (47).
The Global Computing Index represents a year-long joint effort by Inspur Information and IDC. The Report, covering Australia, Brazil, China, France, Germany, Japan, Russia, South Africa, the United Kingdom, and the United States, offers a comprehensive assessment of computing power across four dimensions: computing capacity, computing efficiency, application level, and infrastructure support.
Zhang Dong, vice president of Inspur Information, noted that "the application of emerging technologies, especially AI, will be driving the advancement of computing. As the volume of data and the complexity of algorithms continues to rise, computing will be the determining factor for the AI development ceiling.”
Computing Defines Productivity in the Digital Economy Era; Synchronized Development of Emerging Technology Applications and Computing will Foster Economic Growth
The development of emerging technologies and computing are mutually beneficial in that computing power provides infrastructure support for emerging technologies, which in turn pushes forward the evolution of computing. IoT, AI, and big data are among the major emerging technologies.
In 2020, the global spending on AI by enterprises was forecast to be US$49.87 billion, and this number is estimated to reach US$96.28 billion by 2023. The development of AI is driven by the advancement in computing, data, and algorithms, and sufficient computing power is necessary for the processing of large amounts of data using complex algorithms. The widespread application of IoT will give rise to the fast advancement of edge computing, which has already reshaped IT infrastructure and will revolutionize computing, storage, and networks. Cloud computing is the most important means for improving computing efficiency. IT infrastructure that supports same-pace development of cloud and edge will enable applications of emerging technologies, improve computing power, and eventually reap bigger economic rewards. AI, IoT, cloud computing, and other emerging technologies will be the main drivers for IT spending in the future.
Inspur Empowers Computing Power Upgrade through Investment in Open Computing and Artificial Intelligence
The Report builds a comparative formula between computing power and economic development and serves as a reference for countries to improve their computing power and economic competitiveness. The digital economy is a significant component of GDP and computing is the foundation for the development of the digital economy.
As a leading force in emerging technologies, Inspur is the only server vendor who has joined all major open computing organizations, including OCP (Open Compute Project), ODCC and Open19, and is a Gold Member of OpenStack. Inspur leads the OpenRMC subproject, which focuses on next-generation data center management standards, and is an active member in OAM specification, the Scorpio Project, and the OTII for establishing edge computing standards.
In artificial intelligence, Inspur is the chair of SPEC ML, the Technical Committee on Machine Learning under the international evaluation organization SPEC. While working closely with leading tech companies in AI systems and applications, Inspur leads SPEC ML in the development of AI Test specifications and related benchmarks. As of today, Inspur has the most complete array of GPU servers in the industry with nearly 20 computing platforms supporting GPU numbers ranging from 4 to 64. Inspur also provides ultimate-design GPU servers such as the Inspur NF 5488A5, a 19-time record-setting server in the MLPerf benchmarks. Inspur currently offers full-stack AI capabilities including AI Computing Platform, AI Resource Suite, and Algorithm Toolkit.
Please click for more insights from the report.
About Inspur Information
Inspur Electronic Information Industry Co., LTD is a leading provider of data center infrastructure, cloud computing, and AI solutions, ranking among the world’s top 3 server manufacturers. Through engineering and innovation, Inspur delivers cutting-edge computing hardware design and extensive product offerings to address important technology arenas like open computing, cloud data center, AI and deep learning. Performance-optimized and purpose-built, our world-class solutions empower customers to tackle specific workloads and real-world challenges. To learn more, please go to en.inspur.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210226005020/en/
Contact information
Fiona Liu
Inspur Information
liuxuan01@inspur.com
Vivian Dadamio
vivian@allisonpr.com
+49 89 3888 920 10
+49 (0)176 32 666 550
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
BOCHK and Ant International Forge Strategic Partnership to Enhance Cross-border Payment Connectivity and Innovative Corporate Financial Service Solutions Through Fintech20.8.2026 09:00:00 EEST | Press release
Ant International and Bank of China (Hong Kong) (“BOCHK”) announced that the two parties have forged a strategic partnership. Leveraging BOCHK’s banking strengths and Ant International’s leading fintech and AI technologies, the two parties seek to explore the frontier of AI-driven innovative financial services, empower real-time treasury management and cross-border payments, deliver efficient and intelligent liquidity management and financial service solutions for global enterprises, while continuously enhancing financial services for small and medium-sized enterprises (“SMEs”). This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260819555366/en/ From left to right: Kelvin Li, General Manager of Platform Tech and Senior Vice President of Ant International, Eric Jing, Chairman of Ant International, Sun Yu, Vice Chairman and Chief Executive of BOCHK, and Wang Huabin, Deputy Chief Executive of BOCHK Sun Yu, Vice Chairman and Chief E
Ant International’s FalconTST Model 2.0 Achieves SOTA, Elevating Predictive AI Application in Finance to New Levels20.8.2026 04:55:00 EEST | Press release
Ant International has introduced Falcon Time-Series Transformer (TST) AI Model 2.0, its most advanced TST model so far designed to deliver more accurate forecasting in real-world FX risk management of cross-border payments, with more industry applications to come, such as demand forecasting for supply chain management for e-commerce platforms, and predictive operations management for aviation industry. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260819055561/en/ Falcon TST Time-Series Transformer Al Model 2.0 FalconTST 2.0 demonstrates State-of-the-Art (SOTA) performance on the Mean Absolute Scaled Error (MASE) metric on a top global public evaluation benchmark for time-series foundational models. MASE is among the most critical metrics used to evaluate time-series models. FalconTST 2.0 achieved a MASE score of 0.666 and places it at the top of the leaderboard, surpassing other TST foundational models from leading global
Grid Dynamics Earns MACH Alliance's 2026 Agent Ready Award for Production-Scale Agentic AI19.8.2026 23:05:00 EEST | Press release
Grid Dynamics Holdings, Inc. (Nasdaq: GDYN) (“Grid Dynamics”), a premier AI transformation partner for the Fortune 1000, today announced it has earned MACH Alliance's 2026 Agent Ready Award, becoming one of 35 companies named in the program's inaugural cohort. Agent Ready is an advanced certification that builds upon MACH Certification, the MACH Alliance's baseline standard for open, composable, and connected technology. The honor recognizes certified members that have moved agentic AI from pilots and demos into production, at scale, with the guardrails enterprise deployment requires. Every award is independently reviewed by MACH Alliance, the vendor-neutral authority on scaling production-ready enterprise AI without vendor lock-in. For companies like Grid Dynamics, Agent Ready criteria evaluate organizational readiness at scale: named leadership, market presence, published thought leadership and production delivery. Grid Dynamics met that bar with agentic AI programs built and deliver
Xsolla Announces Multi-Year Strategic Partnership With the Good Game Club Podcast to Amplify Positive Stories From the Global Games Industry19.8.2026 19:10:00 EEST | Press release
Xsolla, a global video game commerce company, today announced a multi-year strategic partnership with Good Game Club, the independent, global podcast dedicated to sharing positive stories from the gaming ecosystem. The partnership builds on a broader effort to support the developers, publishers, and creators shaping the future of the games industry in a positive way by supporting good stories from the human side of video game businesses. The partnership spans the global events calendar, with joint podcast recordings planned each year at gamescom in Cologne and the Game Developers Conference (GDC) in San Francisco. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260819127662/en/ Graphic: Xsolla Xsolla and Good Game Club will collaborate on recurring editorial segments and deep-dive episodes exploring studios and stories from every corner of the industry, from up-and-coming teams to mid-tier and established developers. The coll
KAGA FEI Expands Its Software-Embedded Bluetooth Low Energy Module Lineup with ES4L15MA1 and EC4L15MA119.8.2026 17:00:00 EEST | Press release
KAGA FEI Co., Ltd., a global provider of advanced short-range wireless modules, announced today the development of the ES4L15MA1 and EC4L15MA1 Bluetooth Low Energy modules with embedded software for wireless communication. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260802953307/en/ ES4L15MA1 (left) and EC4L15MA1 (right) sample modules These products are versions of KAGA FEI’s ES4L15BA1 and EC4L15BA1 wireless modules with embedded software, which use Nordic Semiconductor’s nRF54L15. Because the modules include the functions required for Bluetooth Low Energy communication, device manufacturers can develop products in a shorter period without having to develop wireless communication software from scratch. The modules help reduce software development workloads, shorten product development cycles, and lower development costs for a wide range of IoT devices. The need for wireless connectivity in IoT applications is growing acr
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
