Business Wire

ITT’s Connector Business Introduces Veam MOVE-MOD™, Delivering True Modularity in Circular Interconnects

30.11.2021 19:03:00 EET | Business Wire | Press release

Share

November 30, 2021-- ITT Inc.’s (NYSE: ITT) connector business introduces its ruggedized, modular circular series Veam MOVE-MOD™. The flexible design delivers power, signal, and data in a single connector by utilizing a range of snap-in modules with various contact layouts to match individual system requirements. Developed for use in harsh environments, these ultra-durable connectors are suitable for a wide range of applications, including rail, heavy and off-road vehicles, alternative energy and infrastructure, robotics, and other industrial equipment.

“Our customers have relied on Veam connectors to overcome their critical challenges for more than 60 years. MOVE-MOD is a next-generation solution designed to meet their evolving needs,” says Ellen McMillan, Vice President and General Manager Europe, ITT Connect and Control Technologies. “The modular nature of these innovative connectors give long-term flexibility to adapt, convert and expand connectivity post-design-in by simply swapping out modules.”

One key advantage the circular MOVE-MOD series has over its rectangular equivalents is its suitability for size-restricted applications. In comparison to standard rectangular connectors with equivalent pin counts, MOVE-MOD has a condensed footprint. Toolless assembly and installation combined with ultra-secure bayonet coupling that features visual, tactile, and audible secondary locking confirmation ensure MOVE-MOD is a fast and easy solution to work with.

The series is available in two ultra-harsh-environment, RoHS and REACH compliant plating options that deliver 500-hour salt spray resistance. The first option is the proprietary Blue Generation® plating is a high-performance Zinc Nickel formulation that is conductive and offers excellent RFI shielding. While the second option, Black Hard Anodized plating, is a popular non-conductive option, also for use in extreme environments.

Additional key features of the MOVE-MOD series include:

  • Minimized component requirements deliver time and cost efficiencies
  • IP67 environmental sealing
  • Minimum of 500 mating cycles
  • Wide operating temperature range (-55°C to -115°C)
  • RoHS and REACH compliance

For more information about the MOVE-MOD series of modular, circular interconnects, please visit: www.ittcannon.com

About ITT

ITT is a diversified leading manufacturer of highly engineered critical components and customized technology solutions for the transportation, industrial, and oil and gas markets. Building on its heritage of innovation, ITT partners with its customers to deliver enduring solutions to the key industries that underpin our modern way of life. ITT is headquartered in White Plains, N.Y., with employees in more than 35 countries and sales in approximately 125 countries. For more information, visit www.itt.com

About ITT's Connect and Control Technologies Business

ITT's Connect and Control Technologies business designs and manufactures harsh-environment connectors and critical energy absorption, motion, flow and environmental control components. Through leading brands such as Aerospace Controls, BIW Connector Systems, Cannon, Compact, Enidine and Veam, the business serves customers in the aerospace, automation, defense, energy, industrial, infrastructure and transportation markets.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

Contact information

Business Media:
Kellie Harris
+1 914 216 4025
kellie.harris@itt.com

Trade Media:
Nigel Steel
+44 7738 682837
nigel.steel@publitek.com

Customers:
Richard Miles
+44 (0)7920 266088
richard.miles@itt.com

About Business Wire

For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

TreviPay Partners with Dynatos to Add e-Invoicing Capabilities to its B2B Payments Infrastructure15.9.2026 08:00:00 EEST | Press release

TreviPay, a global B2B payments infrastructure partner, today announced a partnership with Dynatos to expand e-invoicing capabilities for TreviPay clients operating across Europe and other markets. Through the partnership, Dynatos Routty Cloud proposition will provide embedded e-invoicing technology and compliance support, helping TreviPay clients exchange invoices across different formats, networks and country requirements in Europe and other global markets. E-invoicing requirements continue to expand across Europe and other global markets, adding complexity for businesses managing invoices across more than 60 countries with mandates announced or already in place. At the same time, invoicing has become an increasingly important part of the B2B buyer experience. TreviPay research found 68% of B2B buyers are more likely to choose a supplier offering invoice terms, up from 51% in 2023. As businesses expand across markets, delivering the invoicing experience buyers expect also requires na

Meiji Group to Showcase Japanese-Quality CMO/CDMO Services and a Global Manufacturing Network at CPHI Milan 202615.9.2026 08:00:00 EEST | Press release

Meiji Seika Pharma Co., Ltd. (HQ: Chuo-ku, Tokyo; President and CEO: Toshiaki Nagasato) will debut as the Meiji Group’s Pharmaceutical Segment at CPHI Milan 2026, at Fiera Milano, Milan, Italy, October 6–8, 2026. At the exhibition, the Meiji Group’s Pharmaceuticals Segment will showcase 80 years of expertise in Japanese standard quality control, manufacturing, and supply network from Japan to Europe, India, and Southeast Asia. It will also highlight group-wide contract manufacturing, from development to supply, tailored to customer needs. Through the exhibition, Meiji Seika Pharma aims to raise global awareness of the Meiji Group’s Pharmaceutical Segment, its brands, capabilities, production capacity, and contract manufacturing services, and to forge new global partnerships to expand its CMO/CDMO business. “CPHI Milan 2026” Exhibition Overview Exhibition Name: CPHI Milan 2026 Dates: October 6 (Tue) – 8 (Thu), 2026 Venue: Fiera Milano (Milan, Italy) Exhibition Area: CMO Area Booth Numbe

Signaloid joins Open Chiplet Atlas Alliance and Announces Plans to Make Its UxHw ASICs Available via OCA Ecosystem15.9.2026 07:00:00 EEST | Press release

British compute hardware company Signaloid has joined the Open Chiplet Atlas (OCA) and announced plans to make its UxHw® compute acceleration technology available as chiplets within the OCA ecosystem. The UxHw technology targets AI and simulation workloads that rely on stochastic methods, including quantitative finance, reinforcement learning, engineering simulations, and world models. The announcement follows Signaloid’s recent tapeout of a UxHw ASIC for robotics and physical AI in an ultra-low-power TSMC process. “The Open Chiplet Atlas (OCA) increases innovation in chip design by defining an open architecture for multi-vendor chiplet interoperability. In doing so, it enables new Systems-in-Package (SiPs) with reduced non-recurring engineering (NRE) costs and a vastly expedited time-to-market,” says Wei-han Lien, Chief CPU Architect and Senior Fellow of Tenstorrent. “We are thrilled to welcome Signaloid to the OCA ecosystem. Their unique, innovative accelerator for stochastic workloa

Rimini Street and Datacom Announce Strategic Partnership to Accelerate AI Adoption and Drive IT Optimisation Across ANZ14.9.2026 23:00:00 EEST | Press release

Rimini Street Inc. (Nasdaq: RMNI), the Software Support and Agentic AI ERP Company™ and the leading third-party support provider for Oracle and SAP software, today announced a strategic partnership with Datacom, one of Australasia’s largest homegrown technology services and solutions providers. The reseller agreement will see Datacom offer Rimini Support™ for Oracle and SAP software to its public and private sector customers across Australia and New Zealand. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260914070894/en/ Rimini Street and Datacom Announce Strategic Partnership to Accelerate AI Adoption and Drive IT Optimisation Across ANZ This collaboration brings together Rimini Street's third-party software support, trusted by thousands of leading organisations including Fortune Global 100, Fortune 500, midmarket, public sector and government agencies, with Datacom’s extensive market presence and implementation expertise.

Lattice to Showcase Next Gen Automotive Sensing Innovations at AutoSens Europe 202614.9.2026 23:00:00 EEST | Press release

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced its exhibition plan for the upcoming AutoSens Europe 2026, taking place on Sept. 22 – 24, 2026, in Barcelona, Spain. As part of the event, Lattice will deliver a technical presentation and host a demo showcase focused on how its low power FPGA solutions are enabling next-generation automotive sensing, ADAS, and in-vehicle networking applications. Who: Lattice Semiconductor What / When (GMT+2): Sept. 22 – 24, 2026 Lattice Demo Showcase at Booth #215 from local dimming, camera monitoring system, sensor security, and more. Presentation (Sept. 23 at 2:30 p.m., Room 5) “Efficient 360° threat detection for parked vehicles – A distributed, event-driven approach” Where: La Farga de L’Hospitalet, Barcelona, Spain AutoSens Europe is the automotive industry's premier conference and exhibition for perception systems, ADAS, and autonomous vehicle technology. Bringing together over 1,000 en

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye