Jumbo and Hanshow announce a new partnership to digitize over 700 stores
23.11.2022 10:00:00 EET | Business Wire | Press release
Jumbo, the second largest supermarket chain in the Netherlands which also has stores in Belgium, has announced an exclusive partnership with global retail solutions provider Hanshow to digitally transform its network of stores.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20221117005660/en/
Hanshow's electronic shelf labels (ESLs) installed at Jumbo (Photo: Business Wire)
Jumbo was founded in 1921 and currently owns more than 700 stores in the Netherlands and Belgium. It is locally renowned for its wide range of selections and personalized attention to both customers and employees.
With the digital transformation of its business model, Jumbo is becoming one of the leading retailers in Europe. This is driven in part by the Jumbo Tech Campus which facilitates the innovation of Jumbo’s digital solutions and channels to connect its online and offline retail business while strengthening relationships with customers.
The collaboration with Hanshow is a crucial move in Jumbo's digitization strategy. To date, Hanshow’s solutions have been rolled out in over 250 stores. Soon Jumbo will have upgraded all 700 of its stores, with over 11 million Hanshow electronic price tags installed.
“The unique Jumbo formula revolves around a large assortment with the best service at low prices. Correct prices on the shelf and the ability to react quickly and efficiently to market developments are essential for this. The technology of Hanshow contributes to this.” Jumbo said.
At the heart of this digital transformation with Hanshow, the adoption of over 11 million electronic shelf labels (ESLs) will save time and energy across all Jumbo stores. Hundreds of thousands of paper price tags can be saved by this partnership each year, which is also in line with Jumbo’s abiding goal of sustainability. ESLs dramatically increase efficiency for retail operations such as inventory management and faster order picking with LED flashing functions. Additionally, ESLs improve the customer shopping experience with centralized price updates, error-free labeling, and enhanced store appearance.
Powering the systems management of this massive amount of ESL is made possible by adopting the Hanshow SaaS solution via Microsoft Azure. Benefits for Jumbo include reducing costs spent on infrastructure and servers, and if needed the Hanshow technical support team is capable of helping resolve technical issues much faster. Hanshow’s PriSmart ESL and IoT device management system also allows Jumbo to get the systems up and running sooner and the ability to manage and update its pricing network in a faster, more secure, and more accessible way.
“Hanshow solutions can drive sustainability, improve efficiency, eliminate waste, and create new opportunities for Jumbo stores,” notes Sally Liang, General Manager of Europe, Hanshow. “This is an exciting era for retail, and we’re proud to be partnering with a company like Jumbo that is committed to improving its customer experience and operational efficiency through digital retail transformation.”
The cooperation with Jumbo is a significant achievement for Hanshow’s international development. In the future, Hanshow looks forward to cooperating with global customers to further explore the paths of digital transformation, to further optimize digital store solutions, and to provide more comprehensive, intelligent, and efficient digital service upgrades.
About Hanshow
Hanshow is a global leader in developing and manufacturing electronic shelf labels and digital store solutions, offering global customers a series of world-class customized IoT touchpoints and digital store solutions that deliver customer-centric insights. Hanshow’s solutions are used by over 30,000 stores in more than 50 countries, helping retailers streamline operations, optimize pricing strategies, and offer consumers a more personalized experience. Learn more: www.hanshow.com
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20221117005660/en/
Contact information
Joy Wang
tianjiao.wang@hanshow.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 23:06:00 EET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 23:00:00 EET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 20:50:00 EET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 19:08:00 EET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 17:00:00 EET | Press release
ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent chip teams. ChipAgents is building the foundational AI infrastructure for chip design, with coordinated AI Agents that can plan, reason, execut
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom