Business Wire

Kioxia and Western Digital Announce 6th-Generation 3D Flash Memory

Share

Kioxia Corporation and Western Digital Corp. (NASDAQ: WDC), today announced that the companies have developed their sixth-generation, 162-layer 3D flash memory technology. Marking the next milestone in the companies’ 20-year joint-venture partnership, this is the companies’ highest density and most advanced 3D flash memory technology to date, utilizing a wide range of technology and manufacturing innovations.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210218005461/en/

“Through our strong partnership that has spanned two decades, Kioxia and Western Digital have successfully created unrivaled capabilities in manufacturing and R&D,” said Masaki Momodomi, Chief Technology Officer, Kioxia. “Together, we produce over 30 percent1 of the world’s flash memory bits and are steadfast in our mission to provide exceptional capacity, performance and reliability at a compelling cost. We each deliver this value proposition across a range of data-centric applications from personal electronics to data centers as well as emerging applications enabled by 5G networks, artificial intelligence and autonomous systems.”

Beyond Vertical Scaling – New Architecture Leverages New Innovations
“As Moore’s Law reaches its physical limits across the semiconductor industry, there’s one place where Moore’s Law continues its relevancy — that’s in flash,” said Dr. Siva Sivaram, President of Technology & Strategy, Western Digital. “To continue these advances and meet the world’s growing data demands, a new approach to 3D flash memory scaling is critical. With this new generation, Kioxia and Western Digital are introducing innovations in vertical as well as lateral scaling to achieve greater capacity in a smaller die with fewer layers. This innovation ultimately delivers the performance, reliability and cost that customers need.”

This sixth-generation 3D flash memory features advanced architecture beyond conventional eight-stagger memory hole array and achieves up to 10 percent greater lateral cell array density compared to the fifth-generation technology. This lateral scaling advancement, in combination with 162 layers of stacked vertical memory, enables a 40 percent reduction in die size compared to the 112-layer stacking technology, optimizing cost.

The Kioxia and Western Digital teams also applied Circuit Under Array CMOS placement and four-plane operation, which together deliver nearly 2.4 times improvement in program performance and 10 percent improvement in read latency compared to the previous generation. I/O performance also improves by 66 percent, enabling the next-generation interface to support the ever-increasing need for faster transfer rates.

Overall, the new 3D flash memory technology reduces the cost per bit, as well as increases the manufactured bits per wafer by 70 percent, compared with the previous generation. Kioxia and Western Digital continue to drive innovation to ensure continued scaling to meet the needs of customers and their diverse applications.

The companies detailed the related innovations in a joint presentation at the ISSCC 2021 show earlier today.

About Kioxia
Kioxia is a world leader in memory solutions, dedicated to the development, production and sale of flash memory and solid-state drives (SSDs). In April 2017, its predecessor Toshiba Memory was spun off from Toshiba Corporation, the company that invented NAND flash memory in 1987. Kioxia is committed to uplifting the world with memory by offering products, services and systems that create choice for customers and memory-based value for society. Kioxia's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centers.

About Western Digital
Western Digital creates environments for data to thrive. As a leader in data infrastructure, the company is driving the innovation needed to help customers capture, preserve, access and transform an ever-increasing diversity of data. Everywhere data lives, from advanced data centers to mobile sensors to personal devices, our industry-leading solutions deliver the possibilities of data. Our data-centric solutions are comprised of the Western Digital®, G-Technology™, SanDisk®, and WD® brands.

© 2021 Kioxia Corporation or its affiliates. All rights reserved.
© 2021 Western Digital Corporation or its affiliates. All rights reserved.
Western Digital and the Western Digital logo are registered trademarks or trademarks of Western Digital Corporation or its affiliates in the US and/or other countries. All other company names, product names, and service names may be trademarks of their respective companies.

1 Source: As of February 18, 2021. Kioxia survey.

Forward-Looking Statements
This news release contains certain forward-looking statements, including the expected availability, benefits and performance of the 6th-generation 3D flash memory technology. There are a number of risks and uncertainties that may cause these forward-looking statements to be inaccurate including, among others: future responses to and effects of the COVID-19 pandemic; volatility in global economic conditions; impact of business and market conditions; impact of competitive products and pricing; development and introduction of products based on new technologies and expansion into new data storage markets; risks associated with cost saving initiatives, restructurings, acquisitions, divestitures, mergers, joint ventures and strategic relationships; difficulties or delays in manufacturing or other supply chain disruptions; hiring and retention of key employees; high level of debt and other financial obligations; changes to relationships with key customers; disruptions in operations from cyber-attacks or other system security risks; actions by competitors; risks associated with compliance with changing legal and regulatory requirements and the outcome of legal proceedings; and other risks and uncertainties listed in Western Digital’s filings with the Securities and Exchange Commission (the “SEC”), including Western Digital’s Form 10-K filed with the SEC on August 28, 2020, to which your attention is directed. You should not place undue reliance on these forward-looking statements, which speak only as of the date hereof, and neither Western Digital nor Kioxia undertakes any obligation to update these forward-looking statements to reflect subsequent events or circumstances.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

Contact information

Kioxia Contacts:
Kota Yamaji
Kioxia Public Relations
81-3-6478-2319
kioxia-hd-pr@kioxia.com

Western Digital Contacts:
Erin Hartin
Western Digital Public Relations
1-303-601-8035
erin.hartin@wdc.com

T. Peter Andrew
Western Digital Investor Relations
1-800-695-6399
investor@wdc.com

About Business Wire

For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Agenus Announces Closing of $141M Strategic Collaboration with Zydus Lifesciences to Advance BOT+BAL and Strengthen U.S. Manufacturing Readiness15.1.2026 14:01:00 EET | Press release

Agenus Inc. (Nasdaq: AGEN), a leader in immuno-oncology innovation, today announced the closing of its previously disclosed strategic collaboration with Zydus Lifesciences Ltd. The agreement is designed to accelerate global development and potential commercialization of Agenus’ botensilimab and balstilimab (BOT+BAL) immunotherapy combination program. The collaboration provides Agenus with strategic capital and committed, long-term biologics manufacturing capacity in the United States to support BOT+BAL clinical development, authorized early access pathways, and commercial supply preparation. As part of the collaboration, Agenus has granted Zydus exclusive rights to develop and commercialize BOT and BAL in India and Sri Lanka, with Agenus eligible to receive royalties on net sales in those territories. The collaboration, first announced on June 3, 2025, included the following key financial terms: Upfront Consideration: $75 million cash payment to Agenus for transfer of biologics manufac

WHOOP and Samuel Ross MBE Announce Multiyear, Global Creative Partnership, Introducing a New Era in Performance Fashion15.1.2026 14:00:00 EET | Press release

WHOOP, the human performance company, announces a landmark creative partnership with acclaimed designer Samuel Ross MBE, who joins as Global Creative Director, WHOOP x SR_A to lead a multiyear collaboration between the two brands titled PROJECT TERRAIN. The collaboration signals the ongoing evolution of WHOOP from a pioneering wearable technology company into a brand shaping not just the future of personal health but also its intersection with performance fashion and cultural design. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260115643104/en/ WHOOP and Samuel Ross MBE Announce Multiyear, Global Creative Partnership, Introducing a New Era in Performance Fashion As the first performance design collaboration for WHOOP, the partnership represents a new chapter for the brand. Under Ross’ direction, PROJECT TERRAIN will deliver a bespoke capsule collection including limited-edition, customized WHOOP bands. The range will also

TNG Digital and EPOS Launch EPOS360 and EPOS360 BlueTap in Malaysia to Help Local SMEs Grow with AI and Unique Payment Capabilities15.1.2026 12:23:00 EET | Press release

TNG Digital Sdn. Bhd. (“TNG Digital”), the operator of Malaysia’s leading digital financial services and lifestyle app, TNG eWallet, and EPOS, the all-in-one SME transformation platform of Ant International, have jointly announced the launch of EPOS360 in Malaysia, with a suite of AI-powered growth tools and unique payment capabilities to support the digitalisation of Malaysian businesses, particularly SMEs. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260115763131/en/ [From left] Mr. Sarveswaran Raja Gopal, Chief Commercial Officer of TNG Digital; Mr. Alan Ni, Chief Executive Officer of TNG Digital; [middle] En. Anuar Fariz Fadzil, Chief Executive Officer of Malaysia Digital Economy Corporation (MDEC); Mr. Gary Liu, Chief Executive Officer of Antom and Senior Vice President of Ant International; and Mr. Alan Wang, Chief Executive Officer of EPOS and Vice President of Ant International, at the launch of EPOS360 and EPOS360

OPEX® Corporation Presented with Multiple DM Awards by Document Manager Magazine15.1.2026 11:00:00 EET | Press release

OPEX® Corporation, a global leader in Next Generation Automation providing innovative solutions for warehouse, document and mail automation, has been recognized by Document Manager magazine with multiple DM Awards. At the 2025 awards ceremony held recently in London, OPEX was named the winner in two categories―Imaging Product of the Year: High Volume and Hardware Product of the Year―for its Falcon+® document imaging solution. OPEX also received runners-up accolades, in partnership with Iron Mountain, in the category of Project of the Year: Public Sector, for their NHS Medical Scanning project. “OPEX is honored to receive such prestigious recognition from Document Manager magazine,” said Alban Collas, Director of EMEA Operations, OPEX. “Our team is committed to developing solutions that enable clients to transform how business is conducted. For our imaging solutions to be recognized in this way means so much to us. We’re especially pleased that the DM Awards honored our partnership with

SAP and Syngenta Announce Partnership to Scale AI-Assisted Agriculture15.1.2026 10:00:00 EET | Press release

SAP SE (NYSE: SAP) and Syngenta, a global leader in agricultural innovation, today announced a multi-year strategic technology partnership to accelerate AI-assisted innovation across Syngenta’s global operations. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260115682130/en/ Jeff Rowe - CEO of Syngenta Group (left) and Christian Klein - CEO of SAP (right) The partnership will embed artificial intelligence at the core of Syngenta’s enterprise, modernizing operations and enabling accelerated innovation through advanced data analytics across the business — from manufacturing and supply chain to grower-facing products and services. Agriculture continues to navigate challenges driven by climate variability, supply chain complexity, and global uncertainty. By deploying AI-assisted tools enterprise-wide, this partnership positions Syngenta to meet the challenge of feeding a projected 10 billion people by 2050, while unlocking fast

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye