Business Wire

Kioxia Develops New 3D Semicircular Flash Memory Cell Structure “Twin BiCS FLASH”

Share

Kioxia Corporation today announced the development of the world’s first[1] three-dimensional (3D) semicircular split-gate flash memory cell structure “Twin BiCS FLASH” using specially designed semicircular Floating Gate (FG) cells. Twin BiCS FLASH achieves superior program slope and a larger program/erase window at a much smaller cell size compared to conventional circular Charge Trap (CT) cells. These attributes make this new cell design a promising candidate to surpass four bits per cell (QLC) for significantly higher memory density and fewer stacking layers. This technology was announced at the IEEE International Electron Devices Meeting (IEDM) held in San Francisco, CA on December 11th.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20191211006038/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

Fabricated semicircular FG cells (a) Cross-sectional view (b) Plane view (Graphic: Business Wire)

3D flash memory technology has achieved high bit density with low cost per bit by increasing the number of cell stacked layers as well as by implementing multilayer stack deposition and high aspect ratio etching. In recent years, as the number of cell layers exceeds 100, managing the trade-offs among etch profile control, size uniformity and productivity is becoming increasingly challenging. To overcome this problem, Kioxia developed a new semicircular cell design by splitting the gate electrode in the conventional circular cell to reduce cell size compared to the conventional circular cell, enabling higher-density memory at a lower number of cell layers.

The circular control gate provides a larger program window with relaxed saturation problems when compared with a planar gate because of the curvature effect, where carrier injection through the tunnel dielectric is enhanced while electron leakage to the block (BLK) dielectric is lowered. In this split-gate cell design, the circular control gate is symmetrically divided into two semicircular gates to take advantage of the strong improvement in the program/erase dynamics. As shown in Fig. 1, the conductive storage layer is employed for high charge trapping efficiency in conjunction with the high-k BLK dielectrics, achieving high coupling ratio to gain program window as well as reduced electron leakage from the FG, thus relieving the saturation issue. The experimental program/erase characteristics in Fig. 2 reveal that the semicircular FG cells with the high-k-based BLK exhibit significant gains in the program slope and program/erase window over the larger-sized circular CT cells. The semicircular FG cells, having superior program/erase characteristics, are expected to attain comparably tight QLC Vt distributions at small cell size. Further, integration of low-trap Si channel makes possible more than four bits/cell, e.g., Penta-Level Cell (PLC) as shown in Fig. 3. These results confirm that semicircular FG cells are a viable option to pursue higher bit density.

Going forward, Kioxia’s research and development efforts aimed at innovation in flash memory will include continuing Twin BiCS FLASH development and seeking its practical applications. At IEDM 2019, Kioxia also announced six other papers highlighting the company’s intensive R&D activities in the area of flash memory.

[1] Source: Kioxia Corporation, as of December 12, 2019.

About Kioxia
Kioxia is a world leader in memory solutions, dedicated to the development, production and sale of flash memory and solid state drives (SSDs). In April 2017, its predecessor Toshiba Memory was spun off from Toshiba Corporation, the company that invented NAND flash memory in 1987. Kioxia is committed to uplifting the world with memory by offering products, services and systems that create choice for customers and memory-based value for society. Kioxia's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centers.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

Contact information

Kioxia Holdings Corporation
Kota Yamaji
Public Relations
Phone: +81-3-6478-2319
kioxia-hd-pr@kioxia.com

About Business Wire

For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Lenovo Group: Second Quarter Financial Results 2025/2620.11.2025 01:45:00 EET | Press release

Lenovo GroupLimited (HKSE: 992) (ADR: LNVGY), together with its subsidiaries (‘the Group’), today reported record results for the second quarter of fiscal year 2025/26, with overall group revenue reaching an all-time high of US$20.5 billion, up 15% year-on-year. Adjusted net income[1] grew 25% year-on-year to US$512 million, and adjusted net income margin expanded to 2.5%, driven by higher revenues. Together, these reflect the strength of the Group’s operational performance as they exclude the impact of non-cash fair value loss on warrants, notional interest on convertible bonds, and other non-cash items. The Group delivered double-digit year-on-year revenue growth across all main business groups and sales geographies. The AI-related revenue mix increased by 13 percentage points year-on-year, accounting for 30% of the Group’s total revenue this quarter. The growth was driven by high-double-digit revenue growth in AI Servers and triple-digit revenue growth in AI PCs, AI smartphones, and

OCP Announces Date of Third Quarter and Nine-Month 2025 Earnings19.11.2025 23:05:00 EET | Press release

OCP S.A. (“OCP” or the “Company”), a global leader in the fertilizer industry, will release its third quarter and nine-month 2025 results on Tuesday, November 25, 2025. The results will be available to holders of the Company’s bonds, qualified institutional buyers, securities analysts and market makers on the OCP Intralinks portal from 9:00 a.m. EDT, 3:00 p.m. Morocco (GMT+1), and 2:00 p.m. London time (GMT). OCP senior management will host a conference call to discuss third quarter and nine-month 2025 results at 10:00 a.m. EDT, 4:00 p.m. Morocco (GMT+1), and 3:00 p.m. London time (GMT) on Tuesday, November 25, 2025, for holders of the Company’s bonds, qualified institutional buyers, securities analysts and market makers. Eligible parties that have not already registered for access to the Intralinks portal may do so by contacting the Investor Relations Department by emailing g.laraki@ocpgroup.ma. About OCP OCP is a global leader in the fertilizer industry, backed by almost a century’s

Marquee Brands Broadens Global Portfolio with Strategic Acquisition of Stance19.11.2025 22:00:00 EET | Press release

Marquee Brands, the premier global brand accelerator, today announced the acquisition of Stance, the innovative lifestyle and performance sock brand. Founded in 2009 in San Clemente, California, Stance joins Marquee Brands’ renowned portfolio, home to some of the world’s most notable brands, including Martha Stewart, Laura Ashley, Sur La Table, BCBG, Ben Sherman, Body Glove and Dakine. The addition of Stance brings total retail sales across Marquee’s portfolio to $4.5 Billion USD. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251119216623/en/ Marquee also announces a new partnership with United Legwear and Apparel Co. (ULAC), which becomes the brand’s core global licensee, managing operations across all territories apart from China. With products sold in 42 countries through more than 1,100 U.S. wholesale accounts, e-commerce, international distributors and mono-branded retail stores, ULAC will oversee Stance’s core product

AWS and HUMAIN Expand Partnership with NVIDIA AI Infrastructure and AWS AI Chip Deal to Drive Global AI Innovation19.11.2025 20:38:00 EET | Press release

Amazon Web Services, Inc. (AWS), an Amazon.com, Inc. company (NASDAQ: AMZN), and HUMAIN, a Public Investment Fund (PIF) company delivering global full-stack AI solutions, announced today at the U.S.-Saudi Investment Forum their plans to provide, deploy and manage up to 150,000 AI accelerators in a data center facility known as an “AI Zone” in Riyadh. As part of the expanded partnership, AWS will become HUMAIN’s preferred AI partner globally, and the two companies will collaborate to bring AI compute and services from Saudi Arabia to customers worldwide. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251119637708/en/ Tanuja Randery, Managing Director, Europe, Middle East & Africa, AWS and Tareq Amin, CEO of HUMAIN The first-of-a-kind AI Zone in Saudi Arabia will support cutting-edge AI training and inference workloads with access to the latest NVIDIA GB300 AI infrastructure and AWS’s Trainium AI chips. The infrastructure will

Luma AI Raises $900 Million Series C Led by HUMAIN And Partners on 2 Gigawatt AI Supercluster in Saudi Arabia19.11.2025 19:15:00 EET | Press release

Luma AI, the frontier artificial intelligence company building multimodal AGI, today announced it has raised $900 million in Series C funding, led by HUMAIN, a PIF company delivering global full-stack AI solutions, with significant participation from AMD Ventures, and existing investors Andreessen Horowitz, Amplify Partners, and Matrix Partners. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251119678010/en/ (L–R) Amit Jain, CEO of Luma AI, and Tareq Amin, CEO of HUMAIN, at the U.S.–Saudi Investment Forum in Washington, D.C., where Luma AI announced its $900 million Series C and partnership on Project Halo - a 2-gigawatt AI supercluster in Saudi Arabia that will power next-generation World Models and accelerate the path toward Multimodal AGI. This Series C is a milestone in the company’s mission to build multimodal general intelligence: AI that can generate, understand, and operate in the physical world. To train and deploy

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye