Business Wire

Kioxia Develops New 3D Semicircular Flash Memory Cell Structure “Twin BiCS FLASH”

12.12.2019 10:37:00 EET | Business Wire | Press release

Share

Kioxia Corporation today announced the development of the world’s first[1] three-dimensional (3D) semicircular split-gate flash memory cell structure “Twin BiCS FLASH” using specially designed semicircular Floating Gate (FG) cells. Twin BiCS FLASH achieves superior program slope and a larger program/erase window at a much smaller cell size compared to conventional circular Charge Trap (CT) cells. These attributes make this new cell design a promising candidate to surpass four bits per cell (QLC) for significantly higher memory density and fewer stacking layers. This technology was announced at the IEEE International Electron Devices Meeting (IEDM) held in San Francisco, CA on December 11th.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20191211006038/en/

To view this piece of content from mms.businesswire.com, please give your consent at the top of this page.

Fabricated semicircular FG cells (a) Cross-sectional view (b) Plane view (Graphic: Business Wire)

3D flash memory technology has achieved high bit density with low cost per bit by increasing the number of cell stacked layers as well as by implementing multilayer stack deposition and high aspect ratio etching. In recent years, as the number of cell layers exceeds 100, managing the trade-offs among etch profile control, size uniformity and productivity is becoming increasingly challenging. To overcome this problem, Kioxia developed a new semicircular cell design by splitting the gate electrode in the conventional circular cell to reduce cell size compared to the conventional circular cell, enabling higher-density memory at a lower number of cell layers.

The circular control gate provides a larger program window with relaxed saturation problems when compared with a planar gate because of the curvature effect, where carrier injection through the tunnel dielectric is enhanced while electron leakage to the block (BLK) dielectric is lowered. In this split-gate cell design, the circular control gate is symmetrically divided into two semicircular gates to take advantage of the strong improvement in the program/erase dynamics. As shown in Fig. 1, the conductive storage layer is employed for high charge trapping efficiency in conjunction with the high-k BLK dielectrics, achieving high coupling ratio to gain program window as well as reduced electron leakage from the FG, thus relieving the saturation issue. The experimental program/erase characteristics in Fig. 2 reveal that the semicircular FG cells with the high-k-based BLK exhibit significant gains in the program slope and program/erase window over the larger-sized circular CT cells. The semicircular FG cells, having superior program/erase characteristics, are expected to attain comparably tight QLC Vt distributions at small cell size. Further, integration of low-trap Si channel makes possible more than four bits/cell, e.g., Penta-Level Cell (PLC) as shown in Fig. 3. These results confirm that semicircular FG cells are a viable option to pursue higher bit density.

Going forward, Kioxia’s research and development efforts aimed at innovation in flash memory will include continuing Twin BiCS FLASH development and seeking its practical applications. At IEDM 2019, Kioxia also announced six other papers highlighting the company’s intensive R&D activities in the area of flash memory.

[1] Source: Kioxia Corporation, as of December 12, 2019.

About Kioxia
Kioxia is a world leader in memory solutions, dedicated to the development, production and sale of flash memory and solid state drives (SSDs). In April 2017, its predecessor Toshiba Memory was spun off from Toshiba Corporation, the company that invented NAND flash memory in 1987. Kioxia is committed to uplifting the world with memory by offering products, services and systems that create choice for customers and memory-based value for society. Kioxia's innovative 3D flash memory technology, BiCS FLASH™, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centers.

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

Contact information

Kioxia Holdings Corporation
Kota Yamaji
Public Relations
Phone: +81-3-6478-2319
kioxia-hd-pr@kioxia.com

About Business Wire

For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Netceed appoints Eric Updyke as Group CEO10.11.2026 16:15:00 EET | Press release

Netceed, a global leader in delivering supply chain solutions across broadband, data center and energy infrastructure, today announced the appointment of Eric Updyke as Group CEO, effective 10th November, 2026. He succeeds Alper Türken, who will step down as CEO on 10th November, 2026. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261110492065/en/ Netceed appoints Eric Updyke as Group CEO Eric brings more than 35 years of leadership experience in communications and technology infrastructure. Most recently, he served as CEO of Spirent Communications plc from 2019 to 2025. At Spirent, he led the company's shift from a hardware-centric vendor to a solutions provider built on software, automation and services. He also expanded the business into new sectors, including AI data center providers, and guided it through a strategic sale, culminating in its $1.5 billion acquisition by Keysight Technologies in 2025. Before Spirent, Eri

80% of IT Leaders Say the Digital Workplace Is Critical to AI Success, Yet Only 10% Have Fundamentally Redesigned It, Lenovo Research Finds10.11.2026 16:00:00 EET | Press release

Eight in ten IT decision makers say the digital workplace is critical to successful AI-led transformation, yet only 10% report fundamentally redesigning it for AI, according to Lenovo’s sixth Work Reborn report, The AI-ready workplace. The findings expose a significant gap between deploying AI tools and the operating capabilities needed to integrate them into how work gets done across an organization. The report frames workplace readiness as a connected system spanning people, workflows, technology, support and governance, with each contributing to how enterprises translate AI ambition into business outcomes at scale. Based on an August 2026 survey of 1,200 IT leaders at organizations with at least 1,000 employees across 12 countries, the report examines the workplace conditions needed to translate AI deployment into measurable value. While 76% rank AI-led transformation among their organization’s top IT priorities, only 27% have scaled AI across business functions. AI Deployment Is No

Nearly Nine in 10 Private Capital GPs Face Data Validation Challenges10.11.2026 16:00:00 EET | Press release

Nearly nine in 10 (88%) of private capital general partners (GPs) surveyed say their finance and operations teams spend between 11% and 50% of their time validating, reconciling, recalculating or recreating administrator outputs, according to new research from CSC, the leading provider of global business administration and compliance solutions¹. CSC surveyed more than 300 GPs and 200 limited partners (LPs) across North America, Europe, the U.K., and Asia Pacific. The report, Future Private Capital CFO 2026, examines how fund finance, liquidity management, reporting, outsourcing, cybersecurity, and AI governance are reshaping the role of the private capital CFO. Half of GPs say their finance and operations teams spend 11% to 25% of their time validating, reconciling, recalculating, or recreating administrator outputs, while 38% put the figure at 26% to 50%. As firms add asset classes, structures, jurisdictions, liquidity tools, and reporting requirements, complexity is increasingly bein

GigaDevice Launches New-Generation GD32H7 High-Performance MCU Portfolio for Full-Scenario Industrial Applications10.11.2026 16:00:00 EET | Press release

GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, officially launches its new-generation GD32H7 MCU portfolio built on a unified chip architecture. Developed from a homologous silicon die with tailored IP configuration, peripheral optimization and scenario-specific tuning, the comprehensive product lineup precisely covers three core industrial application scenarios: industrial HMI human-machine interaction, general industrial automation, and robotic servo joint control. It delivers industrial manufacturers with a high-performance, fully integrated MCU solution featuring unified architecture, clear product classification and exceptional development reusability. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261110874769/en/ GigaDevice New-Generation GD32H7 High-Performance MCU Universal Core Hardware Features – Building a Unified High-Perfor

The $63.4 Billion Innovation Drain: Study Finds Unexpected Tech Costs Force Cuts into AI Investment and Hiring10.11.2026 16:00:00 EET | Press release

Businesses across eight major economies incur $63.4 billion annually in technology infrastructure overspend attributable to opaque, unpredictable or difficult-to-forecast provider charges, forcing companies to scale back investments in artificial intelligence, hiring and new product development, according to new economic research from the Centre for Economics and Business Research (CEBR), commissioned by Wasabi Technologies. The overspend reflects infrastructure provider charges businesses could not forecast, rather than their own planned usage. AI and machine learning infrastructure accounted for $23.4 billion, or 37%, of the total overspend, more than any other technology category. It is also the category businesses find hardest to forecast. AI infrastructure costs are unpredictable for 22% of businesses, nearly double any other layer in the technology stack, where the range is between 8% and 12%. The findings expose a growing financial challenge for companies investing in AI. The in

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye