Mindtech Demonstrates Solutions for AI Training at CES 2020
17.12.2019 11:01:00 EET | Business Wire | Press release
Mindtech Global Ltd, a UK-based start-up, will be at the CTA® Consumer Electronics Show (CES®) in Las Vegas from Jan 5-9th, exhibiting in Eureka Park®, booth 51109, showing their Chameleon product for training neural networks.
Mindtech at CES
Mindtech will be showing demonstrations of our Chameleon product, designed for creating the annotated visual data needed to successfully train and deploy neural networks to solve real-world problems.
Vast quantities of labelled video are required to train neural networks for visual applications; to manually capture and annotate this data has many limitations, including the time and expense involved. To date this has meant only a privileged few can develop and deploy their AI-based computer visions solutions or are perhaps limited to the usage of a few, limited public datasets.
Mindtech changes that with Chameleon, the world’s first tool for synthetic data generation, including a complete virtual world simulator with scenario editor, targeted at all industries that wish to deploy their next-generation, AI-based vision algorithms. The tool allows users to be confident that corner cases which are difficult or impossible to film in the real world have been tested, include sufficient diversity training, and are fully compliant with GDPR. This enhanced data for training helps to prevent embarrassing (or catastrophic) failures in the field.
Whether you are doing drone detection, self-driving cars, smart security cameras or other applications requiring visual stimuli, the Chameleon simulator will provide you with the additional training data you need.
Come and see us at CES, booth 51109 in Eureka Park, and see how we have democratized the acquisition of annotated data.
Contact
For further information or to book a meeting, please contact chris.longstaff@mindtech.global or https://mindtech.global.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20191217005283/en/
Contact information
Neal Leavitt
neal@leavcom.com
760-639-2900
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Growing with Purpose, Delivering with Impact: ProAmpac Releases 2026 Sustainability Impact Report4.8.2026 18:13:00 EEST | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the release of its 2026 Sustainability Impact Report, centered around the theme Growing with Purpose, Delivering with Impact, the report highlights the company's advancements in sustainable innovation, environmental stewardship, employee safety, and responsible business practices while expanding its global footprint. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260804969765/en/ ProAmpac's 2026 Impact Report is here Reflecting another year of meaningful achievements, the report demonstrates how ProAmpac is embedding sustainability throughout its business, from advancing innovative packaging solutions and reducing environmental impacts to strengthening workplace safety and supporting the communities where employees live and work. Notable achievements highlighted in the 2026 Sustainability Impact Report include: Continued Global Growth: Expanded P
New Esri Press Book Empowers Users to Unlock the Potential of AI with the Power of Geography4.8.2026 17:35:00 EEST | Press release
Esri has released Exploring GeoAI: Tools and Workflows, a practical guide to applying geospatial artificial intelligence (GeoAI) using ArcGIS. Designed for GIS professionals, analysts, and data scientists, this hands-on workbook provides the knowledge and tools needed to integrate advanced AI workflows into real-world spatial analysis. As GeoAI continues to transform how organizations analyze and interpret location-based data, Exploring GeoAI equips readers with the skills to confidently implement deep learning models and workflows. The book guides users through the full GeoAI life cycle—from preparing systems and data to training, evaluating, and deploying models in operational environments. Readers begin by learning how to install and configure deep learning frameworks, assess hardware capabilities, and optimize system performance. From there, they progress through key stages of the GeoAI workflow, including defining project requirements, selecting appropriate data, choosing and trai
Rehlko Defines What It Takes to Build AI-Ready Power Infrastructure as Data Center Energy Demands Evolve4.8.2026 16:15:00 EEST | Press release
Rehlko, a global industrial energy resilience platform providing custom-engineered, integrated power solutions for mission-critical infrastructure worldwide, today released new insights on the power infrastructure requirements emerging from the rapid growth of large language models and artificial intelligence. In its latest eBook, AI Readiness Starts with Power: Designing for Real-World Load Conditions, Rehlko examines how increasingly dynamic AI workloads are reshaping expectations for data center power systems and highlights key infrastructure considerations for operators seeking to scale AI capacity reliably and efficiently. As the eBook outlines, AI readiness is increasingly defined not by installed capacity, but by how systems perform under highly variable real-world load conditions. The AI Power Challenge As investment in AI infrastructure accelerates, data center operators face growing pressure to deploy capacity faster than traditional utility infrastructure can support. At the
HappyRobot Raises $150 Million Series C to Build Enterprise Superintelligence4.8.2026 15:30:00 EEST | Press release
HappyRobot, the company putting AI agents to work across complex enterprise operations, today announced it has raised $150 million in Series C funding led by Prysm Capital and co-led by Eurazeo. Existing investors a16z, Base10, Y Combinator are doubling down with participation from strategics like Koch Disruptive Technologies (KDT), Orange, and T.Capital (Deutsche Telekom), Bankinter, Endeavor Catalyst, Kfund and Wave-X. The round values the company at $1.2 billion post-money, bringing total funding to around $200 million and marking a new stage of growth as enterprises deploy AI agents across mission-critical work. HappyRobot works with more than 150+ enterprise customers, including DHL, Kuehne + Nagel, Naturgy, Repsol, and Uber, and has grown 5x since raising its Series B late last year. After first proving its platform in logistics, one of the world’s most operationally demanding industries, HappyRobot is expanding across the supply chain as well as into insurance, energy and utilit
New 3D Flash Memory Technology from Kioxia and Sandisk Achieves Industry’s Highest Bit Density for QLC NAND4.8.2026 15:30:00 EEST | Press release
Future of Memory and Storage Conference (FMS) – Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today unveiled their next-generation Quad-Level-Cell (QLC) 3D flash memory technology, which delivers up to 60% increase in bit density compared to their 8th-generation, surpassing 37 Gb/mm² and setting the industry benchmark1 for bit density, performance and power efficiency. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260804147821/en/ Leveraging the companies’ revolutionary CMOS directly Bonded to Array (CBA) technology2 which fabricates CMOS logic and the memory array on separate wafers before bonding them together with high-precision wafer-to-wafer alignment, the new generation improves read and write bandwidth compared to the 8th-generation 3D flash memory and becomes the industry’s first QLC 3D flash memory technology to reach a 4.8 Gb/s 3 interface. Add
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
