Mitsui Mining & Smelting Co., Ltd. to Initiate Mass Production of HRDP®, a Special Glass Carrier for Next-Generation Semiconductor Packaging Devices
25.1.2021 09:00:00 EET | Business Wire | Press release
For the commercialization of HRDP®1, a special glass carrier for the next-generation semiconductor packaging devices, Mitsui Mining & Smelting Co., Ltd. (President: Keiji Nishida; hereinafter, “Mitsui Kinzoku”) has been expanding the establishment of a system for mass production in collaboration with GEOMATEC Co., Ltd. (President: Kentaro Matsuzaki). Mitsui Kinzoku is pleased to announce today that mass production of HRDP® has started for a domestic multi-chip module manufacturer.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210124005060/en/
Exterior photograph of HRDP®, in the 12-inch wafer type (Photo: Business Wire)
In its January 2018 news release, Mitsui Kinzoku announced the development of HRDP®, a material for the creation of ultra-fine circuits using a glass carrier for the Fan Out panel level package, based on the RDL First method2.
HRDP® is a special glass carrier capable of achieving high production efficiency of the Fan Out packages3, the next-generation semiconductor packaging technologies, including ultra-high density circuits designed with a line/space (L/S) ratio of 2/2 μm or less4. Currently, over 20 customers are evaluating HRDP® for commercialization.
As the first stage, mass production for a domestic multi-chip module manufacturer began in January 2021. This customer will use HRDP® to manufacture devices for the 5G market, which is expected to expand in the future, including RF modules5, and other devices for a variety of applications with plans to increase sales.
As the second stage, an overseas leading package manufacturer is planning to adopt HRDP® within FY2021.
In addition, there are plans to initiate the mass production at the other new customers for a variety of applications, such as HPC6 and mobile phones for FY2022 and onward, and the HRDP® market is expected to expand.
Under its slogan of Material Intelligence, Mitsui Kinzoku will realize customers’ wishes to ensure stable quality and sufficient supply, to provide customers with one stop solutions and to endeavor to increase its market share.
Description of Terms
1 Abbreviation of High Resolution De-bondable Panel
2 Re-Distribution Layer First method: Semiconductor chips are packaged after the process of forming the redistribution layer
3 Fan Out Package: Substrate-less packaging technology with ultra-fine re-distribution layer extended outside the chip size
4 L/S=2/2 µm: The line width of 2 µm and the space between neighboring circuit lines of 2 µm.
5 Radio Frequency Module: Product equipped with several active components (IC chips) and passive components (SAW, condenser, resistor and coil) and sealed
6 High Performance Computing: Computer with large-scale, ultra high-speed computing/processing capability
Reference
"Development of HRDP® Material for Formation of Ultra-Fine Circuits with Glass Carrier for Fan Out Panel Level Package" (Release as of January 25, 2018)
https://www.mitsui-kinzoku.com/Portals/0/resource/uploads/topics_180125e.pdf?TabModule127
Video of the RDL First method using HRDP®
https://www.youtube.com/watch?v=vHhng-NV9QA
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210124005060/en/
Contact information
[Contact for inquiries about this release and HRDP® products]
Corporate Communications Department, Mitsui Mining & Smelting Co., Ltd.
Mr. KASAHARA Norio
TEL: +81-3-5437-8028 E-mail: PR@mitsui-kinzoku.com
[Contact for Inquiries about HRDP® products] (Native language is available.)
In China
EVER TEAM TECHNOLOGY (NANJING) CO., LTD.
Mr. Jordon Jiang
TEL: +86-18601423513 E-MAIL: jordon@evertech.com.tw
In Taiwan
EVER TECH INSTRUMENTAL CO., LTD
Mr. Alvin Tu
TEL: +886-915973025 E-MAIL: alvin@evertech.com.tw
In Korea
AJ COMPANY
Mr. Suh Jeong Wook
TEL: +82-1053711563 E-MAIL: jwsuh@aj-company.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
ADNEC Group Kickstarts November with Two of the World’s Largest Events in the Energy and Tourism Sectors31.10.2026 05:53:00 EET | Press release
ADNEC Group, a Modon company, begins November by hosting two of the world’s most significant international events in the same week. ADIPEC 2026, the world’s largest energy event, takes place at ADNEC Centre Abu Dhabi from 2 to 5 November. Meanwhile, World Travel Market (WTM) London, one of the global travel industry’s leading gatherings, takes place at the Group’s Excel London venue from 3 to 5 November. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261030918463/en/ ADNEC Centre Abu Dhabi (Photo: AETOSWire) The two events, held simultaneously at the Group’s largest venues in the UAE and the UK, reflect ADNEC Group’s capability to deliver large-scale international events across multiple markets. ADIPEC has grown alongside the venue since it was first held at the ADNEC Centre Abu Dhabi in 2006. This year’s edition is set to be the largest in the event’s history, occupying the venue’s entire 153,000 square metres of exhibition
SES and Air Astana Introduce Multi-orbit Inflight Connectivity on A321LR Fleet30.10.2026 19:35:00 EET | Press release
SES was selected by Air Astana, the award-winning flag carrier of Kazakhstan, to introduce next-generation inflight connectivity services across its Airbus A321LR fleet. The first connected aircraft entered commercial service on 29 October 2026. Fleet-wide deployment will continue across the remaining A321LR fleet. Equipped with SES’s new electronically steered array (ESA) antenna, the aircraft delivers reliable connectivity over the SES multi-orbit network. SES will provide a fully managed inflight connectivity service across the fleet, enabling Air Astana passengers to enjoy a seamless online experience throughout their journey. “Airlines are increasingly looking for connectivity solutions that deliver a seamless passenger experience while providing the flexibility to evolve with changing customer expectations,” said Blane Boynton, Senior Vice President, Aviation at SES. “SES's multi-orbit solution will enable Air Astana to offer a consistent, high-quality online experience across it
CIRCOR to Expand Industrial Portfolio with Acquisition of Green Silence Group S.p.A.30.10.2026 18:06:00 EET | Press release
CIRCOR, a KKR portfolio company and global manufacturer of flow control products for industrial and naval markets, today announced that it has signed a definitive agreement to acquire Green Silence Group S.p.A., an Italian provider of hydraulic pumps, electric motors and advanced engineering solutions. The acquisition will bring together the complementary capabilities of Settima, Motive and Spin expanding CIRCOR’s Industrial portfolio with three-screw and ultra-low-noise hydraulic pumps, Motive electric motors, high-efficiency rare-earth-free motor technologies, power electronics and advanced engineering capabilities. Together, these technologies will broaden CIRCOR’s ability to deliver integrated solutions that improve system efficiency, reduce energy consumption and critical raw materials dependency, and address evolving customer needs across industrial and mobile applications. The combination will also provide Green Silence Group access to CIRCOR’s global commercial and operational
Quectel Sues Telit, Alleging False Statements, Cybersquatting and Unfair Competition30.10.2026 17:41:00 EET | Press release
Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today announced that it has filed legal action in the United States District Court for the Southern District of Florida against Telit IoT Solutions Inc. The lawsuit seeks to bring an end to Telit’s campaign of false and misleading claims about Quectel and its products. Quectel alleges that, rather than competing on the strength of its products and technology, Telit engaged in a coordinated campaign to undermine Quectel’s reputation by exploiting geopolitical concerns surrounding Chinese technology companies. According to the complaint, Telit funded, promoted, and amplified false and misleading claims about Quectel’s products while positioning itself to customers as a safer “Western” alternative. The lawsuit further alleges that Telit engaged in cybersquatting involving Quectel’s U.S. domain name to advance its campaign. Quectel maintains that these alleged actions have caused substantial harm to its sales, customer
TestMu AI Launches Kane CLI Exploration, an AI Agent That Maps an Entire Web App From a Single URL and Turns It Into Tests30.10.2026 16:00:00 EET | Press release
TestMu AI, the Full Stack Agentic AI Quality Engineering platform, announced Kane CLI Exploration, an autonomous agent that learns a web application before anyone writes a test. Given a single URL, it walks the entire app on its own, flags problems along the way and gives Kane CLI the context it needs to generate and run tests, even when no requirements, user stories or acceptance criteria exist. Every test plan starts from something written down, and many apps never had it. Legacy products lose their specs when the people who wrote them move on, and apps a coding agent built in a week often have no record of intended behavior beyond the prompt history. With nothing to test against, a testing agent ends up grading the app against itself. Starting from the URL a developer provides, the exploration agent moves through every page, junction and flow it can reach, the way a new QA engineer clicks through a product in their first week. For each page it records the controls, the flows in and
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom