Mitsui Mining & Smelting Co., Ltd. to Initiate Mass Production of HRDP®, a Special Glass Carrier for Next-Generation Semiconductor Packaging Devices
25.1.2021 09:00:00 EET | Business Wire | Press release
For the commercialization of HRDP®1, a special glass carrier for the next-generation semiconductor packaging devices, Mitsui Mining & Smelting Co., Ltd. (President: Keiji Nishida; hereinafter, “Mitsui Kinzoku”) has been expanding the establishment of a system for mass production in collaboration with GEOMATEC Co., Ltd. (President: Kentaro Matsuzaki). Mitsui Kinzoku is pleased to announce today that mass production of HRDP® has started for a domestic multi-chip module manufacturer.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210124005060/en/
Exterior photograph of HRDP®, in the 12-inch wafer type (Photo: Business Wire)
In its January 2018 news release, Mitsui Kinzoku announced the development of HRDP®, a material for the creation of ultra-fine circuits using a glass carrier for the Fan Out panel level package, based on the RDL First method2.
HRDP® is a special glass carrier capable of achieving high production efficiency of the Fan Out packages3, the next-generation semiconductor packaging technologies, including ultra-high density circuits designed with a line/space (L/S) ratio of 2/2 μm or less4. Currently, over 20 customers are evaluating HRDP® for commercialization.
As the first stage, mass production for a domestic multi-chip module manufacturer began in January 2021. This customer will use HRDP® to manufacture devices for the 5G market, which is expected to expand in the future, including RF modules5, and other devices for a variety of applications with plans to increase sales.
As the second stage, an overseas leading package manufacturer is planning to adopt HRDP® within FY2021.
In addition, there are plans to initiate the mass production at the other new customers for a variety of applications, such as HPC6 and mobile phones for FY2022 and onward, and the HRDP® market is expected to expand.
Under its slogan of Material Intelligence, Mitsui Kinzoku will realize customers’ wishes to ensure stable quality and sufficient supply, to provide customers with one stop solutions and to endeavor to increase its market share.
Description of Terms
1 Abbreviation of High Resolution De-bondable Panel
2 Re-Distribution Layer First method: Semiconductor chips are packaged after the process of forming the redistribution layer
3 Fan Out Package: Substrate-less packaging technology with ultra-fine re-distribution layer extended outside the chip size
4 L/S=2/2 µm: The line width of 2 µm and the space between neighboring circuit lines of 2 µm.
5 Radio Frequency Module: Product equipped with several active components (IC chips) and passive components (SAW, condenser, resistor and coil) and sealed
6 High Performance Computing: Computer with large-scale, ultra high-speed computing/processing capability
Reference
"Development of HRDP® Material for Formation of Ultra-Fine Circuits with Glass Carrier for Fan Out Panel Level Package" (Release as of January 25, 2018)
https://www.mitsui-kinzoku.com/Portals/0/resource/uploads/topics_180125e.pdf?TabModule127
Video of the RDL First method using HRDP®
https://www.youtube.com/watch?v=vHhng-NV9QA
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210124005060/en/
Contact information
[Contact for inquiries about this release and HRDP® products]
Corporate Communications Department, Mitsui Mining & Smelting Co., Ltd.
Mr. KASAHARA Norio
TEL: +81-3-5437-8028 E-mail: PR@mitsui-kinzoku.com
[Contact for Inquiries about HRDP® products] (Native language is available.)
In China
EVER TEAM TECHNOLOGY (NANJING) CO., LTD.
Mr. Jordon Jiang
TEL: +86-18601423513 E-MAIL: jordon@evertech.com.tw
In Taiwan
EVER TECH INSTRUMENTAL CO., LTD
Mr. Alvin Tu
TEL: +886-915973025 E-MAIL: alvin@evertech.com.tw
In Korea
AJ COMPANY
Mr. Suh Jeong Wook
TEL: +82-1053711563 E-MAIL: jwsuh@aj-company.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
UAE Opens 15 th UN Congress on Crime Prevention and Criminal Justice and Launches Pledge4Justice with First Pledge of Up to USD 5 Million26.9.2026 23:51:00 EEST | Press release
The 15th United Nations Congress on Crime Prevention and Criminal Justice – Abu Dhabi 2026 kicked off today at ADNEC Centre Abu Dhabi. Set to run until 1 October, the Congress attracts representatives from over 97 countries, including over 32 ministers of justice and interior ministers, alongside senior officials, judges, prosecutors, experts, and youth from around the world. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260926005703/en/ UAE Opens 15th UN Congress on Crime Prevention and Criminal Justice and Launches Pledge4Justice with First Pledge of Up to USD 5 Million (Photo: AETOSWire) The opening session witnessed the adoption of the Abu Dhabi Declaration, which serves as the Congress's principal political and strategic outcome document and will guide international priorities and cooperation in crime prevention, criminal justice and the rule of law over the next five years. The Declaration is structured around four pi
Future Health Convenes Global Health Leaders at UNGA to Advance Health System Transformation at Scale26.9.2026 18:21:00 EEST | Press release
Future Health – A Global Initiative by Abu Dhabi convened Ministers, senior government representatives, and global health leaders in New York on the sidelines of the 81st Session of the United Nations General Assembly (UNGA 81). The high-level dialogue set out practical priorities for moving health systems from reactive treatment towards prediction, prevention, and earlier intervention. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260926746202/en/ Future Health – A Global Initiative by Abu Dhabi convened Ministers, senior government representatives, and global health leaders in New York on the sidelines of the 81st Session of the United Nations General Assembly (UNGA 81). Chaired by H.E. Ahmed Al Sayegh, Minister of Health and Prevention of the United Arab Emirates, the dialogue brought together participants from Angola, Brazil, Ethiopia, Finland, Guyana, Indonesia, Madagascar, Mali, Nigeria, Rwanda, Sweden, the United Ara
Mirum Pharmaceuticals and Incyte Announce U.S. FDA Approval of Atebrioz™ (zilurgisertib) for Adult and Pediatric Patients with Fibrodysplasia Ossificans Progressiva26.9.2026 02:00:00 EEST | Press release
Mirum Pharmaceuticals, Inc. (Nasdaq:MIRM) and Incyte (Nasdaq:INCY) today announced that the U.S. Food and Drug Administration (FDA) has approved Atebrioz™ (zilurgisertib) tablets to reduce the volume of total new heterotopic ossification (HO) in adult and pediatric patients aged 12 years and older with fibrodysplasia ossificans progressiva (FOP). The recommended dose of Atebrioz is 100 mg administered orally, once daily. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260925436454/en/ “Today marks an important milestone for people living with FOP, bringing a new treatment option to adult and pediatric patients living with this devastating disease,” said Chris Peetz, Chief Executive Officer at Mirum. “At Mirum, we are driven to serve rare disease communities where the unmet need is significant and the opportunity to make a difference is profound. The approval of Atebrioz reflects what can be achieved when industry, researchers
Digital Reef Signs Offtake Agreement with Oreasoc Agriculture to Mitigate the Environmental Footprint of Data Centre Growth Through Rainforest Protection, Appointing Xange.com as Digital MRV Partner25.9.2026 22:19:00 EEST | Press release
At Climate Week NYC, Digital Reef and Oreasoc Agriculture Inc. sign an offtake agreement connecting Digital Reef’s 3.3 GW data centre pipeline with environmental assets exceeding 30 million hectares of South American Amazon rainforest, mitigating the environmental footprint of data centre growth through rainforest protection and restoration where Oreasoc works alongside local communities to protect biodiversity, develop sustainable economies and safeguard their territories. Xange.com are appointed as digital MRV technology partner to monitor the data centres and rainforest where Digital Reef will purchase verified environmental assets generated by Oreasoc, supporting the development of low-carbon data centres mitigating their environmental footprint through the protection of high-integrity natural ecosystems across the South American Amazon, whilst advancing sustainable economic development. AI and data centre demand is driving rapid growth, with the International Energy Agency project
NetApp Announces Intent to Acquire PEAK:AIO to Advance Scalable AI Infrastructure Architecture25.9.2026 16:00:00 EEST | Press release
NetApp® (NASDAQ: NTAP), the intelligent data infrastructure company, today announced its intent to acquire PEAK:AIO, a pioneer in next-generation metadata architecture and high-performance parallel file systems. The planned acquisition is expected to accelerate NetApp's AI infrastructure roadmap by augmenting metadata services and parallel namespace innovation designed to help AI clouds scale shared storage alongside growing GPU clusters. As AI becomes embedded in every enterprise workload, organizations are confronting a new challenge: traditional storage architectures were not designed for the unprecedented scale, concurrency, and performance requirements of AI factories, AI clouds, and next-generation data-intensive applications. NetApp is building an architecture that disaggregates metadata from data and enables metadata services to scale independently, creating a foundation for AI infrastructure capable of supporting trillions of files, exabyte-scale environments, and massively pa
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom