Mitsui Mining & Smelting Co., Ltd. to Initiate Mass Production of HRDP®, a Special Glass Carrier for Next-Generation Semiconductor Packaging Devices
25.1.2021 09:00:00 EET | Business Wire | Press release
For the commercialization of HRDP®1, a special glass carrier for the next-generation semiconductor packaging devices, Mitsui Mining & Smelting Co., Ltd. (President: Keiji Nishida; hereinafter, “Mitsui Kinzoku”) has been expanding the establishment of a system for mass production in collaboration with GEOMATEC Co., Ltd. (President: Kentaro Matsuzaki). Mitsui Kinzoku is pleased to announce today that mass production of HRDP® has started for a domestic multi-chip module manufacturer.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210124005060/en/
Exterior photograph of HRDP®, in the 12-inch wafer type (Photo: Business Wire)
In its January 2018 news release, Mitsui Kinzoku announced the development of HRDP®, a material for the creation of ultra-fine circuits using a glass carrier for the Fan Out panel level package, based on the RDL First method2.
HRDP® is a special glass carrier capable of achieving high production efficiency of the Fan Out packages3, the next-generation semiconductor packaging technologies, including ultra-high density circuits designed with a line/space (L/S) ratio of 2/2 μm or less4. Currently, over 20 customers are evaluating HRDP® for commercialization.
As the first stage, mass production for a domestic multi-chip module manufacturer began in January 2021. This customer will use HRDP® to manufacture devices for the 5G market, which is expected to expand in the future, including RF modules5, and other devices for a variety of applications with plans to increase sales.
As the second stage, an overseas leading package manufacturer is planning to adopt HRDP® within FY2021.
In addition, there are plans to initiate the mass production at the other new customers for a variety of applications, such as HPC6 and mobile phones for FY2022 and onward, and the HRDP® market is expected to expand.
Under its slogan of Material Intelligence, Mitsui Kinzoku will realize customers’ wishes to ensure stable quality and sufficient supply, to provide customers with one stop solutions and to endeavor to increase its market share.
Description of Terms
1 Abbreviation of High Resolution De-bondable Panel
2 Re-Distribution Layer First method: Semiconductor chips are packaged after the process of forming the redistribution layer
3 Fan Out Package: Substrate-less packaging technology with ultra-fine re-distribution layer extended outside the chip size
4 L/S=2/2 µm: The line width of 2 µm and the space between neighboring circuit lines of 2 µm.
5 Radio Frequency Module: Product equipped with several active components (IC chips) and passive components (SAW, condenser, resistor and coil) and sealed
6 High Performance Computing: Computer with large-scale, ultra high-speed computing/processing capability
Reference
"Development of HRDP® Material for Formation of Ultra-Fine Circuits with Glass Carrier for Fan Out Panel Level Package" (Release as of January 25, 2018)
https://www.mitsui-kinzoku.com/Portals/0/resource/uploads/topics_180125e.pdf?TabModule127
Video of the RDL First method using HRDP®
https://www.youtube.com/watch?v=vHhng-NV9QA
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210124005060/en/
Contact information
[Contact for inquiries about this release and HRDP® products]
Corporate Communications Department, Mitsui Mining & Smelting Co., Ltd.
Mr. KASAHARA Norio
TEL: +81-3-5437-8028 E-mail: PR@mitsui-kinzoku.com
[Contact for Inquiries about HRDP® products] (Native language is available.)
In China
EVER TEAM TECHNOLOGY (NANJING) CO., LTD.
Mr. Jordon Jiang
TEL: +86-18601423513 E-MAIL: jordon@evertech.com.tw
In Taiwan
EVER TECH INSTRUMENTAL CO., LTD
Mr. Alvin Tu
TEL: +886-915973025 E-MAIL: alvin@evertech.com.tw
In Korea
AJ COMPANY
Mr. Suh Jeong Wook
TEL: +82-1053711563 E-MAIL: jwsuh@aj-company.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Airship Announces Results Guarantee; Releases Commissioned Study Finding 476% ROI for Composite Organization22.7.2026 18:00:00 EEST | Press release
Airship, the mobile-first customer experience platform leader, today announced its Airship Results Guarantee, a corporate commitment to achieve predetermined business outcomes for new customers. Concurrently, the company released the results of a separate, commissioned Total Economic Impact™ (TEI) study conducted by Forrester Consulting on behalf of Airship, July 2026. The study found that a composite organization based on interviewed customers achieved a 476% Return on Investment (ROI) with a payback period of less than six months. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260722832535/en/ Airship has launched a new results guarantee offer to stand behind its value. Alongside this offer, the team shared the results of a new Total Economic Impact™ (TEI) study commissioned with Forrester Consulting illustrating that a composite organization achieved a 476% ROI with a payback period of less than six months. “We introduced
Arrakis Comes out of Stealth With $38M to Help Industrial Enterprises Compete in the AI Era22.7.2026 16:56:00 EEST | Press release
Arrakis, the AI deployment company helping industrial companies install AI agents for mission-critical operations, today announced a $30 million Series A led by Blossom Capital, with participation from existing investor Accel, which also led the company's $7.5 million seed round. The round brings total funding to around $38 million and includes backing from prominent technology leaders, including Olivier Pomel, founder and chief executive of Datadog, Olivier Godement, OpenAI’s Head of business products and Junaid Hussein, founder of Cambridge Aerospace. Founded in January 2026 by former Accel investor Rafael Quintanilla, together with co-founders Haroun Beltaifa, Romain Fouilland and Mikhail Galkov - alumni of Palantir, DeliveryHero, Revolut, Datadog and ASML - Arrakis helps industrial companies deploy AI into core operational workflows across aerospace, energy, logistics, manufacturing, construction and telecommunications markets. Across the US and Europe, governments and businesses a
Vultr and AMD Support the University of Cambridge's TESSERA AI Project to Accelerate Global Environmental Monitoring22.7.2026 16:00:00 EEST | Press release
Vultr, the world’s largest privately-held cloud infrastructure company, and AMD, a leader in high-performance and AI computing, have announced their support for the University of Cambridge's Energy & Environment Group in developing TESSERA, a groundbreaking AI foundation model designed to monitor environmental change internationally at unprecedented scale. Vultr is providing the computational infrastructure, based on AMD Instinct MI325X accelerators, necessary to generate global embeddings covering Earth's land surface from 2017 to 2025, enabling applications in agriculture, biodiversity conservation, and renewable energy infrastructure monitoring. The collaboration represents a significant advancement in applying artificial intelligence to planetary conservation challenges. TESSERA processes data from European Space Agency Sentinel satellites to create detailed embeddings - compressed AI representations - of every 10-meter square of Earth's surface. TESSERA represents the most accurat
Omilia Appoints Ryan Kam as Chief Marketing Officer to Lead Global Brand and Growth Strategy22.7.2026 15:00:00 EEST | Press release
Omilia, a global leader in Self-Learning Agentic CX, today announced the appointment of Ryan Kam as Chief Marketing Officer (CMO). Ryan will be responsible for Omilia's global brand, demand generation, and marketing strategy as the company scales its go-to-market presence across enterprise markets. In his new role, Kam will own Omilia's global marketing function, spanning brand strategy, demand generation, product marketing, analyst relations and communications. He joins at a moment of significant commercial momentum: Omilia has seen accelerating enterprise demand across all industries and is investing in a marketing engine built to match the pace of its growth. Ryan Kam brings more than 20 years of marketing leadership across some of the most recognized names in enterprise technology. Most recently, he served as CMO at Egnyte, a leader in cloud content security and governance. Prior to that, Kam held the CMO role at LogicMonitor, where he drove growth for one of the leading infrastruc
Echodyne Announces ATAK Integration for MESA® Radar Platform22.7.2026 15:00:00 EEST | Press release
Echodyne, the radar platform company, today announced the availability of an Android Team Awareness Kit (ATAK) plugin for its MESA® radar platform. The integration enables users to configure, control, and visualize data from Echodyne radars within the ATAK environment, supporting military, public safety, and security operations that rely on TAK for shared situational awareness. The plugin extends radar management and visualization capabilities to ATAK users, allowing high-fidelity radar data and system controls to be accessed through a familiar operational interface. By integrating radar data into existing TAK workflows, organizations can streamline deployment, reduce operator workload, and improve access to real-time situational awareness. TAK is a government-developed geospatial platform used across U.S. military, federal, state, and local government organizations, as well as by U.S. partner nations. According to the U.S. Army TAK Product Center, the TAK ecosystem supports 15 Departm
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom