Mitsui Mining & Smelting Co., Ltd. to Initiate Mass Production of HRDP®, a Special Glass Carrier for Next-Generation Semiconductor Packaging Devices
For the commercialization of HRDP®1, a special glass carrier for the next-generation semiconductor packaging devices, Mitsui Mining & Smelting Co., Ltd. (President: Keiji Nishida; hereinafter, “Mitsui Kinzoku”) has been expanding the establishment of a system for mass production in collaboration with GEOMATEC Co., Ltd. (President: Kentaro Matsuzaki). Mitsui Kinzoku is pleased to announce today that mass production of HRDP® has started for a domestic multi-chip module manufacturer.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210124005060/en/
Exterior photograph of HRDP®, in the 12-inch wafer type (Photo: Business Wire)
In its January 2018 news release, Mitsui Kinzoku announced the development of HRDP®, a material for the creation of ultra-fine circuits using a glass carrier for the Fan Out panel level package, based on the RDL First method2.
HRDP® is a special glass carrier capable of achieving high production efficiency of the Fan Out packages3, the next-generation semiconductor packaging technologies, including ultra-high density circuits designed with a line/space (L/S) ratio of 2/2 μm or less4. Currently, over 20 customers are evaluating HRDP® for commercialization.
As the first stage, mass production for a domestic multi-chip module manufacturer began in January 2021. This customer will use HRDP® to manufacture devices for the 5G market, which is expected to expand in the future, including RF modules5, and other devices for a variety of applications with plans to increase sales.
As the second stage, an overseas leading package manufacturer is planning to adopt HRDP® within FY2021.
In addition, there are plans to initiate the mass production at the other new customers for a variety of applications, such as HPC6 and mobile phones for FY2022 and onward, and the HRDP® market is expected to expand.
Under its slogan of Material Intelligence, Mitsui Kinzoku will realize customers’ wishes to ensure stable quality and sufficient supply, to provide customers with one stop solutions and to endeavor to increase its market share.
Description of Terms
1 Abbreviation of High Resolution De-bondable Panel
2 Re-Distribution Layer First method: Semiconductor chips are packaged after the process of forming the redistribution layer
3 Fan Out Package: Substrate-less packaging technology with ultra-fine re-distribution layer extended outside the chip size
4 L/S=2/2 µm: The line width of 2 µm and the space between neighboring circuit lines of 2 µm.
5 Radio Frequency Module: Product equipped with several active components (IC chips) and passive components (SAW, condenser, resistor and coil) and sealed
6 High Performance Computing: Computer with large-scale, ultra high-speed computing/processing capability
Reference
"Development of HRDP® Material for Formation of Ultra-Fine Circuits with Glass Carrier for Fan Out Panel Level Package" (Release as of January 25, 2018)
https://www.mitsui-kinzoku.com/Portals/0/resource/uploads/topics_180125e.pdf?TabModule127
Video of the RDL First method using HRDP®
https://www.youtube.com/watch?v=vHhng-NV9QA
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210124005060/en/
Contact information
[Contact for inquiries about this release and HRDP® products]
Corporate Communications Department, Mitsui Mining & Smelting Co., Ltd.
Mr. KASAHARA Norio
TEL: +81-3-5437-8028 E-mail: PR@mitsui-kinzoku.com
[Contact for Inquiries about HRDP® products] (Native language is available.)
In China
EVER TEAM TECHNOLOGY (NANJING) CO., LTD.
Mr. Jordon Jiang
TEL: +86-18601423513 E-MAIL: jordon@evertech.com.tw
In Taiwan
EVER TECH INSTRUMENTAL CO., LTD
Mr. Alvin Tu
TEL: +886-915973025 E-MAIL: alvin@evertech.com.tw
In Korea
AJ COMPANY
Mr. Suh Jeong Wook
TEL: +82-1053711563 E-MAIL: jwsuh@aj-company.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
IDWS 2025 Concludes with Focus on Global Knowledge Exchange, Financial Opportunities, and Scalable Water Solutions16.12.2025 21:03:00 EET | Press release
The 4th Innovation Driven Water Sustainability Conference (IDWS) 2025 concluded on Wednesday in Jeddah, confirming its status as one of the world’s most influential platforms for shaping the future of water innovation, sustainability, and security. Gathering senior global policymakers and international industry leaders, this year’s edition has advanced critical dialogue on safeguarding the planet’s most vital resource, with Saudi Arabia at the forefront. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251216483490/en/ Investors, innovators, and global institutions gather in Saudi to outline how capital, collaboration, and governance can accelerate long term water sustainability (Photo: AETOSWire) Among the most consequential engagements were a series of meetings that brought together discussions powered by SWA, centred on shared challenges, knowledge exchange, and exploring opportunities within the global water ecosystem. Att
OAG Appoints ex-Skyscanner Executive Filip Filipov as New Chief Executive Officer16.12.2025 18:00:00 EET | Press release
OAG announces today the appointment of Filip Filipov, ex-Skyscanner executive, as new Chief Executive Officer. Filip Filipov currently serves as the company’s Chief Operating Officer and takes over from Phil Callow who has chosen to step down having completed thirteen transformational years at the helm of OAG to pursue his many other interests. Since joining in 2024, Filipovhas played a leading role in the company’s ambitious next phase of growth and ongoing acceleration. He will now lead OAG into a new era defined by advanced data products and AI-driven intelligence. Before joining OAG, Filipov held senior roles in travel technology and big-data consulting, including on Skyscanner’s executive team. Filip Filipov said: “It’s a privilege to step into this role and lead a company with such a strong heritage and reputation. I’m excited for what’s ahead and committed to serving our customers with the reliability, service, and innovation they depend on.” Chairman of OAG, Gehan Talwatte, com
Xsolla Integrates SPENN in Rwanda and Zambia Giving Developers Access to a Strong Consumer-Merchant Ecosystem16.12.2025 17:49:00 EET | Press release
Xsolla, a global video game commerce company that helps developers launch, grow, and monetize their games, today announced that it has added SPENN to its payments solution portfolio in Rwanda and Zambia. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251216303338/en/ Xsolla Integrates SPENN In Rwanda And Zambia Giving Developers Access To A Strong Consumer-Merchant Ecosystem Both Rwanda and Zambia are mobile-first, wallet-led economies where mobile money drives financial inclusion and rapid growth in digital transactions. Reports found that approximately 86% of Rwandan adults own or have used mobile money. As of mid-2024, mobile money transaction volumes in Zambia increased by 44% to 1.4 billion transactions from mid-2023. By adding SPENN as a payment method to its portfolio, Xsolla enables players to continue paying seamlessly in a way they are already familiar with. Key benefits of the SPENN integration include: Streamline
New Survey of Nearly 4,300 C-suite Leaders Reveals Intensifying Demand for Faster Innovation, Higher ROI and Stronger Business Resilience16.12.2025 16:00:00 EET | Press release
Rimini Street, Inc. (Nasdaq: RMNI), a global provider of end-to-end enterprise software support, managed services and Agentic AI ERP innovation solutions, and the leading third-party support provider for Oracle, SAP and VMware software, today announced the findings of its new global survey, “C-suite Imperatives: Accelerating Innovation in a Shifting Landscape.” The research was conducted in partnership with Censuswide surveying nearly 4,300 CFOs, CIOs, CEOs and CISOs across the globe, examining the pressures influencing executive-level technology decisions and the priorities shaping their investment strategies. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251216456670/en/ New Survey of Nearly 4,300 C-suite Leaders Reveals Intensifying Demand for Faster Innovation, Higher ROI and Stronger Business Resilience The analysis shows executives are recalibrating their strategies around AI, automation and resilience as boards push
Enersense Selects Sitetracker as the Platform of Choice for 5G and Fiber Expansion Initiatives16.12.2025 16:00:00 EET | Press release
Sitetracker, the global leader in complete Asset Lifecycle Management, announced that Enersense, a leading lifecycle partner for customers operating in energy transmission and production, industrial energy transition and telecommunications services across Finland and the Baltics, has selected Sitetracker to digitize and scale its operations. The implementation enabled Enersense to replace legacy systems, standardize workflows, and support their ability to deliver services with short lead times and high process precision. The first phase of implementation is already supporting Finland’s 5G and rapidly expanding fiber-to-the-home (FTTH) initiatives. Before Sitetracker, Enersense relied on spreadsheets and email to manage project execution, resulting in limited visibility into project milestones, asset tracking, and field performance. As 5G and FTTH deployment accelerated, these manual processes created operational bottlenecks, slowed invoicing, and hindered communication with customers a
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom