Mitsui Mining & Smelting Co., Ltd. to Initiate Mass Production of HRDP®, a Special Glass Carrier for Next-Generation Semiconductor Packaging Devices
25.1.2021 09:00:00 EET | Business Wire | Press release
For the commercialization of HRDP®1, a special glass carrier for the next-generation semiconductor packaging devices, Mitsui Mining & Smelting Co., Ltd. (President: Keiji Nishida; hereinafter, “Mitsui Kinzoku”) has been expanding the establishment of a system for mass production in collaboration with GEOMATEC Co., Ltd. (President: Kentaro Matsuzaki). Mitsui Kinzoku is pleased to announce today that mass production of HRDP® has started for a domestic multi-chip module manufacturer.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20210124005060/en/
Exterior photograph of HRDP®, in the 12-inch wafer type (Photo: Business Wire)
In its January 2018 news release, Mitsui Kinzoku announced the development of HRDP®, a material for the creation of ultra-fine circuits using a glass carrier for the Fan Out panel level package, based on the RDL First method2.
HRDP® is a special glass carrier capable of achieving high production efficiency of the Fan Out packages3, the next-generation semiconductor packaging technologies, including ultra-high density circuits designed with a line/space (L/S) ratio of 2/2 μm or less4. Currently, over 20 customers are evaluating HRDP® for commercialization.
As the first stage, mass production for a domestic multi-chip module manufacturer began in January 2021. This customer will use HRDP® to manufacture devices for the 5G market, which is expected to expand in the future, including RF modules5, and other devices for a variety of applications with plans to increase sales.
As the second stage, an overseas leading package manufacturer is planning to adopt HRDP® within FY2021.
In addition, there are plans to initiate the mass production at the other new customers for a variety of applications, such as HPC6 and mobile phones for FY2022 and onward, and the HRDP® market is expected to expand.
Under its slogan of Material Intelligence, Mitsui Kinzoku will realize customers’ wishes to ensure stable quality and sufficient supply, to provide customers with one stop solutions and to endeavor to increase its market share.
Description of Terms
1 Abbreviation of High Resolution De-bondable Panel
2 Re-Distribution Layer First method: Semiconductor chips are packaged after the process of forming the redistribution layer
3 Fan Out Package: Substrate-less packaging technology with ultra-fine re-distribution layer extended outside the chip size
4 L/S=2/2 µm: The line width of 2 µm and the space between neighboring circuit lines of 2 µm.
5 Radio Frequency Module: Product equipped with several active components (IC chips) and passive components (SAW, condenser, resistor and coil) and sealed
6 High Performance Computing: Computer with large-scale, ultra high-speed computing/processing capability
Reference
"Development of HRDP® Material for Formation of Ultra-Fine Circuits with Glass Carrier for Fan Out Panel Level Package" (Release as of January 25, 2018)
https://www.mitsui-kinzoku.com/Portals/0/resource/uploads/topics_180125e.pdf?TabModule127
Video of the RDL First method using HRDP®
https://www.youtube.com/watch?v=vHhng-NV9QA
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20210124005060/en/
Contact information
[Contact for inquiries about this release and HRDP® products]
Corporate Communications Department, Mitsui Mining & Smelting Co., Ltd.
Mr. KASAHARA Norio
TEL: +81-3-5437-8028 E-mail: PR@mitsui-kinzoku.com
[Contact for Inquiries about HRDP® products] (Native language is available.)
In China
EVER TEAM TECHNOLOGY (NANJING) CO., LTD.
Mr. Jordon Jiang
TEL: +86-18601423513 E-MAIL: jordon@evertech.com.tw
In Taiwan
EVER TECH INSTRUMENTAL CO., LTD
Mr. Alvin Tu
TEL: +886-915973025 E-MAIL: alvin@evertech.com.tw
In Korea
AJ COMPANY
Mr. Suh Jeong Wook
TEL: +82-1053711563 E-MAIL: jwsuh@aj-company.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
FPT Named in Forrester’s The SAP Services Landscape Report30.9.2026 06:00:00 EEST | Press release
Global technology corporation FPT has been included among the notable providers in The SAP Services Landscape, Q3 2026, published by Forrester Research, Inc. The report provides an overview of SAP services providers, examining their market focus, geographic presence, and business specializations to support enterprises in evaluating potential technology partners. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260929359531/en/ The report includes FPT as a systems integrator with an Asia Pacific geographic focus and an industry focus spanning financial services and insurance, healthcare, and manufacturing. FPT identified SAP Business Data Cloud, SAP Enterprise Resource Planning (ERP), and SAP Supply Chain Management (SCM) as its three primary extended business scenario focus areas, what FPT believes reflects its emphasis on modernizing core enterprise systems and enabling more integrated, data-driven operations. Building on mor
SES Successfully Prices €500 million Eurobond30.9.2026 05:41:00 EEST | Press release
NOT FOR RELEASE, PUBLICATION OR DISTRIBUTION IN OR INTO OR TO ANY PERSON LOCATED OR RESIDENT IN, OR AT ANY ADDRESS IN, THE UNITED STATES OF AMERICA, ITS TERRITORIES AND POSSESSIONS (INCLUDING PUERTO RICO, THE U.S. VIRGIN ISLANDS, GUAM, AMERICAN SAMOA, WAKE ISLAND AND THE NORTHERN MARIANA ISLANDS), ANY STATE OF THE UNITED STATES OF AMERICA OR THE DISTRICT OF COLUMBIA (THE UNITED STATES) OR TO ANY U.S. PERSON (AS DEFINED IN REGULATION S OF THE UNITED STATES SECURITIES ACT OF 1933, AS AMENDED (THE SECURITIES ACT)) OR IN OR INTO ANY JURISDICTION WHERE IT IS UNLAWFUL TO RELEASE, PUBLISH OR DISTRIBUTE THIS ANNOUNCEMENT (SEE “OFFER AND DISTRIBUTION RESTRICTIONS” BELOW). SES today announced the successful launch and pricing of a bond offering in which the company has agreed to sell senior unsecured fixed rate notes due in 2031 for a total amount of EUR 500 million. The new notes will bear a coupon of 5.625% and were priced at 99.667% of their nominal value. SES is rated Ba1 (stable) and BBB- (
Murata Begins Mass Production of World’s Smallest 0201-inch Size Three-Terminal Low-ESL MLCCs30.9.2026 05:00:00 EEST | Press release
Murata Manufacturing Co., Ltd. (TOKYO: 6981) (ISIN: JP3914400001) has begun mass production of the LLD series, the world’s smallest* three-terminal low-equivalent series inductance (ESL) multilayer ceramic capacitors (MLCC). Measuring just 0201-inch size (0.6 × 0.3 mm), the new products reduce mounting area by approximately 64% compared with Murata’s previous smallest 0402-inch size (1.0 × 0.5 mm), freeing up valuable PCB space in compact devices such as smartphones and wearables. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260929596419/en/ [Murata Manufacturing Co., Ltd.] Three-Terminal Low-ESL MLCCs As smartphones and wearables incorporate increasingly powerful ICs, maintaining a stable power supply becomes more challenging. High-speed operation causes current demand to change rapidly, which can lead to fluctuations in the voltage supplied to the IC. Minimizing this instability is essential for reliable performance. Thr
Lattice to Showcase AI-Driven Low Power FPGA Innovation at FPGA Horizons Conference29.9.2026 23:00:00 EEST | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced its participation in the upcoming FPGA Horizons conference, taking place on October 6 – 7, 2026 in London. As part of the conference’s technical program, Lattice will deliver a Tech Talk presentation and a hands-on workshop, and host a demo showcase focused on how its low power FPGA solutions are advancing AI at the edge. Who: Lattice Semiconductor What / When (GMT+2): Oct. 6, 2026 Demo showcase including Lattice Holoscan Sensor Bridge solution and Lattice Prompt™ AI-driven FPGA design tool Tech Talk (10:10 – 10:30 a.m.), Shaw Theater: Practical Security Fundamentals for FPGA Engineers Oct. 7, 2026 Workshop (1:30 – 4:40 p.m.), Hyde Park room Lattice Nexus™-based FPGA hands-on Lattice Prompt™ agentic AI workflow Where: FPGA Horizons Conference, Pullman London St Pancras, Euston Road, London NW1 FPGA Horizons is a UK-based conference for FPGA industry specialists. Supporting Res
NetApp and Oracle to Launch Fully Managed Cloud Storage Service for Demanding AI and Enterprise Workloads29.9.2026 20:30:00 EEST | Press release
NetApp® (NASDAQ: NTAP), the Intelligent Data Infrastructure company, and Oracle today announced a new fully managed storage service that brings enterprise-grade NetApp storage natively to Oracle Cloud Infrastructure (OCI). The service will bring NetApp ONTAP® data management capabilities natively to OCI to help organizations simplify the migration and management of critical AI and enterprise workloads in the cloud. Oracle Cloud Infrastructure NetApp Storage Service is designed to be a fully managed OCI-native storage service that brings NetApp ONTAP data management capabilities to OCI. It helps enterprises migrate, run, protect, and modernize databases, enterprise applications, virtualized environments, EDA/HPC, regulated applications, and AI data pipelines while preserving familiar storage operations. “Customers want the flexibility to move AI and enterprise workloads to the cloud without giving up operational simplicity, data management, and reliability,” said Pravjit Tiwana, Senior
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom