NUCB International College: A World-class International Boarding High School to Open in Japan
20.4.2022 12:00:00 EEST | Business Wire | Press release
Kurimoto Educational Institute (KEI, Chairman: Dr. Hiroyuki Kurimoto), the parent organisation of the Nagoya University of Commerce (NUCB) received the official approval for the establishment of its boarding high school, NUCB International College (NIC).
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20220413006084/en/
NIC Campus Overview (Photo: Business Wire)
World-Class Full Boarding High School in Japan
The plan to open the school in September 2022 is progressing as scheduled and NIC is now officially accepting applications from students around the world.
The co-educational institution is designed to provide a world-class education with excellent facilities and a rich natural environment, on its 200-acre campus, in Nisshin city, Japan.
School Outline
School Name: NUCB International College
Capacity: 225 students, Co-educational, Full boarding
Programme: Japanese Senior High School & International Baccalaureate Diploma Programme (IBDP)*
Year level range: 10-12. Student transfers accepted until Year 11.
Language of instruction: English
Location: 4-4 Sagamine, Komenoki, Nisshin, Aichi, Japan
Opening date: September 2022
*NUCB International College is a candidate school for the Diploma Programme. It is pursuing authorisation as an IB World School. Candidate status gives no guarantee that authorisation will be granted.
Educational excellence
NIC stands at the brink of an educational shift, being the only International Boarding High School in Japan implementing innovative early leadership education through the Harvard-style Case Method. Small classes enable personalised supervision by multinational faculty members with master's or doctoral degrees and faculty from affiliated business schools.
Boarding Education
With reference to international boarding school standards, boarding life is supported daily by House Supervisors and House Mentors. Through communal living in an international environment, participants learn the discipline and courtesy required of leaders in the context of diversity. NIC also offers a Summer School and the Bridging Programme (preparation for September enrolment). Plans are also underway for homestays, international exchange programmes, and cultural enrichment trips in Japan.
About Kurimoto Educational Institute
Parent organisation of NUCB Undergraduate School, NUCB Business School, and Nagoya International Junior and Senior High Schools, KEI promotes the high-quality internationalisation of education by acquiring international accreditations (AACSB, EQUIS, AMBA, and IBDP) for the schools it establishes, since 1935.
Click below to find out why NIC should be your number one choice for further studies.
https://ic.nucba.ac.jp/college/advantage/
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20220413006084/en/
Contact information
Takeo Oyama, Assistant Director (NIC)
Kosuke Okamoto, Director of Corporate Headquarters (KEI)
TEL: (+81) 561-73-8181
Email: info@ic.nucba.ac.jp
Website: https://ic.nucba.ac.jp/
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 23:06:00 EET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 23:00:00 EET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 20:50:00 EET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 19:08:00 EET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 17:00:00 EET | Press release
ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent chip teams. ChipAgents is building the foundational AI infrastructure for chip design, with coordinated AI Agents that can plan, reason, execut
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom