Phillips-Medisize Wins Contract to Manufacture First Electronic-Enabled Combination Drug Delivery Product
22.10.2019 18:30:00 EEST | Business Wire | Press release
Phillips-Medisize, a Molex company, announced today an agreement with a leading biotechnology company to manufacture a wearable, electronic-enabled combination product. The product is a post-phase III development-stage combination drug and device that combines two-day, single use, disposable technology for subcutaneous drug delivery.
The wearable combination product – which is replaced every two days – is about the size of a hockey puck, and can either be adhered to the patient’s body, via an adhesive patch, or worn near the infusion site.
Phillips-Medisize, which built devices and supplied key data to support the FDA NDA submission, will provide final assembly, testing and quality control of this electronic combination product. Specifically, Phillips-Medisize will handle the prefilled drug cartridge that fits inside the device. This drug container is aseptically filled and shipped to Phillips-Medisize. Several state-of-the-art Phillips-Medisize facilities are involved in various stages of manufacturing the combination product – including molding, assembly, drug handling, labeling, reconciliation and more.
“This exciting new contract taps over 13 years of Phillips-Medisize’s combination product expertise, which includes cold chain drug handling and first programs with API handling. We have experience in manufacturing both combination and electronic-enabled drug delivery devices, and this is our first product submitted for FDA approval that includes both,” said Matt Jennings, CEO and President, Phillips-Medisize.
Pending receipt of FDA approval, Phillips-Medisize is contracted to provide commercialization services from its Hudson, WI-based manufacturing site. The combination product is slated for launch in 2H 2020. Backed by Phillips-Medisize’s scalability to move to high volume production, the product will be well positioned for a successful market launch.
Strong potential also exists to bring the device onto a connected health platform in the future, by embedding low-cost connectivity that will make it possible to capture and communicate data between patient and provider in order to help monitor adherence.
About Phillips-Medisize
Phillips-Medisize, a Molex company, is an end-to-end provider of innovation, development and manufacturing solutions to the pharmaceutical, diagnostics, medical device and specialty commercial market segments. Backed by the combined global resources of Molex and its parent company Koch Industries, Phillips-Medisize’s core advantage is the knowledge of its people to integrate design, molding, electronics, and automation, providing innovative, high-quality manufacturing solutions. For more information, please visit www.phillipsmedisize.com or www.molex.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20191022005826/en/
Contact information
For more information, contact:
Heather Ditzler
Phone +1 715-377-7261
heather.ditzler@phillipsmedisize.com
Paula Kasper (Europe)
Phone +41448383933
paula.kasper@phillipsmedisize.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
INSEAD Marks the First Milestone in Its Europe Campus Re-imagination25.8.2026 13:07:00 EEST | Press release
INSEAD, The Business School for the World, yesterday inaugurated the Tour Desmarais, marking a major milestone in its Europe Campus Re-imagination (ECR)—a ten-year, €350 million investment totransform its campus in Fontainebleau for the future of business education and learning. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260825752920/en/ From left: Charles Desmarais, Maria Desmarais, Nicolas Desmarais, Paul Desmarais MBA'79, Helene Desmarais, Jean-Michel Wilmotte, Francisco Veloso, Paul Desmarais III MBA'10J, Borina Andrieu The inauguration took place in the presence of members of the Desmarais family, public officials, members of the INSEAD community, partners and distinguished guests from across the business, academic and philanthropic communities. Nestled within one of Europe's most iconic forests, the INSEAD Europe Campus has welcomed students, executives, researchers and entrepreneurs from around the world for more
CTC Global Expands Advanced Conductor Portfolio with ACCC® Plus Conductor25.8.2026 13:00:00 EEST | Press release
CTC Global, the world’s leading developer and manufacturer of high-capacity Advanced Conductors, today announced the introduction of the ACCC® Plus Conductor, an enhanced addition to the ACCC® Conductor family. Utilities are facing a new set of transmission planning challenges, as load growth, generation shifts, interconnection queues, permitting constraints, and evolving reliability requirements put increasing pressure on both existing and new transmission infrastructure. Utilities must quickly add capacity while managing project costs, clearance constraints, structure requirements, and long-term performance. Built on highly proven ACCC® Conductor Technology, the ACCC® Plus Conductor is designed to deliver greater mechanical performance, improved efficiency, and enhanced sag performance, while offering greater design flexibility for demanding transmission line applications. The new conductor option features a higher-strength, higher-modulus core than standard ACCC® Conductor, supporti
From Factory to Field: emnify Launches OEM Program with Free SGP.32 Bootstrap Connectivity25.8.2026 11:00:00 EEST | Press release
emnify, a global provider of cloud-native IoT connectivity, today announced a new program for original equipment manufacturers (OEMs) building connected products for international markets. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260825932817/en/ From Factory to Field with SGP.32 Bootstrap Connectivity The program addresses two common challenges for OEMs: testing and configuring devices that would otherwise leave the factory without connectivity and managing customer-specific physical SIMs throughout production and fulfilment. It enables OEMs to ship a single device SKU globally with built-in SGP.32 bootstrap connectivity, allowing each device to connect to the relevant device-management system for connectivity testing, configuration, and digital eSIM profile provisioning - from the factory onward. Free emnify SGP.32 bootstrap profiles are available for every connected device across an OEM’s production volumes - not on
Nessum Adoption Expands Across Global Energy-Management Infrastructure25.8.2026 11:00:00 EEST | Press release
Nessum Alliance*2 today announced the expansion of Nessum technology in commercial HVAC and smart grid applications through deployments by Alliance members Daikin Industries, Ltd. and Power Plus Communications AG (PPC). The Alliance also noted that cumulative worldwide shipments of LSI devices incorporating Nessum IP have surpassed six million units, according to Panasonic Holdings Corporation, the technology licensor, underscoring its maturity and market adoption. As energy management, digitalization, and sustainable infrastructure accelerate worldwide, organizations need communications networks that combine reliability and flexibility. By enabling high-speed IP communications over existing wiring, Nessum is expanding its role across energy-management applications. Deployments by Daikin and PPC demonstrate how IEEE 1901*3-based Nessum technology delivers value in real-world infrastructure environments, connecting systems, devices, and operational data across critical sectors. In the H
Xsolla Unveils Integrated Commerce Strategy at gamescom dev and gamescom 2026 With New Tools and Innovations25.8.2026 10:00:00 EEST | Press release
Xsolla, a global video game commerce company that helps developers launch, grow, and monetize their games, today announced it is set to return to gamescom dev and gamescom 2026, the world’s premier event for computer and video games, taking place August 24th to August 30th in Cologne, Germany, EU. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260825332614/en/ Graphic: Xsolla At this year’s event, Xsolla will showcase major releases from the past several weeks spanning creator marketing, global payments, backend infrastructure, and new distribution channels, all built to help developers launch, grow, and monetize with less friction: Expanded Xsolla Partner Network: An expanded network with verified creator marketing inside Publisher Account, more than 15 new local payment methods across three continents, and CLI support for the free AI Toolkit that takes developers from merchant account to working web shop in a single sessio
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom