Quectel powers global connectivity and flexible deployment models with new iSIM-enabled module
21.6.2022 12:00:00 EEST | Business Wire | Press release
Quectel Wireless Solutions has launched the new BG773A-GL ultra-compact LTE Cat M1, NB1 and NB2 module which offers integrated SIM (iSIM) support. The iSIM capability of this new module provides huge flexibility and simplicity for integrators and IoT service providers because, in essence, it enables a device with a single stock-keeping unit (SKU) number to have the right connectivity to support its needs globally. Ultimately, this provides a simpler way for integrators to adopt cellular connectivity, removing the needs for country-specific SIM cards and simplifying the logistics of traditional, plastic SIM deployments by eradicating the need for on-site or in-country adaptations.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20220621005267/en/
Quectel's BG773A-GL ultra-compact LTE Cat M1, NB1 and NB2 module which offers integrated SIM (iSIM) support (Photo: Business Wire)
Quectel has been at the forefront of making the promise of iSIM a reality and has been working to tightly align module performance with the new wave of embedded and integrated SIM features that are revolutionizing what is possible in IoT connectivity.
The BG773A-GL module also features ultra-low power consumption implemented by the MIPS 5150 processor and integrated RAM and flash, which help reduce current consumption to low levels in various modes, including power saving mode (PSM) and extended discontinuous reception (eDRX). Importantly, the BG773A-GL boasts a comprehensive hardware-based security feature - Integrated Security Elements (ISE). This is essential because iSIM relies on having a robust secure element to enable it to connect to the best available connectivity at the point of deployment. The module will be commercially available from mid July 2022.
“We’re delighted to have launched the Quectel BG773A-GL module which brings iSIM-enabled connectivity to the global marketplace,” says Richard Hart, Director of Global Connectivity, Quectel Connectivity Solutions. “By enabling integrators to create a single global product with one SKU, logistics and supply chain issues are eliminated and IoT organizations can simply deploy their products anywhere safe in the knowledge that they will be able to access secure, high-quality connectivity with no need for localization and different variants to be manufactured for different markets. This is a giant leap forward for simplifying IoT and one of the key steps needed to build a smarter world.”
The module offers an ultra-compact SMT form factor of 14.9 mm × 12.9 mm × 1.9 mm and enables integrators and developers to design applications easily taking advantage of its low power consumption and compact design structure. The BG773A-GL’s industry-standard interfaces and abundant functionalities extend the suitability of the module to a wide range of IoT applications, such as wireless POS, smart metering, tracking, wearable devices, and many others.
Quectel has collaborated with Kigen, the iSIM pioneer and global security leader to enable the iSIM functionality on BG773A-GL. Kigen’s industry-leading iSIM OS and key insertion services bring a wide selection of networks that augment Quectel connectivity for OEMs to meet their market needs.
“Quectel’s adoption of Kigen iSIM as a pre-packaged solution in the BG773A-GL is a testimony to the maturity of iSIM technology and our ecosystem,” said Vincent Korstanje, CEO of Kigen. “Quectel is a market leader in high-volume manufacturing, and this collaboration will enable OEMs who want to move quickly from pure embedded play to offering full IoT solutions for global markets.”
For a live demonstration of the Quectel iSIM, visit Quectel on Booth No 171, Hall 5 at Embedded World Nuremberg, June 21- 23 2022.
About Quectel
Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global IoT solutions provider backed by outstanding support and services. Our growing global team of over 4,000 professionals sets the pace for innovation in cellular, GNSS and WiFi/BT modules, antennas and IoT connectivity. Listed on the Shanghai Stock Exchange (603236.SS), our international leadership is devoted to advancing IoT across the globe.
For more information: www.quectel.com, LinkedIn, Facebook and Twitter.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20220621005267/en/
Contact information
Ashley Liu, + 86-551-6586 9386 x 8016, media@quectel.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Westlake Epoxy Expands Distribution Relationship with Brenntag to India18.2.2026 03:30:00 EET | Press release
Westlake Corporation (NYSE: WLK) today announced that Westlake Epoxy will expand its long‑standing distribution relationship with Brenntag to South and West India. The agreement builds on a successful collaboration across Europe, North and South America, and Southeast Asia, extending Westlake Epoxy’s reach into one of the world’s fastest‑growing coatings, adhesives and construction markets. Under the expanded collaboration, Brenntag will distribute Westlake Epoxy’s established portfolio of epoxy solutions for coatings, adhesives and construction applications, including the EPON™, EPIKOTE™, EPIKURE™ and EPI‑REZ™ product lines. Customers are expected to benefit from reliable local supply, technical service and application‑focused formulation support tailored to regional requirements. India’s coatings, adhesives and construction sectors continue to grow, driven by infrastructure investment, urbanization and increasing performance expectations. By combining Westlake Epoxy’s proven epoxy te
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 23:06:00 EET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 23:00:00 EET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 20:50:00 EET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 19:08:00 EET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
