Quectel’s Ultra-high Bandwidth 5G R16 Module Certified for Use on T-Mobile’s 5G and LTE-A Networks
14.9.2022 18:41:00 EEST | Business Wire | Press release
Quectel Wireless Solutions, a global IoT solutions provider, has announced that its 5G NR module RM520N-GL, compliant with 3GPP Release 16 (R16) standards, has been certified to operate on T-Mobile’s 5G and LTE-A networks in the United States.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20220829005280/en/
Quectel's 5G module RM520N-GL and its IoT application scenarios (Photo: Business Wire)
With this certification, RM520N-GL customers can commercially deploy their home gateways, industrial routers, industrial automation devices, unmanned delivery vehicles, robots, drones, consumer and industrial laptops and other next generation IoT applications on T-Mobile’s 5G and LTE-A networks.
“We are thrilled to see that Quectel has made further significant progress in 5G, as our module supporting 5G R16 features has gained this important certification in the North American market,” said Norbert Muhrer, President and CSO of Quectel. “This confirms our commitment to drive innovation and provide our global customers with highly reliable, best-in-class IoT solutions, which will help accelerate the next wave of 5G IoT applications.”
Based on Qualcomm’s SDX62 platform, the RM520N-GL supports both 5G NSA and SA modes, as well as R16 enhanced features such as ultra-high bandwidth, millisecond-level latency, 5G network slicing and ultra-reliability.
Targeting global markets, this module is designed to support 28 major sub-6GHz bands worldwide (n1/ 2/ 3/ 5/ 7/ 8/ 12/ 13/ 14/ 18/ 20/ 25/ 26/ 28/ 29/ 30/ 38/ 40/ 41/ 48/ 66/ 70/ 71/ 75/ 76/ 77/ 78/ 79), is backwards compatible with LTE-A/3G networks and features integrated GNSS for location services. This highly integrated module can significantly enhance customers' global IoT deployments.
Designed in an industry-standard M.2 form factor, the dimensions of the RM520N-GL are 30.0mm x 52.0mm x 2.3mm, making it pin-to-pin compatible with Quectel’s 5G module RM50xQ series, LTE-A Cat 6 module EM06/ EM060K series, Cat 12 modules EM12/ EM12xR/ EM120K series and Cat 16 module EM160R-GL, which facilitates easy network upgrades of customer devices.
The RM520N-GL supports downlink and uplink NR 2 x Carrier Aggregation (CA) and all three combinations of sub-6GHz time division duplex (TDD) and frequency division duplex (FDD) CA, including CA of FDD+TDD, FDD+FDD and TDD+TDD. This ensures greater 5G coverage, capacity and throughput by enabling the combination of available 5G spectrum assets. These features enable the RM520N-GL to have maximum downlink rates of up to 3.4Gbps and maximum uplink rates of up to 900Mbps. These data rates meet the needs of industry applications requiring enhanced mobile broadband and reliable communication capabilities, such as fixed wireless access (FWA), mobile broadband equipment and industrial automation.
Featuring a rich set of internet protocols, the RM520N-GL supports multiple optional functions including eSIM and VoLTE and integrates USB 3.1/ PCIe 3.0 super speed interfaces.
In addition to the T-Mobile approval, Quectel’s RM520N-GL has also achieved worldwide certification from GCF, PTCRB, CE, CCC, RCM, FCC and IC.
In order to help customers simplify their designs, Quectel also provides a full range of off-the-shelf and customized 5G antennas which boost wireless connectivity significantly. IoT developers can bundle the RM520N-GL module with Quectel’s antennas and pre-certification services, reducing both cost and time-to-market for their 5G devices.
About Quectel
Quectel’s passion for a smarter world drives us to accelerate IoT innovation. A highly customer-centric organization, we are a global IoT solutions provider backed by outstanding support and services. Our growing global team of over 4,000 professionals sets the pace for innovation in cellular, GNSS, Wi-Fi and Bluetooth® modules, antennas and IoT connectivity. With regional offices and support across the globe, our international leadership is devoted to advancing IoT and helping build a smarter world.
For more information: www.Quectel.com, LinkedIn, Facebook, and Twitter.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20220829005280/en/
Contact information
Media
Ashley Liu – media@quectel.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
HAZAMA ANDO Becomes an Official Partner in Helical Fusion’s Commercial Fusion Initiative and Signs MoU Toward Construction of the Fusion Pilot Plant6.7.2026 09:40:00 EEST | Press release
Helical Fusion Co., Ltd. (“Helical Fusion”), a Japan-based fusion energy startup developing fusion power plants, and HAZAMA ANDO CORPORATION (“HAZAMA ANDO”), a long-established Japanese general contractor, today announced that HAZAMA ANDO has become an Official Partner in the Helix Program, Helical Fusion’s commercial fusion initiative. The two companies have also signed a memorandum of understanding (“MoU”) to collaborate toward the construction of Helix KANATA, Helical Fusion’s Fusion Pilot Plant targeted for the 2030s. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260706176052/en/ (L-R) Kazuhiko Kuniya (Representative Director and President, HAZAMA ANDO CORPORATION) and Takaya Taguchi (Co-Founder and CEO, Helical Fusion Co., Ltd.) at a press conference in Tokyo on July 6, 2026. Fusion energy has the potential to shift the foundation of energy from natural resources to advanced technology by reproducing, on Earth, the sam
Sofinnova Partners Announces Myricx Bio Agrees to Be Acquired by Novartis6.7.2026 08:15:00 EEST | Press release
Sofinnova Partners, a leading European life sciences venture capital firm, today announced that its portfolio company Myricx Bio (“Myricx”) has reached agreement to be acquired by Novartis, for up to $1.5 billion including $1.1 billion cash upfront plus potential milestone payments. This marks Sofinnova Partners' seventh exit in three years. Myricx Bio is a UK-headquartered transatlantic biotech company focused on the discovery and development of a novel class of payloads for antibody-drug conjugates. The company's platform is built around next-generation N-myristoyltransferase inhibitor (NMTi) payloads, a differentiated mechanism of action designed to address the narrow therapeutic windows and tolerability challenges that have limited earlier generations of ADCs, such as TOPO-1 and tubulin inhibitor payload classes. Myricx Bio's two lead ADC assets, directed towards the established targets B7-H3 and HER2, are designed to bring this differentiated approach to patients across a broad ra
Global New Material International Wins Technology Innovation Best Practice Award at Sino-European ESG Conference6.7.2026 06:59:00 EEST | Press release
Global New Material International Holdings Ltd. has received the Technology Innovation Best Practice Award at the Third Sino-European Corporate ESG Best Practice Conference recently in Mainz, Germany, in recognition of its efforts to advance sustainable development through material innovation. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260705533555/en/ Thorsten Giehler (L), Director of the Economic, Social Development and Employment Division of The German Society for International Cooperation (GIZ), delivered the award to Zhou Fangchao, Executive Director and Vice President of Global New Material International. The annual conference, initiated by the Chinese Consulate General in Frankfurt and jointly organized with Chinese and European partners, recognizes corporate best practices in environmental, social and governance (ESG) performance. This year's event brought together government officials, business leaders and exper
Access Advance Welcomes Samsung and Sharp to the VVC Advance Patent Pool6.7.2026 03:00:00 EEST | Press release
Access Advance LLC today announced significant additions to the VVC Advance Patent Pool, including Samsung Electronics and Sharp Corporation joining as both Licensors and Licensees. The additions strengthen Access Advance's position in VVC licensing, bringing two of the world's largest video codec patent holders into the program on both sides of the license. "The growth we are seeing in VVC Advance reflects the broad range of industries and companies that are moving toward VVC as the next standard for video delivery," said Peter Moller, CEO of Access Advance. "Samsung and Sharp joining as both Licensors and Licensees is significant, but so is the participation of leading smartphone brands and the range of consumer electronics and technology companies now executing licenses. We are building a program that reflects where the video market is actually heading." The following companies have joined the VVC Advance Patent Pool as Licensees since the beginning of 2026: American Future Technolo
Kioxia and Sandisk Begin Production of 10th-Generation 3D Flash Memory Products at Kitakami Plant Fab23.7.2026 13:19:00 EEST | Press release
Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today announced the start of production for their 10th-generation 3D Flash memory technology at Fab2 (K2) at the Kitakami Plant in Iwate Prefecture in Japan. The milestone comes as the companies continue to drive meaningful, multi-year bit growth to address the strong demand for their innovative flash memory technology. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702296115/en/ Unveiling ceremony for the K2 facility In conjunction with the start of production, the companies held an unveiling ceremony for the K2 facility. Opening in September 2025, the facility has produced the companies’ 8th-generation 3D flash memory products and will begin to scale production with the introduction of their 10th-generation products. Both generations of 3D flash memory adopt innovative CBA (CMOS directly Bonded to Array)
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
