Radisys Announces Availability of Advanced Release 16 Compliant 5G NR Software
26.10.2021 15:00:00 EEST | Business Wire | Press release
Radisys® Corporation, a global leader of open telecom solutions, today announced the availability of its Release 16 compliant 5G NR protocol software, which supports low latency use cases for 5G private networks. Radisys’ Connect RAN 5G solution, based on specifications from 3GPP, the Small Cell Forum, and the O-RAN Alliance, enables an elastic and agile 5G network tailored to meet the unique requirements of diverse 5G applications with minimized CAPEX, improved time-to-market, and shortened time-to-revenue. The new Release 16 compliant 5G NR protocol software delivers enhancements in functionality, capacity, coverage, latency, mobility, reliability, and ease of deployment.
News Highlights
- Radisys’ Release 16 compliant protocol software unlocks the full potential of 5G NR, enabling operators to monetize their networks by supporting new use cases for industry verticals. It delivers new features, including URLLC (Ultra Reliable Low Latency Communications), TSN (Time Sensitive Network), NR Unlicensed, 5G Location and Positioning Services and UE Radio Capability Signaling Optimization.
- The upgraded protocol software, with new enhancements for beam management for 5G NR sub-6GHz and mmWave frequency bands, MU-MIMO, New Radio Dual Connectivity (NR-DC), Integrated Access and Backhaul (IAB), and Dynamic Spectrum Sharing (DSS), enables robust and efficient network capacity and coverage.
- Radisys’ Connect RAN 5G Software recently won the Small Cell Forum award for Outstanding Contribution to Small Cell Open RAN Platforms. The software is available pre-integrated and pre-validated on multiple industry-leading platforms to accelerate global 5G deployments.
“We are excited to launch the new version of our Connect RAN 5G Software that is now compliant to the 3GPP Release 16 specification and Open RAN architectures, delivering the critical reliability and ultra-low latency needed for emerging Industry 4.0 use cases,” said Munish Chhabra, SVP and General Manager, Mobility Software and Services, Radisys. “Radisys continues to deliver standards-based 5G software early to market. Working closely with our partners, we remain in lockstep with our customers’ requirements for their 5G solutions and advance the 5G ecosystem.”
About Radisys
Radisys is a global leader in open telecom solutions and services. Its disaggregated platforms and integration services leverage open reference architectures and standards combined with open software and hardware, enabling service providers to drive open digital transformation. Radisys offers an end-to-end solutions portfolio from digital end points, to disaggregated and open access and core solutions, to immersive digital applications and engagement platforms. Its world-class and experienced network services organization delivers full lifecycle services to help service providers build and operate highly scalable and high-performance networks at optimum total cost of ownership. For more information, visit www.Radisys.com.
Radisys® is a registered trademark of Radisys. All other trademarks are the property of their respective owners.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20211026005218/en/
Contact information
Nereus for Radisys
Lori Mesecke, +1-503-459-9150
lmesecke@nereus-worldwide.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
TreviPay Partners with Dynatos to Add e-Invoicing Capabilities to its B2B Payments Infrastructure15.9.2026 08:00:00 EEST | Press release
TreviPay, a global B2B payments infrastructure partner, today announced a partnership with Dynatos to expand e-invoicing capabilities for TreviPay clients operating across Europe and other markets. Through the partnership, Dynatos Routty Cloud proposition will provide embedded e-invoicing technology and compliance support, helping TreviPay clients exchange invoices across different formats, networks and country requirements in Europe and other global markets. E-invoicing requirements continue to expand across Europe and other global markets, adding complexity for businesses managing invoices across more than 60 countries with mandates announced or already in place. At the same time, invoicing has become an increasingly important part of the B2B buyer experience. TreviPay research found 68% of B2B buyers are more likely to choose a supplier offering invoice terms, up from 51% in 2023. As businesses expand across markets, delivering the invoicing experience buyers expect also requires na
Meiji Group to Showcase Japanese-Quality CMO/CDMO Services and a Global Manufacturing Network at CPHI Milan 202615.9.2026 08:00:00 EEST | Press release
Meiji Seika Pharma Co., Ltd. (HQ: Chuo-ku, Tokyo; President and CEO: Toshiaki Nagasato) will debut as the Meiji Group’s Pharmaceutical Segment at CPHI Milan 2026, at Fiera Milano, Milan, Italy, October 6–8, 2026. At the exhibition, the Meiji Group’s Pharmaceuticals Segment will showcase 80 years of expertise in Japanese standard quality control, manufacturing, and supply network from Japan to Europe, India, and Southeast Asia. It will also highlight group-wide contract manufacturing, from development to supply, tailored to customer needs. Through the exhibition, Meiji Seika Pharma aims to raise global awareness of the Meiji Group’s Pharmaceutical Segment, its brands, capabilities, production capacity, and contract manufacturing services, and to forge new global partnerships to expand its CMO/CDMO business. “CPHI Milan 2026” Exhibition Overview Exhibition Name: CPHI Milan 2026 Dates: October 6 (Tue) – 8 (Thu), 2026 Venue: Fiera Milano (Milan, Italy) Exhibition Area: CMO Area Booth Numbe
Signaloid joins Open Chiplet Atlas Alliance and Announces Plans to Make Its UxHw ASICs Available via OCA Ecosystem15.9.2026 07:00:00 EEST | Press release
British compute hardware company Signaloid has joined the Open Chiplet Atlas (OCA) and announced plans to make its UxHw® compute acceleration technology available as chiplets within the OCA ecosystem. The UxHw technology targets AI and simulation workloads that rely on stochastic methods, including quantitative finance, reinforcement learning, engineering simulations, and world models. The announcement follows Signaloid’s recent tapeout of a UxHw ASIC for robotics and physical AI in an ultra-low-power TSMC process. “The Open Chiplet Atlas (OCA) increases innovation in chip design by defining an open architecture for multi-vendor chiplet interoperability. In doing so, it enables new Systems-in-Package (SiPs) with reduced non-recurring engineering (NRE) costs and a vastly expedited time-to-market,” says Wei-han Lien, Chief CPU Architect and Senior Fellow of Tenstorrent. “We are thrilled to welcome Signaloid to the OCA ecosystem. Their unique, innovative accelerator for stochastic workloa
Rimini Street and Datacom Announce Strategic Partnership to Accelerate AI Adoption and Drive IT Optimisation Across ANZ14.9.2026 23:00:00 EEST | Press release
Rimini Street Inc. (Nasdaq: RMNI), the Software Support and Agentic AI ERP Company™ and the leading third-party support provider for Oracle and SAP software, today announced a strategic partnership with Datacom, one of Australasia’s largest homegrown technology services and solutions providers. The reseller agreement will see Datacom offer Rimini Support™ for Oracle and SAP software to its public and private sector customers across Australia and New Zealand. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260914070894/en/ Rimini Street and Datacom Announce Strategic Partnership to Accelerate AI Adoption and Drive IT Optimisation Across ANZ This collaboration brings together Rimini Street's third-party software support, trusted by thousands of leading organisations including Fortune Global 100, Fortune 500, midmarket, public sector and government agencies, with Datacom’s extensive market presence and implementation expertise.
Lattice to Showcase Next Gen Automotive Sensing Innovations at AutoSens Europe 202614.9.2026 23:00:00 EEST | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced its exhibition plan for the upcoming AutoSens Europe 2026, taking place on Sept. 22 – 24, 2026, in Barcelona, Spain. As part of the event, Lattice will deliver a technical presentation and host a demo showcase focused on how its low power FPGA solutions are enabling next-generation automotive sensing, ADAS, and in-vehicle networking applications. Who: Lattice Semiconductor What / When (GMT+2): Sept. 22 – 24, 2026 Lattice Demo Showcase at Booth #215 from local dimming, camera monitoring system, sensor security, and more. Presentation (Sept. 23 at 2:30 p.m., Room 5) “Efficient 360° threat detection for parked vehicles – A distributed, event-driven approach” Where: La Farga de L’Hospitalet, Barcelona, Spain AutoSens Europe is the automotive industry's premier conference and exhibition for perception systems, ADAS, and autonomous vehicle technology. Bringing together over 1,000 en
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
