Business Wire

Realtek Semiconductor Selects Allegro DVT’s H.266/VVC Compliance Streams

29.10.2020 10:57:00 EET | Business Wire | Press release

Share

Allegro DVT, the leading provider of video codec compliance test suites and semiconductor video IPs, today announced that Realtek Semiconductor, one of the world's largest and most successful fabless semiconductor companies, has selected Allegro DVT’s VVC test streams and will be used to ensure compliance of Realtek’s products with the new emerging VVC video compression standard.

Versatile Video Coding (VVC) is the latest video compression standard that was finalized in June 2020. The VVC codec has been conceived to be versatile and to address all video applications such as mobile telephony, VOD, Broadcasting, OTT streaming, videoconferencing, screen content, 360° and scalable coding and their requirements in terms of resolution, bitrates and latency.

The Allegro DVT VVC test suite enables comprehensive coverage and verification of VVC decoders and ensures that decoders are fully compliant with all corner cases of the VVC specification.

Furthermore, this VVC test suite is part of a broad family of conformance test suites providing complete bitstream sets to test the compliance of video decoders for formats that include H.264/AVC, H.265/HEVC, AVS2, AVS3, VP9, AV1 and now VVC/H.266.

The latest VVC video compression format pushes the complexity of decoder implementations to higher levels, presenting new verification and validation challenges,” said Realtek’s Vice President and Spokesman, Yee-Wei Huang. “Allegro DVT’s VVC test solution provides the quality and test coverage required to meet our rigorous validation processes.”

Nathalie Brault, VP Marketing at Allegro DVT, commented “We are proud that Realtek selected our VVC test suite proving once more the quality of compliance streams solutions. As the compression efficiency of new video codecs increases, so does the implementation complexity. More than ever, the industry needs a trusted supplier of test streams to ensure 100% compliance with video compression standards.”

About Allegro DVT

Allegro DVT, headquartered in Grenoble/France with offices in Belfast/Northern Ireland and Beijing/China, is a world leading provider of digital video technology solutions including compliance streams and video codec semiconductor IPs focused on the H.264/AVC, H.265/HEVC, AVS2, AVS3, VP9, AV1 and VVC standards.

Founded in 2003, Allegro is today a recognized market leader in video compression technologies and has been chosen by more than 100 major IC providers, OEMs and broadcasters.

For more information, visit www.allegrodvt.com

To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.

Contact information

Elodie Soufi
elodie.soufi@allegrodvt.com

About Business Wire

For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.

Subscribe to releases from Business Wire

Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.

Latest releases from Business Wire

Westlake Epoxy Expands Distribution Relationship with Brenntag to India18.2.2026 03:30:00 EET | Press release

Westlake Corporation (NYSE: WLK) today announced that Westlake Epoxy will expand its long‑standing distribution relationship with Brenntag to South and West India. The agreement builds on a successful collaboration across Europe, North and South America, and Southeast Asia, extending Westlake Epoxy’s reach into one of the world’s fastest‑growing coatings, adhesives and construction markets. Under the expanded collaboration, Brenntag will distribute Westlake Epoxy’s established portfolio of epoxy solutions for coatings, adhesives and construction applications, including the EPON™, EPIKOTE™, EPIKURE™ and EPI‑REZ™ product lines. Customers are expected to benefit from reliable local supply, technical service and application‑focused formulation support tailored to regional requirements. India’s coatings, adhesives and construction sectors continue to grow, driven by infrastructure investment, urbanization and increasing performance expectations. By combining Westlake Epoxy’s proven epoxy te

Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 23:06:00 EET | Press release

Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana

Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 23:00:00 EET | Press release

Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp

Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 20:50:00 EET | Press release

Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve

ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 19:08:00 EET | Press release

ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material

In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.

Visit our pressroom
World GlobeA line styled icon from Orion Icon Library.HiddenA line styled icon from Orion Icon Library.Eye