Ricardo awarded over 18.9million USD to deliver additional ABS/ESC retrofit kits to US Army
14.7.2022 14:52:00 EEST | Business Wire | Press release
The United States Army has awarded Ricardo’s Defense business unit, located in Michigan, over 18.9million USD to deliver additional Antilock Brake System/Electronic Stability Control (ABS/ESC) retrofit kits to improve the safety of operation of the US Army’s High Mobility Multipurpose Wheeled Vehicle (HMMWV).
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20220629005571/en/
Ricardo Awarded Over 18.9 million USD to Deliver Additional ABS/ESC Retrofit Kits to US Army (Photo: Business Wire)
In addition to those retrofit kits Ricardo has previously delivered, this contract award will improve safety on fielded vehicles in the US Army’s enduring HMMWV fleet. Additionally, more than 7,000 new production or recapitalized HMMWV vehicles have been delivered to the US Army with Ricardo’s integrated ABS/ESC technology following the Army’s mandate of the Ricardo system on all new production HMMWVs. In 2019, the Army provisioned Ricardo’s ABS/ESC retrofit kit into the national stock system for application of vehicles produced prior to 2019 that are slated to remain in the Army’s enduring fleet through 2040.
Chet Gryczan, President of Ricardo Defense said: “Ricardo is committed to providing our customers with mission critical, innovative, integrated solutions that deliver capability to the soldier. This award demonstrates that Ricardo can solve tough challenges for legacy systems that require a future-looking integrated solution. Consistent with our core values of sustainable, safe, and smart mobility, the successful deployment of Ricardo’s ABS/ESC safety critical system ensures the safety of soldiers and operators remain at the forefront of every training and operational mission. We are extremely proud to support the US Army’s objective ensuring that soldier safety remains a top priority throughout each mission.”
The Ricardo developed ABS/ESC retrofit system encompasses a complete solution integrated into the HMMWV architecture including antilock braking, electronic stability control, active rollover protection, traction control, and improved brake calipers, pads, and rotors. The Ricardo system additionally introduces a crashworthy steering column and a modern electronic network to the vehicle and leverages low-cost, proven components specifically designed for the arduous requirements of military application. From the beginning, Ricardo designed the system for ease of upgrade to the existing fleet to minimize HMMWV lifecycle cost to US taxpayers.
Ends
Ricardo Defense Inc, is the business entity within Ricardo plc that works on classified safety and defence contracts for the US DoD and it therefore operates as a separate entity governed by a Special Security Agreement (SSA). Ricardo Defense Inc provides solutions to meet the challenges faced by defence customers in the integration of complex and diverse systems specialising in taking innovative technologies from science to real-world deployment.
About Ricardo
Ricardo plc is a global strategic, environmental, and engineering consulting company, listed on the London Stock Exchange. With over 100 years of engineering excellence and employing close to 3,000 employees in more than 20 countries, we provide exceptional levels of expertise in delivering leading-edge and innovative cross-sector sustainable products and solutions. Every day, we enable our customers to solve the most complex and dynamic challenges to help achieve a safe and sustainable world. Visit www.ricardo.com
Ricardo Defense Inc, is the business entity within Ricardo plc that works on classified safety and defence contracts for the US DoD and it therefore operates as a separate entity governed by a Special Security Agreement (SSA). Ricardo Defense Inc provides solutions to meet the challenges faced by defence customers in the integration of complex and diverse systems specialising in taking innovative technologies from science to real-world deployment.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20220629005571/en/
Contact information
Media contacts:
Kathryn Bellamy
Group Senior Communications Manager
Ricardo plc
Email: kathryn.bellamy@ricardo.com
Telephone: +44(0)7921 941824
Kathryn Caulfield
Communications Manager
Ricardo Defense
Email: kathryn.caulfield@ricardodefense.com
Telephone: +1 (586) 899-7668
Cell: +1(248) 602-5159
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Compass Pathways Launches Proposed $150.0 Million Public Offering17.2.2026 23:06:00 EET | Press release
Compass Pathways plc (Nasdaq: CMPS), a biotechnology company dedicated to accelerating patient access to evidence-based innovation, announced today the launch of a proposed public offering of $150.0 million of American Depositary Shares (“ADSs”), each representing one ordinary share, and in lieu of ADSs, to certain institutional investors, pre-funded warrants to purchase ADSs. All securities are being offered by Compass Pathways. Compass Pathways expects to grant the underwriters a 30-day option to purchase up to an additional $22.5 million of ADSs at the public offering price, less the underwriting discounts and commissions . The proposed offering is subject to market and other conditions, and there can be no assurance as to whether or when the proposed offering may be completed, or as to the actual size or terms of the proposed offering. Jefferies, TD Cowen, Cantor and Stifel are acting as joint book-runners for the proposed offering. H.C. Wainwright & Co. is also acting as lead mana
Lattice Launches Joint Cyber Resilience Reference Kit with EXOR International and TrustiPhi to Simplify Secure Device Development17.2.2026 23:00:00 EET | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable leader, today announced a Cyber Resilience Reference Kit designed to help industrial and edge device manufacturers accelerate secure system design, developed in collaboration with EXOR International and TrustiPhi. Built on the Lattice MachXO3D™ secure control FPGA, EXOR International’s industrial edge platform, and TrustiPhi’s integrated security orchestration platform, the kit enables hardware‑rooted trust, secure lifecycle management, and industrial‑grade connectivity to accelerate cyber resilient system design. “Security can no longer be an afterthought, especially at the industrial edge. With this collaboration, we’re giving customers a practical, integrated way to accelerate secure system development and support emerging requirements such as the EU Cyber Resilience Act,” said Karl Wachswender, Senior Principal System Architect Industrial, Lattice Semiconductor. “Through our early access program, major industrial comp
Capvidia and Hexagon to Host Live Webinar on Building a “Real” Digital Thread from Design to Inspection Using MBD, QIF, and PC-DMIS17.2.2026 20:50:00 EET | Press release
Capvidia, a global leader in Model-Based Definition (MBD) and model-based interoperability, announced it will co-host a live webinar with Hexagon focused on creating a seamless digital thread that connects design, production, and inspection using MBD, the Quality Information Framework (QIF), and Hexagon’s PC-DMIS metrology software. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217927277/en/ Connecting design to inspection—without the rework. Capvidia + Hexagon show how MBD + QIF power a real digital thread into PC-DMIS for faster, traceable, more accurate inspection. Titled “Connected for Success: Unlock seamless data flow and precision from design to inspection”, the webinar will take place on Wednesday, February 25, 2026, at 9:00 AM EST / 2:00 PM GMT. Attendees will see a practical demonstration of how an integrated approach can reduce manual data entry, minimize translation errors, preserve design intent, and improve
ProAmpac Pushes the Limits of Fiber Packaging with New High Barrier Packaging Innovation Platform17.2.2026 19:08:00 EET | Press release
ProAmpac, a global leader in flexible packaging and material science, announces the expansion of its ProActive Recyclable® RP-2000 High Barrier Series. This curbside recyclable, fiber-based packaging platform is designed to help brands transition away from traditional non-recyclable high-barrier multilayer structures, such as paper/foil, paper/metalized polyethylene terephthalate (METPET), and certain film laminations. The RP-2000 platform provides strong barriers to oxygen and moisture, making it well-suited for sensitive dry food products such as oatmeal, granola, cereal, spices, snacks, dried fruits, and nuts. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260217779741/en/ ProAmpac's RP-2000MHB Series “Supporting the growing Fiberization of Packaging® movement, and as adoption of fiber-based structures accelerates, it is critical that ProAmpac continues to expand the functional performance envelope of paper-based material
ChipAgents Raises $74M to Scale an Agentic AI Platform to Accelerate Chip Design17.2.2026 17:00:00 EET | Press release
ChipAgents, the category leader for Agentic AI platforms in the semiconductor design industry, announced it has closed an oversubscribed $50 million Series A1 funding round, bringing total capital raised to $74 million. The round was led by Matter Venture Partners, a TSMC-backed HardTech VC firm, with participation from existing investors Bessemer Venture Partners, Micron, MediaTek, and Ericsson. As part of the investment, Wen Hsieh, Founding Managing Partner of Matter VP, will join ChipAgents' Board of Directors, bringing over two decades of expertise and relationships in semiconductor design and manufacturing. Building the AI Workforce for Chip Design Companies This new capital will enable ChipAgents to aggressively scale its Agentic AI platform, expand its engineering and research organization, and accelerate global deployment of multi-agent chip teams. ChipAgents is building the foundational AI infrastructure for chip design, with coordinated AI Agents that can plan, reason, execut
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom