RoboSense Launched E1, A High-Performance Flash Solid-State LiDAR and Debuted A Smart Manufacturing System with An Annual Output of A Million Units
8.11.2022 15:28:00 EET | Business Wire | Press release
RoboSense, a world-leading provider of Smart LiDAR Sensor Systems, held a new product launch and Tech Day event. During the conference, RoboSense officially launched RS-LiDAR-E1 (E1), a flash solid-state LiDAR that sees 360° based on its in-house, custom developed chips and flash technology platform. Also debuted was the only China National Accreditation Service (CNAS) recognized on-board LiDAR lab of the industry to date, and held the unveiling ceremony of the smart manufacturing joint venture, Luxsense, jointly with Luxshare-ICT, a domestic leading electronics manufacturer.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20221108005666/en/
RoboSense Tech Day Launched E1, A High-Performance Flash Solid-State LiDAR and Debuted A Smart Manufacturing System with An Annual Output of A Million Units (Graphic: Business Wire)
RoboSense launched E1, the first automotive-grade flash solid-state LiDAR. It serves as a new product platform featuring area array transceiver technology with application-specific developed chips as the core. E1 is designed for large-scale series production with a simple bill of materials including no moving parts, and excels in all the three aspects of detection performance, cost efficiency and automotive-grade safety and reliability of LiDARs. As a key piece to realizing the core functions of autonomous driving, E1 will assist partners to further bridge the gap in smart driving perception and improve the all-scenario perception capability of automated and autonomous vehicles.
4 core features of E1
- Horizontal FOV of 120°, which ensures 360° coverage area without blind zone using minimum sensors.
- Vertical FOV is designed to be 90°, to allow the perception area to cover both blind zones on the ground and lateral vision.
- Ultra-high frame rates of over 25Hz, capturing target objects’ motion states and predicting their moves faster.
- Detection range of 30m @10%, which enables better perception planning control.
E1 uses RoboSense’s first in-house, custom chips for flash solid-state LiDAR platform and its first 2D electronic scanning technology. With highly integrated chips that incorporate the three core components of transmission, reception, and processing, E1 greatly streamlines the circuit design and production processes, creating the performance and cost advantages necessary for the durability and reliability requirements of blind spot LiDARs in the automotive market.
To ensure product performance and rapidly improve production capacity, RoboSense launched the first and only CNAS certified LiDAR lab to analyze LiDAR and their components and developed a complementary smart manufacturing system to produce this high-tech, precision sensor.
During the event, leaders of RoboSense and Luxshare jointly held the unveiling ceremony of Luxsense. Investment in the first phase of RoboSense smart manufacturing system exceeded 1 billion RMB cumulatively; the plant area exceeds 55,000 square meters including nearly 20 automated production lines built with highly intelligent production software to achieve a top-level production efficiency of “a LiDAR every 12 seconds” and guarantees capacity by connecting our Shenzhen, Dongguan and Guangzhou plants.
Additionally, RoboSense announced a new strategic financing round which attracted top industry investors. In particular, industry investors in this new financing round include car companies with self-owned brands, emerging automakers, top luxury supercar brands, leading commercial vehicle companies, supply chain pioneers and the tier 1 institutions. Greatly empowered by capital investments from the industry, RoboSense gained unprecedented momentum and sustainability.
RoboSense (Suteng Innovation Technology Co., Ltd.) is a world-leading provider of Smart LiDAR Sensor Systems. With a complete portfolio of LiDAR sensors, AI perception and IC chipsets, RoboSense transforms conventional 3D LiDAR sensors with comprehensive data analysis and interpretation systems.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20221108005666/en/
Contact information
Grace Ye
media@robosense.ai
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Kioxia and Sandisk Begin Production of 10th-Generation 3D Flash Memory Products at Kitakami Plant Fab23.7.2026 13:19:00 EEST | Press release
Kioxia Corporation, a subsidiary of Kioxia Holdings Corporation (TOKYO: 285A) and Sandisk Corporation (Nasdaq: SNDK) today announced the start of production for their 10th-generation 3D Flash memory technology at Fab2 (K2) at the Kitakami Plant in Iwate Prefecture in Japan. The milestone comes as the companies continue to drive meaningful, multi-year bit growth to address the strong demand for their innovative flash memory technology. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260702296115/en/ Unveiling ceremony for the K2 facility In conjunction with the start of production, the companies held an unveiling ceremony for the K2 facility. Opening in September 2025, the facility has produced the companies’ 8th-generation 3D flash memory products and will begin to scale production with the introduction of their 10th-generation products. Both generations of 3D flash memory adopt innovative CBA (CMOS directly Bonded to Array)
VeriSilicon Introduces CPP2000 Camera Post-Processing IP for Embodied Robotics and Mobile Vision Applications3.7.2026 13:02:00 EEST | Press release
VeriSilicon (688521.SH) today announced its high-performance CPP2000 Camera Post-Processing (CPP) IP, expanding the company’s Image Signal Processing (ISP) solutions with advanced post-processing capabilities. By improving image quality and visual perception in mobile imaging scenarios, CPP2000 enables more reliable vision performance in robotics, drones, and other mobile vision applications. CPP2000 integrates multiple image processing technologies and can further optimize YUV images output from image signal processors. The IP supports image and video processing at up to 8K resolution and offers multiple hardware configuration options to meet diverse requirements in Power, Performance, Area (PPA), and latency across different applications. CPP2000 leverages the combined operation of multiple image processing technologies, including motion-compensated temporal filtering, advanced spatial noise reduction, chroma adjustment and dynamic contrast improvement, and edge enhancement. Together
Messer Acquires Singapore-Based Industrial Gas Platform; Japan Corporate Advisory Institute Advises Sellers3.7.2026 12:11:00 EEST | Press release
Messer, the world’s largest privately held specialist for industrial, medical, electronic and specialty gases, has acquired WKS Group, a Singapore-based industrial gas platform with operations across Singapore and southern Malaysia. Transaction terms were not disclosed. Messer reported consolidated sales of approximately EUR 4.5 billion for its 2025 financial year. Founded in Singapore in 1977, WKS Group comprises six companies and employs approximately 195 people across Singapore and southern Malaysia. The acquisition expands Messer’s operating footprint in Southeast Asia and strengthens its access to key industrial clusters across the region. “We are pleased to have completed this transaction with Messer, whose strategic vision makes them an excellent partner for WKS Group,” said Mr. Wong Koh Hoi, shareholder of WKS Group. “We appreciate JCAI’s professionalism and dedication throughout the process, and their expertise was instrumental in achieving a successful outcome.” Japan Corpora
Access Advance Welcomes Meta Platforms, Inc. and Alibaba Group to the Video Distribution Patent Pool3.7.2026 02:00:00 EEST | Press release
Access Advance LLC today announced that Meta Platforms, Inc., one of the world's largest distributors of video content across its Facebook, Instagram, Threads, and WhatsApp services, has joined the Video Distribution Patent Pool (VDP Pool) as a Licensee. Meta also joined both the HEVC Advance and VVC Advance pools as a Licensee. Alibaba Group, whose video infrastructure spans a wide range of video-based services across e-commerce, entertainment, and digital media platforms, was also announced as a VDP Pool Licensee this week. Meta and Alibaba joining the VDP Pool further reinforces the program’s market leading position in resolving the licensing issues around the use of modern video codecs, including VP9, AV1, HEVC and VVC, across all the diverse business models of internet video streaming. "A significant U.S.-based company like Meta joining as a Licensee is a milestone moment for the content distribution business and the VDP Pool," said Peter Moller, CEO of Access Advance. "Meta reach
Kioxia Commences Sample Shipments of 10th-Generation BiCS FLASH™ Devices Delivering High Performance, High Capacity and Low Power Consumption3.7.2026 02:00:00 EEST | Press release
Kioxia Corporation, a world leader in memory solutions, today announced that it has commenced sample shipments of 1Tb (terabit) Triple-Level-Cell (TLC) memory devices utilizing its 10th-generation BiCS FLASH™ 3D flash memory technology.1 These will be primarily integrated into the company’s enterprise and data center SSDs, strengthening Kioxia’s lineup to meet the growing demand for AI storage, which requires higher performance, higher capacity, and lower power consumption. These new products will be manufactured using state-of-the-art equipment at Kioxia’s Kitakami Plant Fab2 facility in Iwate Prefecture, Japan. By leveraging innovative CMOS directly Bonded to Array (CBA) technology2 and On-Pitch Select Gate Drain (OPS) technology,3 both adopted since the 8th-generation BiCS FLASH™, the 10th-generation technology achieves a NAND interface speed of 4.8 Gb/s,4 a 33% improvement over the 8th generation. Bit density has increased by 59% by stacking 332 layers and improving lateral density
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
