Samsung Announces Availability of Its Leading-Edge 2.5D Integration 'H-Cube' Solution for High Performance Applications
Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20211111005553/en/
H-CubeTM Package Structure Concept (Graphic: Business Wire)
"H-Cube solution, which is jointly developed with Samsung Electro-mechanics (SEMCO) and Amkor Technology, is suited to high-performance semiconductors that need to integrate a large number of silicon dies,” said Moonsoo Kang, senior vice president and Head of Foundry Market Strategy Team at Samsung Electronics. "By expanding and enriching the foundry ecosystem, we will provide various package solutions to find a breakthrough in the challenges our customers are facing."
“In today’s environment where system integration is increasingly required and substrate supplies are constrained, Samsung Foundry and Amkor Technology have successfully co-developed H-Cube to overcome these challenges,” said JinYoung Kim, senior vice president of Global R&D Center at Amkor Technology. “This development lowers barriers to entry in the HPC/AI market and demonstrates successful collaboration and partnership between the foundry and outsourced semiconductor assembly and test (OSAT) company.”
H-Cube Structure and Features
2.5D packaging enables logic chips or high-bandwidth memory (HBM) to be placed on top of a silicon interposer in a small form factor. Samsung’s H-Cube technology features a hybrid substrate combined with a fine-pitch substrate which is capable of fine bump connection, and a High-Density Interconnection (HDI) substrate, to implement large sizes into 2.5D packaging.
With the recent increase in specifications required in the HPC, AI, and networking application market segments, large-area packaging is becoming important as the number and size of chips mounted in one package increases or high-bandwidth communication is required. For attachment and connection of silicon dies including the interposer, fine-pitch substrates is essential but prices rise significantly following an increase in size.
When integrating six or more HBMs, the difficulty in manufacturing the large-area substrate increases rapidly, resulting in decreased efficiency. Samsung solved this problem by applying a hybrid substrate structure in which HDI substrates that are easy to implement in large-area is overlapped under a high-end fine-pitch substrate.
By decreasing the pitch of solder ball, which electrically connects the chip and the substrate, by 35% compared to the conventional ball pitch, the size of fine-pitch substrate can be minimized, while adding HDI substrate (module PCB) under the fine-pitch substrate to secure connectivity with the system board.
In addition, to enhance the reliability of the H-Cube solution, Samsung applied its proprietary signal/power integrity analysis technology that can stably supply power while minimizing the signal loss or distortion when stacking multiple logic chips and HBMs.
Looking ahead, in cooperation with its ecosystem partners, Samsung will hold its 3rd Annual ‘Samsung Advanced Foundry Ecosystem (SAFETM) Forum' virtually on November 17 (PST).
For pre-registration on the SAFE forum, please visit https://www.samsungfoundry.com
# # #
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20211111005553/en/
Contact information
Ujeong Jahnke
Samsung Semiconductor Europe GmbH
Tel. +49(0)89-45578-1000
Email: sseg.comm@samsung.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
AI Takes Out the Trash: Largest U.S. Recycling Project to Extend Landfill Life for Virginia Residents21.11.2025 14:30:00 EET | Press release
The Southeastern Public Service Authority of Virginia (“SPSA”), the regional waste authority for South Hampton Roads, has signed a 20-year contract with Commonwealth Sortation LLC, an affiliate of AMP Robotics Corporation (together, “AMP”), to provide solid waste processing services for SPSA’s eight member communities and their 1.2 million residents. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251120330758/en/ Building on a nearly two-year pilot project in Portsmouth—which featured an AMP ONE™ system capable of processing up to 150 tons of locally sourced municipal solid waste (“MSW”) per day—AMP will now scale its technology region-wide. Under this long-term partnership, which will facilitate the largest recycling project in the country, AMP will deploy additional MSW sortation lines and an organics management system capable of processing 540,000 tons annually to divert half of the waste SPSA brings to AMP facilities. AM
RSA Recognized for the Second Consecutive Year in the 2025 Gartner® Magic Quadrant™ for Access Management21.11.2025 14:00:00 EET | Press release
RSA, the security-first identity leader, today announced that RSA® ID Plus has been recognized for the second year in a row in the Gartner® Magic Quadrant™ for Access Management. “The RSA Access Management strategy has never been about being everything to everyone,” said Greg Nelson, RSA CEO. “We specialize in protecting organizations where risk tolerance is at its lowest and security requirements are at their highest. Our focus is intentional: providing security-first access management that supports compliance, ensures resilience, and delivers confidence at scale.” “RSA specializes in the workforce access management use cases where security, compliance, and operational resilience are non-negotiables,” said Jim Taylor, RSA President, Chief Product and Strategy Officer. “Our product development strategy will continue to emphasize the key qualities that highly regulated industries prioritize, including user experience, strong support for workforce management, and intelligent posture mana
NIQ and Amazon Marketing Cloud (AMC) Collaborate to Measure Reach and Impact of Cross-Platform Ad Campaigns in Italy21.11.2025 10:00:00 EET | Press release
NIQ and Amazon Marketing Cloud (AMC) have announced a new collaboration to study the effectiveness of cross-platform advertising across linear TV and Amazon Ads inventory in Italy. Through the collaboration advertisers and agencies will gain actionable insights into the relative performance of ad placements across digital, linear TV and streaming environments, including how each contributes to incremental reach and influences product purchases on Amazon’s ecommerce platforms. The insights are made possible by using high-quality data from Sinottica®—a well-established single-source consumer panel in Italy owned by NIQ—with data from Amazon Marketing Cloud. Specifically, the research will leverage Sinottica’s linear TV data alongside several Amazon inventory sources, including Amazon DSP, Sponsored Ads (Products, Brands, Display), and Streaming TV (Prime Video, Twitch, Fire TV). This approach will enable a deeper understanding of how ad exposure across digital and TV channels translates
Ahead of Holiday Season, Visa Identifies Five Transformative Forces Reshaping Global Payment Security20.11.2025 20:50:00 EET | Press release
To celebrate International Fraud Awareness Week, Visa (NYSE: V) today released its Fall 2025 Biannual Threats Report, revealing five forces that are transforming the global payments security landscape. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251120412198/en/ The report, produced by Visa's Payment Ecosystem Risk and Control (PERC) team, draws on intelligence from Visa's global network to identify how criminal operations are evolving with unprecedented speed, scale, and sophistication. "The payments ecosystem is experiencing a paradigm shift in how fraud operates," said Paul Fabara, Chief Risk and Client Services Officer at Visa. "Criminals are no longer working as opportunistic individuals-- they're operating like tech startups, building reusable infrastructure and deploying systematic, industrial-scale operations that challenge conventional defenses. Understanding these evolving forces is critical for the entire ecosy
Suzano Forms Partnership with Tencent and Ecofuturo Institute at COP30 for AI-Powered Conservation and Nature Education20.11.2025 19:25:00 EET | Press release
The world’s largest pulp supplier, Suzano, today announces the signing of a Memorandum of Understanding (MoU) with the multinational technology business Tencent and the Brazilian non-profit Ecofuturo Institute, to pioneer new digital approaches to drive public engagement in conservation. The collaboration will leverage Suzano’s expertise in sustainable forestry, Tencent’s cutting-edge digital technology, and Ecofuturo’s expertise in environmental education, to pilot joint initiatives in both Brazil and China. These include enhancing ecological awareness, accelerating biodiversity solutions, and leveraging digital platforms to foster public engagement in conservation. The partnership will result in a pilot project where advanced AI tools for species recognition developed by Tencent’s Sustainable Social Value organization will be used to identify and monitor native species at Neblinas Park and other conservation areas managed by Ecofuturo. Further initiatives include the development of i
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom