Samsung Announces Availability of Its Leading-Edge 2.5D Integration 'H-Cube' Solution for High Performance Applications
Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20211111005553/en/
H-CubeTM Package Structure Concept (Graphic: Business Wire)
"H-Cube solution, which is jointly developed with Samsung Electro-mechanics (SEMCO) and Amkor Technology, is suited to high-performance semiconductors that need to integrate a large number of silicon dies,” said Moonsoo Kang, senior vice president and Head of Foundry Market Strategy Team at Samsung Electronics. "By expanding and enriching the foundry ecosystem, we will provide various package solutions to find a breakthrough in the challenges our customers are facing."
“In today’s environment where system integration is increasingly required and substrate supplies are constrained, Samsung Foundry and Amkor Technology have successfully co-developed H-Cube to overcome these challenges,” said JinYoung Kim, senior vice president of Global R&D Center at Amkor Technology. “This development lowers barriers to entry in the HPC/AI market and demonstrates successful collaboration and partnership between the foundry and outsourced semiconductor assembly and test (OSAT) company.”
H-Cube Structure and Features
2.5D packaging enables logic chips or high-bandwidth memory (HBM) to be placed on top of a silicon interposer in a small form factor. Samsung’s H-Cube technology features a hybrid substrate combined with a fine-pitch substrate which is capable of fine bump connection, and a High-Density Interconnection (HDI) substrate, to implement large sizes into 2.5D packaging.
With the recent increase in specifications required in the HPC, AI, and networking application market segments, large-area packaging is becoming important as the number and size of chips mounted in one package increases or high-bandwidth communication is required. For attachment and connection of silicon dies including the interposer, fine-pitch substrates is essential but prices rise significantly following an increase in size.
When integrating six or more HBMs, the difficulty in manufacturing the large-area substrate increases rapidly, resulting in decreased efficiency. Samsung solved this problem by applying a hybrid substrate structure in which HDI substrates that are easy to implement in large-area is overlapped under a high-end fine-pitch substrate.
By decreasing the pitch of solder ball, which electrically connects the chip and the substrate, by 35% compared to the conventional ball pitch, the size of fine-pitch substrate can be minimized, while adding HDI substrate (module PCB) under the fine-pitch substrate to secure connectivity with the system board.
In addition, to enhance the reliability of the H-Cube solution, Samsung applied its proprietary signal/power integrity analysis technology that can stably supply power while minimizing the signal loss or distortion when stacking multiple logic chips and HBMs.
Looking ahead, in cooperation with its ecosystem partners, Samsung will hold its 3rd Annual ‘Samsung Advanced Foundry Ecosystem (SAFETM) Forum' virtually on November 17 (PST).
For pre-registration on the SAFE forum, please visit https://www.samsungfoundry.com
# # #
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20211111005553/en/
Contact information
Ujeong Jahnke
Samsung Semiconductor Europe GmbH
Tel. +49(0)89-45578-1000
Email: sseg.comm@samsung.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Quectel Takes Smart Meters to the Next Generation at Enlit 202519.11.2025 11:00:00 EET | Press release
Quectel Wireless Solutions, an end-to-end global IoT solutions provider, has announced it is attending the Enlit 2025 event in Bilbao, Spain on 18-20 November 2025 and will be at Stand 1.G86. Quectel is attending to showcase how its comprehensive range of modules, antennas and services are poised to assist continued massive uptake of smart meters and assist industry moves from first to second-generation devices. With deployments of smart meters, comprised of electricity, water and gas meters, exceeding 1.06 billion at the end of 2023 and set to continue in all regions, according to IoT Analytics, Quectel is seeing growth across all meter types and expansion of meter-based use cases. Smart electricity meters are being deployed in developing markets for the first time and mature markets are accelerating deployments of second-generation smart meters to help users optimize consumption and manage their own power generation via two-way metering communications. Growth is being experienced acr
Duco introduces agentic workspace; a new collaboration layer for intelligent operations19.11.2025 11:00:00 EET | Press release
Duco, the trusted control layer in an agentic world, today announced the launch of agentic workspace, a new capability within the Duco Platform designed to help operations teams work alongside intelligent agents with transparency, control and confidence. Agentic workspace is a collaboration environment where users can build, maintain, optimise, manage tasks and exceptions. All within a single, auditable workspace. It brings humans and autonomous agents together in a shared operational context, ensuring interoperability between systems while maintaining full oversight and explainability. “Agentic workspace is the next step in our mission to put people in control of automated operations,” said James Maxfield, Chief Product Officer at Duco. “As firms embrace agentic AI, they need tools that allow them to monitor, adjust and collaborate with these systems in real time. This workspace gives them that control, without slowing innovation.” By combining data automation, exception management an
Pacsun Successfully Implements Manhattan Active ® Point of Sale, Unifying Commerce and Cutting Checkout Times19.11.2025 10:00:00 EET | Press release
Manhattan Associates Inc. (NASDAQ: MANH) today announced that Pacsun, a leading youth fashion retailer, has successfully deployed Manhattan Active® Point of Sale (POS), a cloud-native in-store sales and service solution that empowers associates to merge digital convenience with personalised retailing. Following a five-month project start to pilot phase, Pacsun rolled out Manhattan's POS solution across 300 plus stores in just eight weeks. Mobile checkout capabilities eased long in-store lines, while unified inventory management, powered by RFID integration, supported seamless fulfilment across Instagram, Amazon, TikTok and Pacsun’s own channels. During peak holiday season, Pacsun achieved record breaking revenue and streamlined operations, with 40% of online orders being fulfilled via stores, optimising inventory proximity, labour capacity and shipping costs that reduced logistics expenses by 25%. Stores are now critical drivers of retail differentiation, with industry research showing
Aqara's Next-Generation Radiator Thermostat Delivers Smarter, Greener Heating to European Homes19.11.2025 10:00:00 EET | Press release
Aqara, a global leader and pioneer in IoT, today announces the availability of its Radiator Thermostat W600, first unveiled at IFA 2025. Boasting smart features like convenient temperature control, automated climate regulation, and seamless interoperability across Matter ecosystems via Thread/Zigbee protocol, the W600 transforms traditional radiators into intelligent, energy-efficient heating systems that not only enhance comfort but also help reduce energy bills. Designed for sustainable living, the Radiator Thermostat W600 delivers energy savings by minimizing heating in unoccupied areas. Instead of heating the whole home, users can schedule temperature adjustments for individual rooms, with up to 7 time periods per day, aligning with daily routines. Furthermore, these thermostatic radiator valves (TRV) can regulate indoor temperature based on environmental and behavioral triggers like room occupancy and geofencing, allowing for a heating system that adapts to real-time usage and occ
Frontgrade Gaisler and DELTATEC Enable Advanced Space Computing Across Multiple Missions19.11.2025 10:00:00 EET | Press release
Frontgrade™ Gaisler Technologies a leading provider of high-reliability electronic solutions for space and national security missions, and DELTATEC,a very high-level design house specialized in advanced technologies are pleased to celebrate their successful collaboration in delivering high-performance computing solutions for space applications, with the GR712RC dual-core microprocessor at the heart of several flight-proven systems. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20251119011567/en/ The GR712RC, developed by Frontgrade Gaisler and based on the fault-tolerant LEON3FT architecture, has been integrated into multiple Data Handling System (DHS) units designed by DELTATEC. These include one Payload Data Handling Unit (PDHU) and two On-Board Computers (OBCs) currently operating aboard ESA’s eSAIL mission, launched into Low Earth Orbit (LEO) in September 2020. Moreover, DELTATEC recently delivered the Flight Model of the
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom