Samsung Announces Availability of Its Leading-Edge 2.5D Integration 'H-Cube' Solution for High Performance Applications
11.11.2021 12:00:00 EET | Business Wire | Press release
Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20211111005553/en/
H-CubeTM Package Structure Concept (Graphic: Business Wire)
"H-Cube solution, which is jointly developed with Samsung Electro-mechanics (SEMCO) and Amkor Technology, is suited to high-performance semiconductors that need to integrate a large number of silicon dies,” said Moonsoo Kang, senior vice president and Head of Foundry Market Strategy Team at Samsung Electronics. "By expanding and enriching the foundry ecosystem, we will provide various package solutions to find a breakthrough in the challenges our customers are facing."
“In today’s environment where system integration is increasingly required and substrate supplies are constrained, Samsung Foundry and Amkor Technology have successfully co-developed H-Cube to overcome these challenges,” said JinYoung Kim, senior vice president of Global R&D Center at Amkor Technology. “This development lowers barriers to entry in the HPC/AI market and demonstrates successful collaboration and partnership between the foundry and outsourced semiconductor assembly and test (OSAT) company.”
H-Cube Structure and Features
2.5D packaging enables logic chips or high-bandwidth memory (HBM) to be placed on top of a silicon interposer in a small form factor. Samsung’s H-Cube technology features a hybrid substrate combined with a fine-pitch substrate which is capable of fine bump connection, and a High-Density Interconnection (HDI) substrate, to implement large sizes into 2.5D packaging.
With the recent increase in specifications required in the HPC, AI, and networking application market segments, large-area packaging is becoming important as the number and size of chips mounted in one package increases or high-bandwidth communication is required. For attachment and connection of silicon dies including the interposer, fine-pitch substrates is essential but prices rise significantly following an increase in size.
When integrating six or more HBMs, the difficulty in manufacturing the large-area substrate increases rapidly, resulting in decreased efficiency. Samsung solved this problem by applying a hybrid substrate structure in which HDI substrates that are easy to implement in large-area is overlapped under a high-end fine-pitch substrate.
By decreasing the pitch of solder ball, which electrically connects the chip and the substrate, by 35% compared to the conventional ball pitch, the size of fine-pitch substrate can be minimized, while adding HDI substrate (module PCB) under the fine-pitch substrate to secure connectivity with the system board.
In addition, to enhance the reliability of the H-Cube solution, Samsung applied its proprietary signal/power integrity analysis technology that can stably supply power while minimizing the signal loss or distortion when stacking multiple logic chips and HBMs.
Looking ahead, in cooperation with its ecosystem partners, Samsung will hold its 3rd Annual ‘Samsung Advanced Foundry Ecosystem (SAFETM) Forum' virtually on November 17 (PST).
For pre-registration on the SAFE forum, please visit https://www.samsungfoundry.com
# # #
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20211111005553/en/
Contact information
Ujeong Jahnke
Samsung Semiconductor Europe GmbH
Tel. +49(0)89-45578-1000
Email: sseg.comm@samsung.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Traxys Group Completes Acquisition of Carbomax AB Through the Purchase of 100% of Comax22.4.2026 13:01:00 EEST | Press release
Traxys S.à.r.l., a global trader and merchant in the metals and natural resources sectors, is pleased to announce that the previously announced acquisition of Comax2 AB - the holding company of Carbomax AB - from Investment Aktiebolaget Spiltan and the other shareholders of Comax2 AB has successfully closed. Traxys Group has now acquired 100% of the interests in Comax2 AB, making Carbomax AB a wholly owned subsidiary of Traxys Group. All required Swedish regulatory clearances including foreign direct investment and antitrust approvals have been obtained allowing the parties to finalize the transaction. Carbomax AB is a leading Swedish trading house and industrial operator specializing in ferroalloys, carbon products and briquettes. Through this acquisition, Traxys strengthens its presence in the Scandinavian market and reinforces its commitment to advancing sustainable steel production in the region. The combination of Traxys and Carbomax creates significant commercial, operational and
Reply Signs Strategic Collaboration Agreement with AWS to Accelerate AI-Driven Cloud Transformation2.4.2026 11:00:00 EEST | Press release
Reply [EXM, STAR: REY] announced today that it has signed a strategic collaboration agreement (SCA) with Amazon Web Services (AWS) to accelerate the adoption of cloud and artificial intelligence solutions across key international markets. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260402597802/en/ This strategic collaboration agreement further reinforces Reply’s commitment to enable organizations across industries to harness the full potential of cloud and artificial intelligence technologies. At the core of the SCA is a strong focus on Artificial Intelligence and Generative AI. Leveraging the deep expertise of its specialized companies - Comsysto Reply, Data Reply, Sense Reply, and Storm Reply - Reply supports organizations in designing and deploying enterprise-grade GenAI solutions, including agentic AI systems for autonomous workflows, domain-specialized models for vertical industries, and governance frameworks aligne
Bending Spoons renews tech scholarship for women with €100,000 commitment2.4.2026 10:11:00 EEST | Press release
Bending Spoons today opened applications for the 2026 edition of its Women in Computer Science Scholarship. The program offers twenty scholarships, each worth €5,000, to university students pursuing technology degrees across Europe and the United Kingdom. This year’s recipients will also be invited to a two-day networking event in Milan in October, fully covered by the company. The initiative is part of a broader set of programs Bending Spoons runs to recognize and support the next generation of technology talent, including merit-based scholarships, networking events, and student competitions. "The students of computer science today will define what the field looks like in the years ahead," said Eva Milenkovska, talent manager at Bending Spoons and lead of the scholarship initiative. "This scholarship is about recognizing the women who are pushing themselves to excel and to help shape the future of the industry." This is the fourth time Bending Spoons has offered this specific scholars
SecurityTech on the Rise: G+D Reports Strong Order Intake and High Resilience in 20252.4.2026 09:30:00 EEST | Press release
In fiscal year 2025, Giesecke+Devrient (G+D) reaffirmed its position as global leader in SecurityTech for mission-critical infrastructure. In a market where security is becoming essential for technological and societal stability, G+D demonstrates strong growth prospects. In 2025, G+D achieved a record order intake of €3.6 billion (+8%). Revenue increased to €3.2 billion (+1%), although exchange rate effects dampened growth. The key figures underscore the company's strong operational performance and profitability: Adjusted EBIT reached a new high of €211 million. The substantial free cash flow of €119 million provides additional leeway for future investments. With its equally strong segments – Digital Security, Financial Platforms and Currency Technology – G+D boasts a resilient portfolio that effectively cushions market volatility. The company's success reflects this strategic strength, combining technological depth, a global presence and operational reliability. G+D is making targeted
Bona Releases 2025 Sustainability Report2.4.2026 09:05:00 EEST | Press release
Bona®, a global, family-owned company that supplies products for installing, renovating, maintaining, and restoring premium floors, has published its 2025 Sustainability Report. The report outlines progress across Bona’s three sustainability pillars – Respect our Planet, Care for People, and Trusted Business – and highlights the continued integration of sustainability into all aspects of its operations. “Our business is built on extending the life of existing flooring materials and reducing the need for replacement,” says Lidija Broström, Interim Chief Executive Officer at Bona. “At Bona, we are making steady progress in reducing our impact while building a stronger foundation for the future. By working closely with our partners, we aim to drive meaningful change across our value chain and contribute to a more sustainable future.” In 2025, Bona reduced total Scope 1 and 2 greenhouse gas emissions (market-based) by 46% compared to its 2022 baseline, reaching 1,338 tonnes of CO₂—surpassi
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom