Samsung Announces Availability of Its Leading-Edge 2.5D Integration 'H-Cube' Solution for High Performance Applications
11.11.2021 12:00:00 EET | Business Wire | Press release
Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest 2.5D packaging solution specialized for semiconductors for HPC, AI, data center, and network products that require high-performance and large-area packaging technology.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20211111005553/en/
H-CubeTM Package Structure Concept (Graphic: Business Wire)
"H-Cube solution, which is jointly developed with Samsung Electro-mechanics (SEMCO) and Amkor Technology, is suited to high-performance semiconductors that need to integrate a large number of silicon dies,” said Moonsoo Kang, senior vice president and Head of Foundry Market Strategy Team at Samsung Electronics. "By expanding and enriching the foundry ecosystem, we will provide various package solutions to find a breakthrough in the challenges our customers are facing."
“In today’s environment where system integration is increasingly required and substrate supplies are constrained, Samsung Foundry and Amkor Technology have successfully co-developed H-Cube to overcome these challenges,” said JinYoung Kim, senior vice president of Global R&D Center at Amkor Technology. “This development lowers barriers to entry in the HPC/AI market and demonstrates successful collaboration and partnership between the foundry and outsourced semiconductor assembly and test (OSAT) company.”
H-Cube Structure and Features
2.5D packaging enables logic chips or high-bandwidth memory (HBM) to be placed on top of a silicon interposer in a small form factor. Samsung’s H-Cube technology features a hybrid substrate combined with a fine-pitch substrate which is capable of fine bump connection, and a High-Density Interconnection (HDI) substrate, to implement large sizes into 2.5D packaging.
With the recent increase in specifications required in the HPC, AI, and networking application market segments, large-area packaging is becoming important as the number and size of chips mounted in one package increases or high-bandwidth communication is required. For attachment and connection of silicon dies including the interposer, fine-pitch substrates is essential but prices rise significantly following an increase in size.
When integrating six or more HBMs, the difficulty in manufacturing the large-area substrate increases rapidly, resulting in decreased efficiency. Samsung solved this problem by applying a hybrid substrate structure in which HDI substrates that are easy to implement in large-area is overlapped under a high-end fine-pitch substrate.
By decreasing the pitch of solder ball, which electrically connects the chip and the substrate, by 35% compared to the conventional ball pitch, the size of fine-pitch substrate can be minimized, while adding HDI substrate (module PCB) under the fine-pitch substrate to secure connectivity with the system board.
In addition, to enhance the reliability of the H-Cube solution, Samsung applied its proprietary signal/power integrity analysis technology that can stably supply power while minimizing the signal loss or distortion when stacking multiple logic chips and HBMs.
Looking ahead, in cooperation with its ecosystem partners, Samsung will hold its 3rd Annual ‘Samsung Advanced Foundry Ecosystem (SAFETM) Forum' virtually on November 17 (PST).
For pre-registration on the SAFE forum, please visit https://www.samsungfoundry.com
# # #
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20211111005553/en/
Contact information
Ujeong Jahnke
Samsung Semiconductor Europe GmbH
Tel. +49(0)89-45578-1000
Email: sseg.comm@samsung.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Airgain Expands Public Safety and Utility Connectivity Portfolio with FirstNet, Built with AT&T3.6.2026 00:56:00 EEST | Press release
Airgain, Inc. (NASDAQ: AIRG), a leading provider of advanced wireless connectivity solutions, today announced the continued expansion of its mission-critical connectivity portfolio with FirstNet®, Built with AT&T – America’s public safety network – to support reliable, high-performance communications for public safety agencies, utilities and field operations across the United States. Growing its public safety connectivity capabilities, Airgain recently added the MegaFi 2™ and MegaGo 2™ to its portfolio. As FirstNet MegaRange™ solutions, which use High Power User Equipment (HPUE) technology, the two routers transmit with 6x the power exclusively on Band 14, nationwide, high-quality spectrum set aside by the government for public safety on FirstNet. This helps support reliable communications in remote areas and through signal-blocking materials like glass, concrete and metal. The addition of MegaFi 2™ and MegaGo 2™ strengthens Airgain’s growing AirgainConnect® portfolio, which also inclu
Fi Expands International Footprint to 38 Countries Worldwide2.6.2026 20:25:00 EEST | Press release
Fi, the leader in smart pet technology, today announced a major international expansion, bringing its AI-powered GPS pet wearables and connectivity network to 38 countries across North America and Europe. Fi devices are now available for purchase in 29 markets, including newly added countries such as Finland, Sweden, Denmark, Austria, Belgium, the Netherlands, Romania, Slovakia, and Latvia. Through Fi's international connectivity network, customers can also use Fi in Switzerland, Norway, Liechtenstein, Iceland, and Turkey, bringing Fi's total coverage footprint to 38 countries. The expansion reflects growing demand from pet owners who want reliable connectivity and health insights, whether they're at home or traveling abroad. "Wherever your pet roams, Fi should work," said Jonathan Bensamoun, Founder and CEO of Fi. "As more pet owners travel internationally and expect seamless connectivity, we're expanding Fi's footprint to help them stay connected to their pets across more of Europe a
XFolio AI Acquires Absolute Payment Solutions to Unify Treasury and Payments for UK Corporates2.6.2026 20:16:00 EEST | Press release
XFolio AI (xfolio.ai), a Paris-based treasury and cash management technology group, has acquired Absolute Payment Solutions (APS) (https://www.absolutepayments.com/), one of a select number of Pay.UK-accredited Bacs service providers in the UK. This acquisition creates an integrated platform spanning Bacs and all payment types, open banking, risk management, and treasury—giving UK corporates of all sizes the tools to manage cash and execute payments in one place. APS’s Bacs accreditation underpins payment services relied upon daily by organisations across both the public and private sectors, from SMEs running payroll and direct debit collections to large corporates processing high-volume payment flows. While enterprise payment platforms often demand significant scale and budget, and lighter solutions trade capability for speed of setup, APS and XFolio together deliver accredited Bacs infrastructure combined with advanced treasury intelligence across SWIFT, API, H2H, and EBICS rails—wit
Amazfit Introduces a New Era of Hybrid Training with Balance 3 and Balance Ultra2.6.2026 20:00:00 EEST | Press release
Amazfit, a leading global smart wearable brand owned by Zepp Health, today unveiled the Amazfit Balance 3 and Amazfit Balance Ultra, the newest additions to the Balance series and the hero watches for Amazfit’s new Hybrid Training System, connecting performance tracking with intelligent training guidance through the Zepp App. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260602329170/en/ Built around how modern athletes train today, Balance 3 and Balance Ultra are designed for people balancing strength, endurance, recovery, work, stress, and daily life. The devices serve as the engine layer of the connected Hybrid Training ecosystem, capturing how users train, recover, and respond over time. The products were unveiled at a launch event in New York during a panel hosted by leading voices from the fitness and HYROX community. Built around how modern athletes train today, Balance 3 and Balance Ultra are designed for people bal
Mouser's Rise of the Robots Program Explores Humanoid Design Considerations2.6.2026 18:19:00 EEST | Press release
Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, today announced the latest installment of its Empowering Innovation Together (EIT) technology series, Rise of the Robots, which explores key technologies behind humanoid robots and their potential for transformation. The series shares how these robots have progressed from simple machinery to critical tools used in caregiving, industrial automation, education, and even in the harshest environments. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260602293561/en/ The latest EIT installment explores the engineering design process, system integration challenges, and the role of legacy infrastructure, safety, and ROI in shaping scalable humanoid robot deployment. While science fiction has long envisioned robots resembling humans, recent advances in sensing, actuation, AI, embedded computing, and pow
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom