Samsung Announces Industry's First EUV DRAM with Shipment of First Million Modules
25.3.2020 13:00:00 EET | Business Wire | Press release
Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has successfully shipped one million of the industry's first 10nm-class (D1x) DDR4 (Double Date Rate 4) DRAM modules based on extreme ultraviolet (EUV) technology. The new EUV-based DRAM modules have completed global customer evaluations, and will open the door to more cutting-edge EUV process nodes for use in premium PC, mobile, enterprise server and datacenter applications.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20200325005238/en/
Samsung Electronics Hwaseong Campus (Photo: Business Wire)
"With the production of our new EUV-based DRAM, we are demonstrating our full commitment toward providing revolutionary DRAM solutions in support of our global IT customers,” said Jung-bae Lee, executive vice president of DRAM Product & Technology at Samsung Electronics. "This major advancement underscores how we will continue contributing to global IT innovation through timely development of leading-edge process technologies and next-generation memory products for the premium memory market."
Samsung is the first to adopt EUV in DRAM production to overcome challenges in DRAM scaling. EUV technology reduces repetitive steps in multi-patterning and improves patterning accuracy, enabling enhanced performance and greater yields as well as shortened development time.
EUV will be fully deployed in Samsung's future generations of DRAM, starting with its fourth-generation 10nm-class (D1a) or the highly-advanced 14nm-class, DRAM. Samsung expects to begin volume production of D1a-based DDR5 and LPDDR5 next year, which would double manufacturing productivity of the 12-inch D1x wafers.
In line with the expansion of the DDR5/LPDDR5 market next year, the company will further strengthen its collaboration with leading IT customers and semiconductor vendors on optimizing standard specifications, as it accelerates the transition to DDR5/LPDDR5 throughout the memory market.
To better address the growing demand for next-generation premium DRAM, Samsung will start the operation of a second semiconductor fabrication line in Pyeongtaek, South Korea, within the second half of this year.
Timeline of Samsung DRAM Milestones
|
Date |
Samsung DRAM Milestones |
|
2021 (TBD) |
4th-gen 10nm-class (1a) EUV-based 16Gb DDR5/LPDDR5 mass production |
|
March 2020 |
4th-gen 10nm-class (1a) EUV-based DRAM development |
|
September 2019 |
3rd-gen 10nm-class (1z) 8Gb DDR4 mass production |
|
June 2019 |
2nd-gen 10nm-class (1y) 12Gb LPDDR5 mass production |
|
March 2019 |
3rd-gen 10nm-class (1z) 8Gb DDR4 development |
|
November 2017 |
2nd-gen 10nm-class (1y) 8Gb DDR4 mass production |
|
September 2016 |
1st-gen 10nm-class (1x) 16Gb LPDDR4/4X mass production |
|
February 2016 |
1st-gen 10nm-class (1x) 8Gb DDR4 mass production |
|
October 2015 |
20nm (2z) 12Gb LPDDR4 mass production |
|
December 2014 |
20nm (2z) 8Gb GDDR5 mass production |
|
December 2014 |
20nm (2z) 8Gb LPDDR4 mass production |
|
October 2014 |
20nm (2z) 8Gb DDR4 mass production |
|
February 2014 |
20nm (2z) 4Gb DDR3 mass production |
|
February 2014 |
20nm-class (2y) 8Gb LPDDR4 mass production |
|
November 2013 |
20nm-class (2y) 6Gb LPDDR3 mass production |
|
November 2012 |
20nm-class (2y) 4Gb DDR3 mass production |
|
September 2011 |
20nm-class (2x) 2Gb DDR3 mass production |
|
July 2010 |
30nm-class 2Gb DDR3 mass production |
|
February 2010 |
40nm-class 4Gb DDR3 mass production |
|
July 2009 |
40nm-class 2Gb DDR3 mass production |
###
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com.
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20200325005238/en/
Contact information
Ujeong Jahnke
Samsung Semiconductor Europe GmbH
Tel. +49(0)6196-66-3300
Email: ujeong.j@samsung.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Quectel Unveils Versatile Pi Series SBCs to Power Developer Innovation10.3.2026 10:00:00 EET | Press release
Quectel Wireless Solutions, a global end-to-end IoT solutions provider, today announces the launch of its range of Quectel Pi series of single-board computers (SBCs), designed for a broad range of industrial use cases. The portfolio currently includes three compact development platforms - the Quectel Pi M1, L1, and H1 boards - engineered for low power consumption, cost efficiency, and full-stack software support. Designed to accelerate prototyping and product development, they are well suited for embedded applications, IoT solutions, robotics projects, and edge computing deployments. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260310949640/en/ Quectel unveils versatile Pi series SBCs to power developer innovation “We’re delighted to launch the affordable, versatile, open source Quectel Pi series of SBCs to help developers of real IoT projects in areas such as home automation, robotics, sensors and edge computing to achiev
Expereo Appoints Kevin Brown as Chief Operating Officer to Drive Operational Excellence and Customer-Focused Growth10.3.2026 10:00:00 EET | Press release
Expereo, the world-leading Managed Network as a Service (NaaS) provider, today announces the appointment of Kevin Brown as Chief Operating Officer (COO), reinforcing the company’s focus on operational integration, efficiency, and scaling its customer and supplier-facing functions globally. Brown will assume overall accountability for operational strategy, transformation delivery, and performance across all customer and supplier-facing functions, while working in close partnership with the Digital Office, to deliver on our digital transformation. He brings extensive global operational leadership experience across Telco, Cybersecurity, and SaaS, most recently serving as Global COO of NCC Group, where he built and scaled operating models to drive customer experience, efficiency, and growth. Earlier in his career, Brown led the cybersecurity business at BT, establishing a strong track record of transforming operations into engines of value creation at scale. Kevin Brown, Chief Operating Of
Cooler Master Earns Four iF Design Awards 2026 for PC Design Innovation10.3.2026 09:07:00 EET | Press release
Cooler Master, a global leader in PC components and tech lifestyle solutions, today announced that four of its products have received the iF DESIGN AWARD 2026, one of the world’s most respected design honors presented annually by iF Design in Hamburg, Germany. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260310659475/en/ Cooler Master's winning iF designs: MasterFan A120, MasterFrame 360 Panorama, COSMOS Alpha and Custom GPU Fan Cooling Kit. The award recognizes outstanding achievement in product design, innovation, and user experience. For Cooler Master, the recognition highlights a design philosophy that combines engineering performance with builder-focused creativity. The award-winning products include the COSMOS Alpha, MasterFrame 360 Panorama, Custom GPU Fan Cooling Kit, and MasterFan A120, each representing a different dimension of Cooler Master’s design approach, from modular chassis architecture to advanced thermal
GigaDevice Expands GD25UF Series Density Empowering AI Computing with 1.2V Ultra-Low Power Storage10.3.2026 09:00:00 EET | Press release
GigaDevice (HKEX: 3986), a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, today announced the expanded density range of its GD25UF series 1.2V ultra-low power SPI NOR Flash, now spanning from 8Mb to 256Mb. This expansion precisely addresses diverse storage needs across wide range of applications from the advanced high performance AI computing space to the low power battery operated devices. From its intrinsic low-voltage and ultra-low power performance, portable devices like wearables, hearables, AI ASIC platforms, medical devices, and other fast-growing emerging markets can have longer battery life while driving device miniaturization from edge AI to ultra-compact form factors. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20260310862079/en/ GD25UF SPI NOR Flash Expanded Density Powering the Low-Voltage SoC Era with a Smarter System Architecture As se
GigaDevice Introduces GD32M531 MCU, Empowering Technological Innovation in Motor Control10.3.2026 09:00:00 EET | Press release
GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products today officially announced the launch of the GD32M531 series 32-bit microcontrollers (MCUs) specifically tailored for motor control applications. Powered by the Arm® Cortex®-M33 core, the series integrates dedicated hardware accelerators for motor control and highly integrated peripheral resources. With exceptional computing performance, precise control capability, and industrial-grade high reliability, it achieves accurate control of dual motors + PFC, providing a high-efficiency and cost-effective solution for various home appliance application scenarios such as air conditioner outdoor units, air source heat pumps, washing machines/dryers, dishwashers, and multi-burner induction cookers. Samples and development boards of the GD32M531 series MCU are now available, and mass production and supply will officially start in April. This press release feature
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom
