Samsung Electronics Achieves Life Cycle Assessment Verification on Product Carbon Footprint for Semiconductors
30.1.2023 12:37:00 EET | Business Wire | Press release
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has established a Life Cycle Assessment (LCA) on the product carbon footprint of its semiconductor business and achieved verification from DNV, one of the world's leading independent certification bodies.
This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20230130005256/en/
Samsung Electronics Achieves Life Cycle Assessment Verification on Product Carbon Footprint for Semiconductors (Photo: Business Wire)
LCA is a methodology for assessing environmental impacts throughout the lifecycle of commercial products, processes, or services, by quantifying the amount of energy, materials and waste discharge. In detail, on its semiconductors’ carbon footprint, Samsung's LCA covers raw material extraction to chip manufacturing, assembling, and testing. Its results are in accordance with ISO 14040, ISO 14044 and ISO 14067 to ensure credibility and transparency.
The carbon footprint is commonly used by Samsung and its customers to recognize the environmental impact across all phases of Samsung's semiconductor products, and can be used as a metric to track and reduce carbon emissions.
"Since 2019, we have been actively mobilizing efforts to measure and reduce the carbon emissions of our key memory and logic solutions," said Dooguen Song, Executive Vice President of the Environment, Health and Safety (EHS) Center at Samsung Electronics. "By leveraging LCA, we will be able to support our customers to achieve their carbon neutrality, as well as becoming more transparent on the environmental impact of the semiconductors we produce worldwide."
"As a global expert in energy and environmental certification, DNV is pleased to have partnered with and to congratulate Samsung on successfully establishing its reliable LCA." said JangSup Lee, CEO of DNV Business Assurance Korea. "Together with global business leaders like Samsung, we will continue to take part in creating a more sustainable environment in the future."
Since 2019, 37 of Samsung's semiconductor products received carbon footprint accreditation from the Carbon Trust and UL, 6 of its memory products certified for carbon reduction from Carbon Trust. Samsung's eco-conscious product portfolio includes DRAM, SSD, embedded storage, mobile SoC, mobile Image Sensor, automotive LED packages.
Leveraging its LCA established at the end of last year, Samsung will quantify the carbon footprints of chips manufactured across all of its global manufacturing, testing and assembly locations in Korea, China, and the U.S.
With sustainability at its core, Samsung will expand its LCA to include water and resource footprints to provide a more comprehensive assessment that will ultimately reduce the environmental impact of various applications such as mobile and wearables, data centers, consumer electronics, automotive, communications and more.
About Samsung Electronics Co., Ltd.
Samsung inspires the world and shapes the future with transformative ideas and technologies. The company is redefining the worlds of TVs, smartphones, wearable devices, tablets, digital appliances, network systems, and memory, system LSI, foundry and LED solutions. For the latest news, please visit the Samsung Newsroom at http://news.samsung.com.
# # #
To view this piece of content from cts.businesswire.com, please give your consent at the top of this page.
View source version on businesswire.com: https://www.businesswire.com/news/home/20230130005256/en/
Contact information
Ujeong Jahnke
Samsung Semiconductor Europe GmbH
Tel. +49(0)89-45578-1000
Email: sseg.comm@samsung.com
About Business Wire
For more than 50 years, Business Wire has been the global leader in press release distribution and regulatory disclosure.
Subscribe to releases from Business Wire
Subscribe to all the latest releases from Business Wire by registering your e-mail address below. You can unsubscribe at any time.
Latest releases from Business Wire
Lattice Delivers Industry-First PQC-Enabled Platform Firmware Resilience for AI Infrastructure with Lattice Sentry Solution Stack12.10.2026 23:00:00 EEST | Press release
Lattice Semiconductor (NASDAQ: LSCC), the low power programmable and platform firmware leader, today announced the latest version of its Lattice Sentry™ solution stack (v5.0), the industry’s first post-quantum cryptography (PQC)-enabled Platform Firmware Resilience (PFR) and attestation solution. Extending Lattice's post-quantum cryptography leadership from silicon to a complete platform security stack, Lattice Sentry now delivers CNSA 2.0-aligned, NIST-compliant protection across AI data centers, and critical infrastructure, giving system designers a validated, production-ready path to quantum-resistant security. Lattice Sentry extends the company’s PQC leadership, combining the industry's first CNSA 2.0-compliant FPGA portfolio with AMI's platform management software to deliver a complete, integrated platform security solution. “AI infrastructure and the threat landscape are evolving rapidly. Platform firmware has become a primary attack vector, and the quantum era will upend decades
Cooler Master Expands End-to-End Cooling Solutions for AI Infrastructure12.10.2026 20:00:00 EEST | Press release
Cooler Master, a global leader in digital infrastructure cooling solutions, has outlined its end-to-end cooling portfolio for AI infrastructure, designed to support high-density computing deployments in new data centers and existing facilities expanding AI capacity. Anchored by a 2,500 kW Liquid-to-Liquid In-Row Coolant Distribution Unit (CDU), the portfolio spans facility-level heat transfer, rack and server cooling, and the equipment used to prepare liquid cooling systems for operation. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012102572/en/ “Customers need choices that bring fast time-to-market, flexibility, and scalability for the deployment of their facilities,” said Thomas Chen, CEO at Cooler Master Corporation. “We aim to help them put liquid cooling to work, whether that means retrofitting an existing data center or building a new site. That requires comprehensive plans about how the equipment being assembled
GigaDevice Deepens Ecosystem Collaboration with LVGL to Advance GD32’s Global Open-Source GUI Ecosystem12.10.2026 16:00:00 EEST | Press release
GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, is deepening its ecosystem collaboration with LVGL. LVGL's Open graphics library is one of the world’s most widely‑adopted open‑source embedded frameworks. Eight GD32 MCU product families have now been officially included in the LVGL ecosystem, providing developers worldwide with more convenient and efficient support for embedded graphics development. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012320702/en/ Eight GD32 product series supported on LVGL website LVGL is an open-source graphical user interface framework designed for embedded devices, commercially supported by LVGL Ltd., a technology company based in Cambridge, UK. Lightweight, efficient, and cross-platform, it can be widely used in applications such as smart home devices, industrial control systems, consumer electronics, a
W. L. Gore & Associates Launches GORE® Battery Vents – MultiVent Series at the Battery Show12.10.2026 15:00:00 EEST | Press release
Today, W. L. Gore & Associates (Gore) introduced GORE® Battery Vents – MultiVent Series at The Battery Show North America 2026, a new integrated venting architecture that combines all three functions into a single device. Designed for lithium-ion battery packs in electric vehicles and energy storage systems, GORE® MultiVent is an integrated battery vent: one device that equalizes pressure, protects against moisture and evacuates gas during thermal runaway, then reseals. It gives pack designers an alternative to combining dual-stage vents, separate evacuation valves and desiccants. This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20261012625188/en/ GORE® MultiVent GORE MultiVent builds on technology Gore acquired from Vernay Laboratories in 2026 and combines Gore membrane expertise with Vernay’s advanced valve technology. Battery pack designers have traditionally relied on multiple components to manage pressure equalization, mois
Echodyne and ACS Sign Strategic Collaboration Agreement to Advance Counter-UAS Capabilities Worldwide12.10.2026 15:00:00 EEST | Press release
Echodyne, the radar platform company, and ACS, a precision robotics company for defense, today announced the signing of a Strategic Collaboration Agreement to accelerate the development, demonstration, and deployment of integrated counter-unmanned aircraft system (C-UAS) solutions. The agreement establishes collaboration across Echodyne’s high-performance commercial counter-UAS radar hardware and software roadmaps and ACS’s Bullfrog robotic weapon station capabilities, and follows the recent announcement of each company’s award from Joint Interagency Task Force 401 for Domestic Shield, the JIATF-401 C-UAS Marketplace, and other critical counter-drone requirements. Bullfrog combines computer vision, autonomous control, and precision robotics with existing weapon systems to detect, track, identify, and engage unmanned threats. Integrating Echodyne’s precise radar track data extends this capability with persistent airspace positional information, providing earlier awareness and high-confi
In our pressroom you can read all our latest releases, find our press contacts, images, documents and other relevant information about us.
Visit our pressroom